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    • 1. 发明授权
    • Semiconductor device including a conductive film having a tapered shape
    • 包括具有锥形形状的导电膜的半导体装置
    • US08017951B2
    • 2011-09-13
    • US12424807
    • 2009-04-16
    • Takashi HamadaYasuyuki Arai
    • Takashi HamadaYasuyuki Arai
    • H01L27/12
    • H01L27/124G02F1/13454H01L27/1214H01L27/127H01L29/42384
    • TFT structures optimal for driving conditions of a pixel portion and driving circuits are obtained using a small number of photo masks. First through third semiconductor films are formed on a first insulating film. First shape first, second, and third electrodes are formed on the first through third semiconductor films. The first shape first, second, third electrodes are used as masks in first doping treatment to form first concentration impurity regions of one conductivity type in the first through third semiconductor films. Second shape first, second, and third electrodes are formed from the first shape first, second, and third electrodes. A second concentration impurity region of the one conductivity type which overlaps the second shape second electrode is formed in the second semiconductor film in second doping treatment. Also formed in the second doping treatment are third concentration impurity regions of the one conductivity type which are placed in the first and second semiconductor films. Fourth and Fifth concentration impurity regions having the other conductivity type that is opposite to the one conductivity type are formed in the third semiconductor film in third doping treatment.
    • 使用少量的光掩模获得对像素部分和驱动电路的驱动条件最佳的TFT结构。 第一至第三半导体膜形成在第一绝缘膜上。 第一形状的第一,第二和第三电极形成在第一至第三半导体膜上。 在第一掺杂处理中,第一形状的第一,第二,第三电极用作掩模,以在第一至第三半导体膜中形成一种导电类型的第一浓度杂质区。 第二形状的第一,第二和第三电极由第一形状的第一,第二和第三电极形成。 在第二掺杂处理中,在第二半导体膜中形成与第二形状的第二电极重叠的一种导电类型的第二浓度杂质区。 在第二掺杂处理中也形成为放置在第一和第二半导体膜中的一种导电类型的第三浓度杂质区。 在第三掺杂处理中,在第三半导体膜中形成具有与一种导电类型相反的另一导电类型的第四和第五浓度杂质区。
    • 4. 发明授权
    • Method of manufacturing a semiconductor device
    • 制造半导体器件的方法
    • US06979603B2
    • 2005-12-27
    • US10422829
    • 2003-04-25
    • Takashi HamadaYasuyuki Arai
    • Takashi HamadaYasuyuki Arai
    • H01L29/786G02F1/1362H01L21/77H01L21/84H01L27/12H01L29/423H01L21/00
    • H01L27/124G02F1/13454H01L27/1214H01L27/127H01L29/42384
    • TFT structures optimal for driving conditions of a pixel portion and driving circuits are obtained using a small number of photo masks. First through third semiconductor films are formed on a first insulating film. First shape first, second, and third electrodes are formed on the first through third semiconductor films. The first shape first, second, third electrodes are used as masks in first doping treatment to form first concentration impurity regions of one conductivity type in the first through third semiconductor films. Second shape first, second, and third electrodes are formed from the first shape first, second, and third electrodes. A second concentration impurity region of the one conductivity type which overlaps the second shape second electrode is formed in the second semiconductor film in second doping treatment. Also formed in the second doping treatment are third concentration impurity regions of the one conductivity type which are placed in the first and second semiconductor films. Fourth and Fifth concentration impurity regions having the other conductivity type that is opposite to the one conductivity type are formed in the third semiconductor film in third doping treatment.
