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1. 发明申请

US20070222338A1 Ultrasonic transducer, ultrasonic probe and method for fabricating the same 有权
标题翻译：超声波换能器，超声波探头及其制造方法
公开(公告)号：US20070222338A1
公开(公告)日：2007-09-27
申请号：US11657186
申请日：2007-01-23
申请人： Takanori Aono , Tatsuya Nagata , Hiroyuki Enomoto , Shuntaro Machida
发明人： Takanori Aono , Tatsuya Nagata , Hiroyuki Enomoto , Shuntaro Machida
IPC分类号： H01L41/04
CPC分类号： B06B1/0292
摘要： In an ultrasonic transducer including a gap between an upper electrode and a lower electrode on a silicon substrate, it is made possible to reduce or adjust warpage of an above-gap membrane vibrated by electrostatic actuation due to internal stress. A fourth insulating film and a fifth insulating film of films positioned above the gap which is a cavity required for transmitting and receiving ultrasonic are respectively a silicon oxide film for compression stress and a silicon nitride film for tensile stress. Therefore, compression stress and tensile stress cancel each other, so that warpage of the above-gap membrane is reduced. An amount of warpage can be adjusted by adjusting a film thickness of the fourth insulating film and a film thickness of the fifth insulating film.
摘要翻译：在包括硅基板上的上电极和下电极之间的间隙的超声波换能器中，由于内部应力，能够减少或调整由静电驱动振动的上间隙膜的翘曲。位于间隙上方的膜的第四绝缘膜和第五绝缘膜分别是用于发送和接收超声波所需的腔，分别是用于压缩应力的氧化硅膜和用于拉伸应力的氮化硅膜。因此，压缩应力和拉伸应力彼此抵消，从而减小了上间隙膜的翘曲。可以通过调整第四绝缘膜的膜厚度和第五绝缘膜的膜厚来调节翘曲量。

2. 发明授权

US07667374B2 Ultrasonic transducer, ultrasonic probe and method for fabricating the same 有权
标题翻译：超声波换能器，超声波探头及其制造方法
公开(公告)号：US07667374B2
公开(公告)日：2010-02-23
申请号：US11657186
申请日：2007-01-23
申请人： Takanori Aono , Tatsuya Nagata , Hiroyuki Enomoto , Shuntaro Machida
发明人： Takanori Aono , Tatsuya Nagata , Hiroyuki Enomoto , Shuntaro Machida
IPC分类号： H01L41/00
CPC分类号： B06B1/0292
摘要： In an ultrasonic transducer including a gap between an upper electrode and a lower electrode on a silicon substrate, it is made possible to reduce or adjust warpage of an above-gap membrane vibrated by electrostatic actuation due to internal stress. A fourth insulating film and a fifth insulating film of films positioned above the gap which is a cavity required for transmitting and receiving ultrasonic are respectively a silicon oxide film for compression stress and a silicon nitride film for tensile stress. Therefore, compression stress and tensile stress cancel each other, so that warpage of the above-gap membrane is reduced. An amount of warpage can be adjusted by adjusting a film thickness of the fourth insulating film and a film thickness of the fifth insulating film.
摘要翻译：在包括硅基板上的上电极和下电极之间的间隙的超声波换能器中，由于内部应力，能够减少或调整由静电驱动振动的上间隙膜的翘曲。位于间隙上方的膜的第四绝缘膜和第五绝缘膜分别是用于发送和接收超声波所需的腔，分别是用于压缩应力的氧化硅膜和用于拉伸应力的氮化硅膜。因此，压缩应力和拉伸应力彼此抵消，从而减小了上间隙膜的翘曲。可以通过调整第四绝缘膜的膜厚度和第五绝缘膜的膜厚来调节翘曲量。

