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    • 5. 发明申请
    • Atom probe apparatus and method for working sample preliminarily for the same
    • 原子探针装置及其工作原理方法
    • US20070176099A1
    • 2007-08-02
    • US10592844
    • 2005-03-02
    • Takashi Kaito
    • Takashi Kaito
    • G01N23/00
    • G01N1/32B82Y35/00H01J2237/3109
    • Problems to be solved by the present invention are to present a technique for preliminarily working a sample, which makes a place, that is desired to be analyzed, of a device into an acicular protrusion by locally cutting out the place, and to provide, even if the sample is a sample of a multilayer structure containing element layers whose evaporation electric fields are small in later-mentioned circumstances, a technique for making a stable ion evaporation in order possible, thereby making an SAP analysis at an atomic level possible. A preliminarily working of a sample for an atom probe apparatus of the invention comprises a step of cutting out a sample's desired observation site to a block-like form by using an FIB apparatus, a step of carrying and fixing the block-like cut-out sample onto a sample substrate, and a step of working the block-like sample fixed onto the sample substrate into a needle tip shape by an FIB etching. Further, the sample worked into the needle tip shape is formed such that a layer direction of a multilayer structure becomes parallel to a longitudinal direction of a needle.
    • 本发明要解决的问题在于,通过局部地切割该位置,提出一种将装置预先加工成针状突起物的方法,从而将装置进行预先加工成针状突起的技术, 如果样品是在稍后提到的情况下含有蒸发电场小的元素层的多层结构的样品,则可以顺序进行稳定的离子蒸发的技术,从而使原子级的SAP分析成为可能。 对于本发明的原子探针装置的样品的预先加工包括通过使用FIB装置将样品的期望的观察位置切割成块状的步骤,携带和固定块状切口的步骤 样品到样品基板上,以及通过FIB蚀刻将固定在样品基板上的块状样品加工成针尖形状的步骤。 此外,加工成针尖形状的样品形成为使得多层结构的层方向平行于针的纵向方向。
    • 9. 发明授权
    • Analysis of integrated circuit operability using a focused ion beam
    • 使用聚焦离子束分析集成电路的可操作性
    • US5376883A
    • 1994-12-27
    • US984921
    • 1992-12-04
    • Takashi Kaito
    • Takashi Kaito
    • G01R31/28G01R31/303H01J37/252H01L21/66
    • G01R31/303
    • A method and apparatus for analyzing the operability of a semiconductor integrated circuit without removing a passivation film formed on a surface of the circuit and also for analyzing causes of failure of such circuit. The integrated circuit wiring receives an AC test signal and a predetermined portion of the surface of the circuit is simultaneously scanned and irradiated with a focused ion beam while the portion is irradiated with an electron beam to neutralize charges produced by the ion beam irradiation. Then, secondary electrons which are released from the surface of the circuit as a result of the focused ion beam irradiation are detected, and the detected signals are matched with a scanning signal to display an image of the semiconductor integrated circuit.
    • 一种用于分析半导体集成电路的可操作性而不去除形成在电路表面上的钝化膜的方法和装置,并且还用于分析这种电路的故障原因。 集成电路布线接收AC测试信号,同时用聚焦离子束扫描和照射电路表面的预定部分,同时用电子束照射该部分以中和由离子束照射产生的电荷。 然后,检测作为聚焦离子束照射的结果从电路表面释放的二次电子,并且检测到的信号与扫描信号相匹配,以显示半导体集成电路的图像。
    • 10. 发明申请
    • Processing probe, processing apparatus, and method of manufacturing the processing probe
    • 加工探头,加工装置及加工探针的制造方法
    • US20060192114A1
    • 2006-08-31
    • US11346825
    • 2006-02-03
    • Tatsuya AdachiTakashi Kaito
    • Tatsuya AdachiTakashi Kaito
    • G01N23/00
    • G01Q70/16G01Q70/10G01Q70/14G01Q80/00
    • A method of manufacturing a processing probe comprising a cantilever arranged in opposition to a sample, and a processing needle provided at a tip end of the cantilever to be able to contact with a surface of the sample in a state of being opposed to the sample, the processing needle being sharpened at a tip end thereof, the method comprising a selecting process of selecting a diamond small piece, which is sized to be conformed to a tip end dimension of the cantilever and has a projection, out of a plurality of diamond small pieces, a moving process of moving the selected diamond small piece onto a processing base after the selecting process, and a processing process of performing an etching processing in a manner to further sharpen the projection in an optional shape with focused beam after the moving process and mounting a base end side of the projection to the tip end of the cantilever with the use of the focused beam to fabricate a processing needle.
    • 一种制造处理探针的方法,其包括与样品相对布置的悬臂,以及设置在悬臂的尖端处以能够与样品相对的状态与样品的表面接触的处理针, 所述加工针在其尖端处被磨削,所述方法包括选择过程,所述选择过程选择金刚石小件,其尺寸设计成符合所述悬臂的尖端尺寸并且具有突出部,所述多个金刚石小件从多个金刚石小 在选择处理之后将所选择的金刚石小块移动到处理基底上的移动过程以及在移动过程之后以聚焦光束进一步锐化具有可选形状的突出物的方式进行蚀刻处理的处理过程;以及 使用聚焦光束将突起的基端侧安装到悬臂的末端以制造加工针。