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1. 发明授权

US08065031B2 Polishing end point detection method utilizing torque change and device thereof 失效
标题翻译：利用扭矩变化的抛光终点检测方法及其装置
公开(公告)号：US08065031B2
公开(公告)日：2011-11-22
申请号：US11900155
申请日：2007-09-10
申请人： Takashi Fujita , Satoshi Hasegawa , Shinji Osada , Soushi Yamada , Takuji Atarashi
发明人： Takashi Fujita , Satoshi Hasegawa , Shinji Osada , Soushi Yamada , Takuji Atarashi
IPC分类号： G06F19/00 , G05B13/02 , G01L1/00 , H03F1/26 , B24B49/00
CPC分类号： B24B49/16 , B24B37/013 , H01L21/3212 , H01L22/26
摘要： Change in a torque waveform is monitored while removing continuously-varied periodic noise in real time, and the change in the torque waveform caused purely by the wafer state is detected by separating noise components while removing the noise not caused by the wafer state such as drift noise caused by dressing conditions and the polishing pad state, thereby reliably detecting a polishing end point with high precision when polishing is finished. A polishing end point detection device utilizing torque change for analyzing periodic components in data by subjecting Fourier transformation to the measured data, and calculating moving average processing time for removing periodic noise components based on the analyzed periodic components, and correcting the waveform by performing averaging process based on the moving average processing time calculated in real time for the data, and detecting the polishing end point of a predetermined film based on a change in the corrected torque waveform.
摘要翻译：在实时切换连续变化的周期性噪声的同时监视扭矩波形的变化，并且仅通过晶片状态引起的转矩波形的变化通过分离噪声分量来检测，同时消除由晶片状态引起的噪声（例如漂移）由修整条件和抛光垫状态引起的噪声，从而在抛光结束时可以高精度地可靠地检测抛光终点。一种抛光终点检测装置，其利用扭矩变化来对数据中的周期性分量进行分析，对傅立叶变换进行测量数据的处理，并根据分析的周期分量计算移除平均处理时间以消除周期性噪声分量，并通过执行平均处理来校正波形基于对于数据实时计算的移动平均处理时间，并且基于校正的扭矩波形的变化来检测预定胶片的抛光终点。

2. 发明申请

US20080071414A1 Polishing end point detection method utilizing torque change and device thereof 失效
标题翻译：利用扭矩变化的抛光终点检测方法及其装置
公开(公告)号：US20080071414A1
公开(公告)日：2008-03-20
申请号：US11900155
申请日：2007-09-10
申请人： Takashi Fujita , Satoshi Hasegawa , Shinji Osada , Soushi Yamada , Takuji Atarashi
发明人： Takashi Fujita , Satoshi Hasegawa , Shinji Osada , Soushi Yamada , Takuji Atarashi
IPC分类号： G06F19/00
CPC分类号： B24B49/16 , B24B37/013 , H01L21/3212 , H01L22/26
摘要： Change in a torque waveform is monitored while removing continuously-varied periodic noise in real time, and the change in the torque waveform caused purely by the wafer state is detected by separating noise components while removing the noise not caused by the wafer state such as drift noise cased by dressing conditions and the polishing pad state, thereby reliably detecting a polishing end point at high precision in the wafer state when polishing is finished. A polishing end point detection device utilizing torque change having a torque measurement means for measuring torque, a periodic component analysis means for analyzing periodic components in data by subjecting Fourier transformation to the measured data, an average processing time calculation means for calculating moving average processing time for removing periodic noise components based on the analyzed periodic components, an average processing means for correcting the waveform by performing averaging process based on the moving average processing time calculated in real time for the data, and an end point detection means for detecting the polishing end point of a predetermined film based on change in the corrected torque waveform is provided.
摘要翻译：在实时切换连续变化的周期性噪声的同时监视扭矩波形的变化，并且仅通过晶片状态引起的转矩波形的变化通过分离噪声分量来检测，同时消除由晶片状态引起的噪声（例如漂移）通过修整条件和抛光垫状态进行包围的噪声，从而在抛光结束时在晶片状态下可靠地高精度地检测抛光终点。一种利用扭矩变化的抛光终点检测装置，具有用于测量扭矩的扭矩测量装置，用于通过对所测量的数据进行傅里叶变换来分析数据中的周期分量的周期性分量分析装置，用于计算移动平均处理时间的平均处理时间计算装置用于基于分析的周期分量去除周期性噪声分量;平均处理装置，用于通过基于对于数据实时计算的移动平均处理时间进行平均处理来校正波形;以及终点检测装置，用于检测抛光端提供基于校正转矩波形的变化的预定胶片的点。

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