3. 发明授权

US07969067B2 Ultrasound probe 失效
标题翻译：超声探头
公开(公告)号：US07969067B2
公开(公告)日：2011-06-28
申请号：US12161962
申请日：2006-11-14
申请人： Takanori Aono , Tatsuya Nagata , Katsunori Asafusa , Takashi Kobayashi , Naoya Kanda
发明人： Takanori Aono , Tatsuya Nagata , Katsunori Asafusa , Takashi Kobayashi , Naoya Kanda
IPC分类号： H01L41/08
CPC分类号： G10K11/002 , A61B8/00
摘要： There is provided an ultrasound probe including a first substrate having a silicon substrate and an ultrasound transmit-receive element, an acoustic lens disposed over an upper surface of the first substrate, and a damping layer disposed under the first substrate, in which a second substrate is disposed between a lower surface of the first substrate and an upper surface of the damping layer, and the second substrate is made of a material having approximately the same linear expansion coefficient and acoustic impedance as the silicon substrate of the first substrate. With this structure, it is possible to provide the ultrasound probe which can prevent damage to the silicon substrate due to temperature change and has excellent transmission/reception performance and structure reliability while reducing noise by reflected waves in transmission and reception.
摘要翻译：提供一种超声波探头，其包括具有硅衬底和超声波发射接收元件的第一衬底，设置在第一衬底的上表面上的声透镜，以及设置在第一衬底下方的阻尼层，其中第二衬底设置在第一基板的下表面和阻尼层的上表面之间，第二基板由具有与第一基板的硅基板大致相同的线膨胀系数和声阻抗的材料制成。利用这种结构，可以提供能够防止由于温度变化而损坏硅基板的超声波探头，并且在发送和接收中减少反射波的噪声的同时具有优异的发送/接收性能和结构可靠性。

4. 发明申请

US20090069688A1 ULTRASOUND PROBE 失效
标题翻译：超声探头
公开(公告)号：US20090069688A1
公开(公告)日：2009-03-12
申请号：US12161962
申请日：2006-11-14
申请人： Takanori Aono , Tatsuya Nagata , Katsunori Asafusa , Takashi Kobayashi , Naoya Kanda
发明人： Takanori Aono , Tatsuya Nagata , Katsunori Asafusa , Takashi Kobayashi , Naoya Kanda
IPC分类号： A61B8/14
CPC分类号： G10K11/002 , A61B8/00
摘要： There is provided an ultrasound probe including a first substrate having a silicon substrate and an ultrasound transmit-receive element, an acoustic lens disposed over an upper surface of the first substrate, and a damping layer disposed under the first substrate, in which a second substrate is disposed between a lower surface of the first substrate and an upper surface of the damping layer, and the second substrate is made of a material having approximately the same linear expansion coefficient and acoustic impedance as the silicon substrate of the first substrate. With this structure, it is possible to provide the ultrasound probe which can prevent damage to the silicon substrate due to temperature change and has excellent transmission/reception performance and structure reliability while reducing noise by reflected waves in transmission and reception.
摘要翻译：提供一种超声波探头，其包括具有硅衬底和超声波发射接收元件的第一衬底，设置在第一衬底的上表面上的声透镜，以及设置在第一衬底下方的阻尼层，其中第二衬底设置在第一基板的下表面和阻尼层的上表面之间，第二基板由具有与第一基板的硅基板大致相同的线膨胀系数和声阻抗的材料制成。利用这种结构，可以提供能够防止由于温度变化而损坏硅基板的超声波探头，并且在发送和接收中减少反射波的噪声的同时具有优异的发送/接收性能和结构可靠性。

5. 发明授权

US07018857B2 Method of manufacturing a semiconductor device including defect inspection using a semiconductor testing probe 失效
标题翻译：使用半导体测试探针制造包括缺陷检查的半导体器件的方法
公开(公告)号：US07018857B2
公开(公告)日：2006-03-28
申请号：US10459598
申请日：2003-06-12
申请人： Masatoshi Kanamaru , Takanori Aono , Tatsuya Nagata , Kenji Kawakami , Hideyuki Aoki
发明人： Masatoshi Kanamaru , Takanori Aono , Tatsuya Nagata , Kenji Kawakami , Hideyuki Aoki
IPC分类号： H01L21/66
CPC分类号： G01R1/06761 , G01R1/0735 , G01R3/00
摘要： A manufacturing method for improving the yield in a semiconductor manufacturing process and reducing the manufacturing cost produces a semiconductor device that is inexpensively manufactured and has a high reliability by reliably making contact during inspection with a suitable pressing force, while limiting damage to an electrode pad even when many inspected electrodes are inspected. A substrate used for inspection of the semiconductor device has a beam, a probe on the beam having a projecting shape for coming in contact with an electrode (electrode pad) of the semiconductor device, and a secondary electrode electrically connected to the probe through an electrically conductive member disposed on the side of the beam opposed to the side where the probe is provided. In an inspecting process, an inspecting device having a layer having many projections formed in the probe come in contact with the electrode pad of the semiconductor device.
摘要翻译：一种用于提高半导体制造工艺中的产量并降低制造成本的制造方法产生了廉价制造的半导体器件，并且通过在合适的按压力期间可靠地进行接触检查而具有高的可靠性，同时限制对电极焊盘的损伤甚至当检查了许多检查电极时。用于检查半导体器件的衬底具有光束，所述光束上的探针具有用于与半导体器件的电极（电极焊盘）接触的突出形状，以及通过电气电连接到探针的次级电极导电构件设置在与设置探针的一侧相对的梁的侧面上。在检查过程中，具有形成在探针中的具有许多突起的层的检查装置与半导体器件的电极焊盘接触。

