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    • 3. 发明授权
    • Optical pickup device and method of manufacturing the same
    • 光拾取装置及其制造方法
    • US08619537B2
    • 2013-12-31
    • US13535010
    • 2012-06-27
    • Takayuki MogiTakao Fukumoto
    • Takayuki MogiTakao Fukumoto
    • G11B17/00
    • G11B7/0935G11B7/22
    • Provided is an optical pickup device capable of preventing a soldering work from physically damaging any part of a housing of the optical pickup device. In the optical pickup device to be provided, a circuit board fixed to an LD holder and a circuit board covering a housing from below are connected via a solder joint. An inner-side part of an upper-end portion of an external sidewall of the housing located near the connecting position is cut away to form a cut surface. When a soldering iron is used to form the solder joint to connect the two circuit boards, the cut surface prevents the soldering iron from touching the external sidewall and thereby preventing this part of the external sidewall from being damaged by the soldering iron.
    • 提供了一种能够防止焊接工作物理地损坏光学拾取装置的壳体的任何部分的光学拾取装置。 在要提供的光拾取装置中,通过焊接点连接固定到LD保持器的电路板和从下方覆盖壳体的电路板。 位于连接位置附近的壳体的外侧壁的上端部的内侧部被切除以形成切割面。 当使用烙铁形成焊接接头来连接两个电路板时,切割表面防止烙铁接触外侧壁,从而防止外部侧壁的这一部分被烙铁损坏。