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1. 发明授权

US07216327B2 Device for estimating number of board layers constituting board, system including the device, and method for estimating the same and program for executing the method 有权
标题翻译：用于估计构成板的板数量的装置，包括该装置的系统，以及用于估计其的方法和用于执行该方法的程序的装置
公开(公告)号：US07216327B2
公开(公告)日：2007-05-08
申请号：US10777103
申请日：2004-02-13
申请人： Takahiro Yaguchi , Seishi Eya
发明人： Takahiro Yaguchi , Seishi Eya
IPC分类号： G06F17/50
CPC分类号： G06F17/5077 , H01L2224/16 , H01L2924/15311 , H05K3/0005 , H05K3/46
摘要： A device for estimating the required number of board layer to provide necessary wiring in a printed circuit board or a LSI package, a system including the device, a method and a program for estimating the same. In this system, positional information of pins mounted to each component and a board, and connection information between pins are retrieved from a pin positional information file and a net list file. Further, information about an order of layers to be added, a diameter of a via in respective layers and obstacles to wiring is retrieved from the net list file an added layer structure defining file. Thereafter, information about a layer structure, vias, an area where wiring is prohibited is stored in a storage. A wiring route searching section determines whether or not it is possible to form necessary wiring under the present structure. When the wiring route searching section determines it to be impossible, a layer in the next order is added according to information about added layers. Subsequently, the wiring route searching section judges the possibility again. When determining it to be possible, the wiring route searching section outputs the present layer structure to an output device. By this means, it becomes possible to estimate a layer structure and the number of layers.
摘要翻译：一种用于估计所需数量的电路板层以在印刷电路板或LSI封装中提供必要布线的装置，包括该装置的系统，方法和用于估计该装置的程序。在该系统中，从引脚位置信息文件和网络列表文件检索安装到每个部件和板上的引脚的位置信息以及引脚之间的连接信息。此外，从网络列表文件检索关于要添加的层的顺序，各层中的通孔的直径和布线的障碍的信息，添加层结构定义文件。此后，存储有关层结构，通孔，禁止布线的区域的信息。布线路径搜索部确定在本结构下是否可能形成必要的布线。当布线路径搜索部确定为不可能时，根据关于添加的层的信息，添加下一顺序的层。随后，布线路径搜索部分再次判断可能性。当确定可能时，布线路径搜索部分将当前层结构输出到输出装置。通过这种方式，可以估计层结构和层数。

2. 发明申请

US20060161874A1 Printed circuit wiring board designing support device, printed circuit board designing method, and its program 有权
标题翻译：印刷电路布线板设计支援装置，印刷电路板设计方法及其程序
公开(公告)号：US20060161874A1
公开(公告)日：2006-07-20
申请号：US10561195
申请日：2004-06-16
申请人： Takashi Harada , Takahiro Yaguchi , Akira Wakui , Seishi Eya , Shunsuke Fujimoto
发明人： Takashi Harada , Takahiro Yaguchi , Akira Wakui , Seishi Eya , Shunsuke Fujimoto
IPC分类号： G06F17/50 , G06F9/45
CPC分类号： G06F17/5068 , H05K1/0231 , H05K3/0005 , H05K2201/09309
摘要： A printed circuit wiring board designing support device includes a layout data receiving section receiving printed circuit board layout data through an input/output section, a section for extracting structures of power supply/ground planes, a via hole extracting section for extracting a via hole interconnecting the wirings extending over power supply/ground planes, a capacitor extracting section for extracting a capacitor connected between power supply/ground planes, a distance measuring section for measuring the distance between the via hole and the capacitor, a database where the allowable distance value between the via hole and the capacitor in respect to the distance between the power supply and ground planes is recorded, an examination section for comparing the capacitor/via hole distance with the allowable distance value, and a warning section for issuing a warning when the distance between the via hole and the capacitor is larger than the allowable distance value.
摘要翻译：一种印刷电路布线板设计支援装置，包括布局数据接收部分，通过输入/输出部分接收印刷电路板布局数据，用于提取电源/接地层结构的部分，通孔提取部分，用于提取互连的通孔在电源/接地层上延伸的布线，用于提取连接在电源/接地层之间的电容器的电容器提取部分，用于测量通孔和电容器之间的距离的距离测量部分，记录通孔和电容器相对于电源与接地面之间的距离，用于将电容器/通孔距离与允许距离值进行比较的检查部分和用于在电容器/通孔距离与接地面之间的距离通孔和电容器大于容许距离值。