6. 发明申请

US20050074910A1 Manufacturing method of semiconductor device 失效
标题翻译：半导体器件的制造方法
公开(公告)号：US20050074910A1
公开(公告)日：2005-04-07
申请号：US10459598
申请日：2003-06-12
申请人： Masatoshi Kanamaru , Takanori Aono , Tatsuya Nagata , Kenji Kawakami , Hideyuki Aoki
发明人： Masatoshi Kanamaru , Takanori Aono , Tatsuya Nagata , Kenji Kawakami , Hideyuki Aoki
IPC分类号： G01R31/26 , G01R1/067 , G01R1/073 , G01R3/00 , H01L21/66
CPC分类号： G01R1/06761 , G01R1/0735 , G01R3/00
摘要： A manufacturing method for improving the yield in a semiconductor manufacturing process and reducing the manufacturing cost produces a semiconductor device that is inexpensively manufactured and has a high reliability by reliably making contact during inspection with a suitable pressing force, while limiting damage to an electrode pad even when many inspected electrodes are inspected. A substrate used for inspection of the semiconductor device has a beam, a probe on the beam having a projecting shape for coming in contact with an electrode (electrode pad) of the semiconductor device, and a secondary electrode electrically connected to the probe through an electrically conductive member disposed on the side of the beam opposed to the side where the probe is provided. In an inspecting process, an inspecting device having a layer having many projections formed in the probe come in contact with the electrode pad of the semiconductor device.
摘要翻译：一种用于提高半导体制造工艺中的产量并降低制造成本的制造方法产生了廉价制造的半导体器件，并且通过在合适的按压力期间可靠地进行接触检查而具有高的可靠性，同时限制对电极焊盘的损伤甚至当检查了许多检查电极时。用于检查半导体器件的衬底具有光束，所述光束上的探针具有用于与半导体器件的电极（电极焊盘）接触的突出形状，以及通过电气电连接到探针的次级电极导电构件设置在与设置探针的一侧相对的梁的侧面上。在检查过程中，具有形成在探针中的具有许多突起的层的检查装置与半导体器件的电极焊盘接触。

7. 发明申请

US20140260612A1 Composite Sensor and Method for Manufacturing The Same 审中-公开
标题翻译：复合传感器及其制造方法
公开(公告)号：US20140260612A1
公开(公告)日：2014-09-18
申请号：US14353635
申请日：2011-11-28
申请人： Takanori Aono , Kengo Suzuki , Masahide Hayashi , Heewon Jeong
发明人： Takanori Aono , Kengo Suzuki , Masahide Hayashi , Heewon Jeong
IPC分类号： G01C19/5705
CPC分类号： G01C19/5705 , B81B2201/0235 , B81B2201/0242 , B81C1/00285 , G01C19/5783 , G01P15/0802 , G01P2015/088
摘要： The disclosure provides a composite sensor with high reliability and a method for manufacturing the same. A moving body of an acceleration sensor and an oscillator of an angular velocity sensor are provided on the same sensor wafer, while being partitioned by a wall, and a cap wafer is formed to have a gap that corresponds to each of the sensors. A through hole and a bump are formed in a sensor sealing portion, the acceleration sensor is sealed in an air atmosphere in a first sealing process, and in a second sealing process, the angular velocity sensor is sealed by bringing the sensors and the cap into contact with each other and joining the sensors and the cap in a vacuum atmosphere. Thereafter, a composite sensor wafer is cut, a circuit board and a wiring board are mounted thereon, and a composite sensor is formed.
摘要翻译：本公开提供了具有高可靠性的复合传感器及其制造方法。加速度传感器的移动体和角速度传感器的振荡器设置在相同的传感器晶片上，同时由壁分隔，并且盖晶片形成为具有与每个传感器对应的间隙。在传感器密封部中形成有贯通孔和凸块，在第一密封工序中将加速度传感器密封在空气气氛中，在第二密封工序中，通过将传感器和盖体彼此接触并在真空环境中连接传感器和盖子。此后，将复合传感器晶片切割，电路板和布线板安装在其上，并且形成复合传感器。