    • 使用少量的光掩模获得对像素部分和驱动电路的驱动条件最佳的TFT结构。 第一至第三半导体膜形成在第一绝缘膜上。 第一形状的第一,第二和第三电极形成在第一至第三半导体膜上。 在第一掺杂处理中,第一形状的第一,第二,第三电极用作掩模,以在第一至第三半导体膜中形成一种导电类型的第一浓度杂质区。 第二形状的第一,第二和第三电极由第一形状的第一,第二和第三电极形成。 在第二掺杂处理中,在第二半导体膜中形成与第二形状的第二电极重叠的一种导电类型的第二浓度杂质区。 在第二掺杂处理中也形成为放置在第一和第二半导体膜中的一种导电类型的第三浓度杂质区。 在第三掺杂处理中,在第三半导体膜中形成具有与一种导电类型相反的另一导电类型的第四和第五浓度杂质区。
    • 5. 发明授权
    • Display device having driver TFTs and pixel TFTs formed on the same substrate
    • 具有形成在同一基板上的驱动TFT和像素TFT的显示装置
    • US07531839B2
    • 2009-05-12
    • US11288218
    • 2005-11-29
    • Takashi HamadaYasuyuki Arai
    • Takashi HamadaYasuyuki Arai
    • H01L27/13
    • H01L27/124G02F1/13454H01L27/1214H01L27/127H01L29/42384
    • TFT structures optimal for driving conditions of a pixel portion and driving circuits are obtained using a small number of photo masks. First through third semiconductor films are formed on a first insulating film. First shape first, second, and third electrodes are formed on the first through third semiconductor films. The first shape first, second, third electrodes are used as masks in first doping treatment to form first concentration impurity regions of one conductivity type in the first through third semiconductor films. Second shape first, second, and third electrodes are formed from the first shape first, second, and third electrodes. A second concentration impurity region of the one conductivity type which overlaps the second shape second electrode is formed in the second semiconductor film in second doping treatment. Also formed in the second doping treatment are third concentration impurity regions of the one conductivity type which are placed in the first and second semiconductor films. Fourth and Fifth concentration impurity regions having the other conductivity type that is opposite to the one conductivity type are formed in the third semiconductor film in third doping treatment.
    • 使用少量的光掩模获得对像素部分和驱动电路的驱动条件最佳的TFT结构。 第一至第三半导体膜形成在第一绝缘膜上。 第一形状的第一,第二和第三电极形成在第一至第三半导体膜上。 在第一掺杂处理中,第一形状的第一,第二,第三电极用作掩模,以在第一至第三半导体膜中形成一种导电类型的第一浓度杂质区。 第二形状的第一,第二和第三电极由第一形状的第一,第二和第三电极形成。 在第二掺杂处理中,在第二半导体膜中形成与第二形状的第二电极重叠的一种导电类型的第二浓度杂质区。 在第二掺杂处理中也形成为放置在第一和第二半导体膜中的一种导电类型的第三浓度杂质区。 在第三掺杂处理中,在第三半导体膜中形成具有与一种导电类型相反的另一导电类型的第四和第五浓度杂质区。
    • 9. 发明授权
    • Method for manufacturing semiconductor device
    • 制造半导体器件的方法
    • US08659014B2
    • 2014-02-25
    • US13174980
    • 2011-07-01
    • Tatsuya HondaYasuyuki Arai
    • Tatsuya HondaYasuyuki Arai
    • H01L29/10H01L29/12
    • H01L27/1225H01L27/3244H01L29/7869Y10T428/12917
    • An object is to provide a method for manufacturing a semiconductor device, in which the number of photolithography steps can be reduced, the manufacturing process can be simplified, and manufacturing can be performed with high yield at low cost. A method for manufacturing a semiconductor device includes the following steps: forming a semiconductor film; irradiating a laser beam by passing the laser beam through a photomask including a shield for shielding the laser beam; subliming a region which has been irradiated with the laser beam through a region in which the shield is not formed in the photomask in the semiconductor film; forming an island-shaped semiconductor film in such a way that a region which is not irradiated with the laser beam is not sublimed because it is a region in which the shield is formed in the photomask; forming a first electrode which is one of a source electrode and a drain electrode and a second electrode which is the other one of the source electrode and the drain electrode; forming a gate insulating film; and forming a gate electrode over the gate insulating film.
    • 本发明的目的是提供一种制造半导体器件的方法,其中可以减少光刻步骤的数量,可以简化制造工艺,并且可以以低成本高成品率地进行制造。 一种制造半导体器件的方法包括以下步骤:形成半导体膜; 通过使激光束通过包括用于屏蔽激光束的屏蔽的光掩模来照射激光束; 通过在半导体膜中的光掩模中未形成屏蔽的区域激光照射激光束的区域; 形成岛状半导体膜,使得由于其是在光掩模中形成屏蔽的区域而不被激光束照射的区域不升华; 形成作为源极电极和漏极电极之一的第一电极和作为源极电极和漏极电极中的另一个的第二电极; 形成栅极绝缘膜; 以及在所述栅极绝缘膜上形成栅电极。