3. 发明申请

US20050278679A1 Device for estimating number of board layers constituting board, system including the device, and method for estimating the same and program for executing the method 有权
标题翻译：用于估计构成板的板数量的装置，包括该装置的系统，以及用于估计其的方法和用于执行该方法的程序的装置
公开(公告)号：US20050278679A1
公开(公告)日：2005-12-15
申请号：US10777103
申请日：2004-02-13
申请人： Takahiro Yaguchi , Seishi Eya
发明人： Takahiro Yaguchi , Seishi Eya
IPC分类号： G06F17/50 , H01L23/12 , H03K17/693 , H05K1/00 , H05K3/00 , H05K3/46
CPC分类号： G06F17/5077 , H01L2224/16 , H01L2924/15311 , H05K3/0005 , H05K3/46
摘要： A device for estimating the required number of board layer to provide necessary wiring in a printed circuit board or a LSI package, a system including the device, a method and a program for estimating the same. In this system, positional information of pins mounted to each component and a board, and connection information between pins are retrieved from a pin positional information file and a net list file. Further, information about an order of layers to be added, a diameter of a via in respective layers and obstacles to wiring is retrieved from the net list file an added layer structure defining file. Thereafter, information about a layer structure, vias, an area where wiring is prohibited is stored in a storage. A wiring route searching section determines whether or not it is possible to form necessary wiring under the present structure. When the wiring route searching section determines it to be impossible, a layer in the next order is added according to information about added layers. Subsequently, the wiring route searching section judges the possibility again. When determining it to be possible, the wiring route searching section outputs the present layer structure to an output device. By this means, it becomes possible to estimate a layer structure and the number of layers.
摘要翻译：一种用于估计所需数量的电路板层以在印刷电路板或LSI封装中提供必要布线的装置，包括该装置的系统，方法和用于估计该装置的程序。在该系统中，从引脚位置信息文件和网络列表文件检索安装到每个部件和板上的引脚的位置信息以及引脚之间的连接信息。此外，从网络列表文件检索关于要添加的层的顺序，各层中的通孔的直径和布线的障碍的信息，添加层结构定义文件。此后，存储有关层结构，通孔，禁止布线的区域的信息。布线路径搜索部确定在本结构下是否可能形成必要的布线。当布线路径搜索部确定为不可能时，根据关于添加的层的信息，添加下一顺序的层。随后，布线路径搜索部分再次判断可能性。当确定可能时，布线路径搜索部分将当前层结构输出到输出装置。通过这种方式，可以估计层结构和层数。

4. 发明授权

US07168058B2 Printed circuit wiring board designing support device, printed circuit board designing method, and its program 有权
标题翻译：印刷电路布线板设计支援装置，印刷电路板设计方法及其程序
公开(公告)号：US07168058B2
公开(公告)日：2007-01-23
申请号：US10561195
申请日：2004-06-16
申请人： Takashi Harada , Takahiro Yaguchi , Akira Wakui , Seishi Eya , Shunsuke Fujimoto
发明人： Takashi Harada , Takahiro Yaguchi , Akira Wakui , Seishi Eya , Shunsuke Fujimoto
IPC分类号： G06F17/50
CPC分类号： G06F17/5068 , H05K1/0231 , H05K3/0005 , H05K2201/09309
摘要： A printed circuit wiring board designing support device includes a layout data receiving section receiving printed circuit board layout data through an input/output section, a section for extracting structures of power supply/ground planes, a via hole extracting section for extracting a via hole interconnecting the wirings extending over power supply/ground planes, a capacitor extracting section for extracting a capacitor connected between power supply/ground planes, a distance measuring section for measuring the distance between the via hole and the capacitor, a database where the allowable distance value between the via hole and the capacitor in respect to the distance between the power supply and ground planes is recorded, an examination section for comparing the capacitor/via hole distance with the allowable distance value, and a warning section for issuing a warning when the distance between the via hole and the capacitor is larger than the allowable distance value.
摘要翻译：一种印刷电路布线板设计支援装置，包括布局数据接收部分，通过输入/输出部分接收印刷电路板布局数据，用于提取电源/接地层结构的部分，通孔提取部分，用于提取互连的通孔在电源/接地层上延伸的布线，用于提取连接在电源/接地层之间的电容器的电容器提取部分，用于测量通孔和电容器之间的距离的距离测量部分，记录通孔和电容器相对于电源与接地面之间的距离，用于将电容器/通孔距离与可允许距离值进行比较的检查部分和用于当电容器/通孔距离与接地面之间的距离通孔和电容器大于容许距离值。

5. 发明授权

US06774641B2 Printed circuit board design support apparatus, method, and program 有权
标题翻译：印刷电路板设计支持设备，方法和程序
公开(公告)号：US06774641B2
公开(公告)日：2004-08-10
申请号：US10173007
申请日：2002-06-18
申请人： Hideki Sasaki , Takahiro Yaguchi , Akira Wakui , Seishi Eya , Takashi Harada , Toshihide Kuriyama
发明人： Hideki Sasaki , Takahiro Yaguchi , Akira Wakui , Seishi Eya , Takashi Harada , Toshihide Kuriyama
IPC分类号： G01R2728
CPC分类号： G06F17/5036
摘要： In a printed circuit board design support apparatus for supporting design of a printed circuit board by calculating a radiation amount of electromagnetic radiation caused by an interconnection on the basis of design information related to each of the printed circuit board having a ground plane, interconnections formed on the printed circuit board, and components to be mounted on the printed circuit board, an arithmetic unit calculates a common mode (CM) radiation amount of the interconnection on the basis of a CM radiation amount ratio that indicates a ratio of a common mode (CM) radiation amount of electromagnetic radiation caused by the ground plane in correspondence with the interconnection to a differential mode (DM) radiation amount of electromagnetic radiation caused by the interconnection. A printed circuit board design support method and program are also disclosed.
摘要翻译：在印刷电路板设计支持装置中，用于通过基于与具有接地平面的印刷电路板相关的设计信息计算由互连引起的电磁辐射的辐射量来支持印刷电路板的设计，在印刷电路板和要安装在印刷电路板上的部件，运算单元基于指示共模（CM）的比率的CM辐射量比率来计算互连的共模（CM）辐射量）由与互连造成的电磁辐射辐射量对应于由互连造成的电磁辐射的差分模式（DM）辐射量的对应。还公开了印刷电路板设计支持方法和程序。

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