8. 发明授权

US07939938B2 Functional device package with metallization arrangement for improved bondability of two substrates 有权
标题翻译：具有金属化布置的功能器件封装，用于改善两个衬底的粘合性
公开(公告)号：US07939938B2
公开(公告)日：2011-05-10
申请号：US12028108
申请日：2008-02-08
申请人： Shohei Hata , Naoki Matsushima , Eiji Sakamoto , Ryoji Okada , Takanori Aono , Atsushi Kazama , Toshiki Kida
发明人： Shohei Hata , Naoki Matsushima , Eiji Sakamoto , Ryoji Okada , Takanori Aono , Atsushi Kazama , Toshiki Kida
IPC分类号： H01L23/04
CPC分类号： B81C1/00269 , B81C2203/019 , H01L2924/0002 , H01L2924/00
摘要： A packaging structure for hermetically sealing a functional device by solder connection at a wafer level in which a first Si substrate having a concave portion metallized on its internal surface and a second Si substrate metallized at a position opposed to said concave portion are used, the metallization applied to the internal surface of the concave portion of the first Si substrate and the metallization applied to the second Si substrate at the position opposed to the concave portion are connected by molten solder to hermetically seal the functional device between the first Si substrate and the second Si substrate, whereby the wettability of the solder for the two Si substrates is improved, the bondability between the Si substrates is enhanced, and the yield at which the package is manufactured is improved.
摘要翻译：一种封装结构，用于通过在晶片级焊接连接来密封功能器件，其中使用在其内表面上具有金属化的凹部的第一Si衬底和在与所述凹部相对的位置上金属化的第二Si衬底，所述金属化施加到第一Si衬底的凹部的内表面，并且在与凹部相对的位置处施加到第二Si衬底的金属化通过熔融焊料连接，以将功能器件密封在第一Si衬底和第二Si衬底之间 Si衬底，由此提高了用于两个Si衬底的焊料的润湿性，提高了Si衬底之间的粘合性，并提高了制造封装的成品率。

9. 发明授权

US09146253B2 Combined sensor and method for manufacturing the same 有权
标题翻译：组合传感器及其制造方法
公开(公告)号：US09146253B2
公开(公告)日：2015-09-29
申请号：US13699235
申请日：2011-05-20
申请人： Takanori Aono , Kengo Suzuki , Akira Koide , Masahide Hayashi
发明人： Takanori Aono , Kengo Suzuki , Akira Koide , Masahide Hayashi
IPC分类号： G01P1/02 , G01P15/08 , B81C1/00 , G01C19/56 , G01P15/125 , G01C19/5783 , H01L23/00 , H01L23/31 , H01L21/56
CPC分类号： G01P15/0802 , B81B2201/0235 , B81B2201/0242 , B81B2203/0315 , B81B2207/095 , B81C1/00293 , B81C2203/031 , G01C19/56 , G01C19/5783 , G01P15/125 , H01L21/561 , H01L23/315 , H01L24/94 , H01L2924/12042 , H01L2924/15788 , H01L2924/16235 , Y10T29/49146 , Y10T29/49826 , H01L2924/00
摘要： An acceleration sensor and an angular velocity sensor are sealed in respective pressure atmospheres suitable therefor in the process of a series of bonding steps, thereby improving the detection sensibilities of the sensors.A movable member 111 of an acceleration sensor 11 and a vibrator 121 of an angular velocity sensor 12 are fabricated on the same sensor wafer 10 with a wall 16 interposed therebetween. A cap wafer 20 is formed in which gaps 21, 22 corresponding to the movable member 111 of the acceleration sensor 11 and the vibrator 121 of the angular velocity sensor 12 are provided. Bumps 23 are disposed near the gap 22 of the angular velocity sensor 12. The acceleration sensor 11 is sealed at atmospheric pressure. Then, the angular velocity sensor 12 is subjected to high temperature and a high-load and is vacuum-sealed. Thereafter, cutting with a diamond grindstone and mounting of circuit substrates and a wiring substrate are performed to form a combined sensor.
摘要翻译：加速度传感器和角速度传感器在一系列接合步骤的过程中被密封在适合于其的相应的压力环境中，从而提高传感器的检测灵敏度。加速度传感器11的可动部件111和角速度传感器12的振动器121被制造在相同的传感器晶片10上，壁16插入其中。形成盖片20，其中设置有与加速度传感器11的可动构件111对应的间隙21,22和角速度传感器12的振子121。凸起23设置在角速度传感器12的间隙22附近。加速度传感器11在大气压下被密封。然后，对角速度传感器12进行高温高负荷的真空密封。此后，进行用金刚石磨石切割并安装电路基板和布线基板以形成组合的传感器。

10. 发明申请

US20100014033A1 BASE MATERIAL FOR DISPLAY PANEL, METHOD FOR MANUFACTURING THE BASE MATERIAL, AND DISPLAY PANEL 审中-公开
标题翻译：用于显示面板的基材，用于制造基底材料的方法和显示面板
公开(公告)号：US20100014033A1
公开(公告)日：2010-01-21
申请号：US12448843
申请日：2008-02-05
申请人： Kaori Kawasaki , Takanori Aono
发明人： Kaori Kawasaki , Takanori Aono
IPC分类号： G02F1/13363 , H01J9/00
CPC分类号： G02B5/201 , G02B5/3083 , G02F1/13363 , G02F1/1339 , G02F2001/133565 , G02F2001/133633 , G02F2201/50 , G02F2413/01 , G02F2413/11 , G02F2413/13
摘要： A liquid crystal display panel in which a retardation layer is disposed in the inner side of a cell is provided. The liquid crystal display panel can improve the close adhesiveness between the retardation layer in the seal region and the base material of the liquid crystal display panel substrate constituting the liquid crystal cell, whereby leakage of light can be prevented; the rigidity of the liquid crystal cell can be improved; and the common defects of each panel can be eliminated. Also, a display panel base material for such a liquid crystal display panel and a method of manufacturing the same are provided. On a sheet-shaped base material 10, there is laminated a retardation control layer 14 using the polymerizable liquid crystal as a material in which an anisotropic phase part 14a that is polymerized and cured with use of a metal mask 70 of a structure having another frame in the inside of a frame in a state in which a polymerizable liquid crystal serving as a material is oriented and an isotropic phase part 14b that is polymerized and cured in an isotropic state in which the polymerizable liquid crystal serving as a material is not oriented are arranged to be separated in a regional manner in the plane direction thereof. The isotropic phase part 14b is disposed in a region including at least a region predetermined to be sealed on the retardation control layer 14.
摘要翻译：提供一种液晶显示面板，其中延迟层设置在单元的内侧。液晶显示面板可以提高密封区域中的延迟层与构成液晶单元的液晶显示面板基板的基材之间的紧密粘合性，从而可以防止光的泄漏; 可以提高液晶单元的刚性; 并且可以消除每个面板的常见缺陷。此外，还提供了一种用于这种液晶显示面板的显示面板基材及其制造方法。在片状基材10上，使用可聚合液晶作为材料层叠延迟控制层14，其中使用具有另一框架的结构的金属掩模70聚合和固化的各向异性相部分14a 在作为材料的聚合性液晶取向的状态下的框架内部，以各向同性状态聚合固化的各向同性状态的各向异性状态，其中作为材料的取向的聚合性液晶不是取向的各向同性相部分14b，被布置为在其平面方向上以区域方式分离。各向同性相部分14b设置在至少包括预定密封在延迟控制层14上的区域的区域中。

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