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    • 1. 发明授权
    • Multi-wire saw
    • 多线锯
    • US07306508B2
    • 2007-12-11
    • US10540020
    • 2004-10-22
    • Takafumi KawasakiHirozoh TsurutaHirokazu NishidaSeiichi MimuraMasayuki HamayasuHisashi Tominaga
    • Takafumi KawasakiHirozoh TsurutaHirokazu NishidaSeiichi MimuraMasayuki HamayasuHisashi Tominaga
    • B24B49/00B28D1/06
    • B28D5/007B24B27/0633B28D5/045H01L21/304Y02P70/179
    • A multi-wire saw according to the present invention cuts a workpiece while supplying a slurry containing an alkali or mixed acid to a cutting interface between the workpiece and a wire, and includes: a storage tank with a heating mechanism for storing and heating the slurry; a thermal insulating pipe for transporting the slurry sent with a pump from the storage tank with a heating mechanism to a position before a position where the wire is incorporated into the workpiece, while keeping the slurry at a predetermined temperature; a thermostat for keeping a temperature in a vicinity of the workpiece fixed to a stage at the predetermined temperature; and a wire heating mechanism for heating the wire to the predetermined temperature. Consequently, the cutting resistance decreases during cutting machining of a silicon ingot, and the variation in the cutting resistance also decreases, whereby a high-quality wafer can be obtained at a high efficiency and a low cost.
    • 根据本发明的多线锯在将含有碱或混合酸的浆料供给到工件和线材之间的切割界面的同时切割工件,并且包括:具有用于储存和加热浆料的加热机构的储罐 ; 绝热管,用于将具有加热机构的从所述储存罐输送的浆料输送到所述线材并入所述工件的位置之前,同时将所述浆料保持在预定温度; 用于将工件附近的温度固定在预定温度的台上的恒温器; 以及用于将线材加热到预定温度的线材加热机构。 因此,在硅锭的切割加工期间切削阻力降低,并且切削阻力的变化也降低,从而可以以高效率和低成本获得高质量的晶片。
    • 2. 发明申请
    • Multi-wire saw
    • 多线锯
    • US20060249134A1
    • 2006-11-09
    • US10540020
    • 2004-10-22
    • Takafumi KawasakiHirozoh TsurutaHirokazu NishidaSeiichi MimuraMasayuki HamayasuHisashi Tominaga
    • Takafumi KawasakiHirozoh TsurutaHirokazu NishidaSeiichi MimuraMasayuki HamayasuHisashi Tominaga
    • B28D1/08
    • B28D5/007B24B27/0633B28D5/045H01L21/304Y02P70/179
    • A multi-wire saw according to the present invention cuts a workpiece while supplying a slurry containing an alkali or mixed acid to a cutting interface between the workpiece and a wire, and includes: a storage tank with a heating mechanism for storing and heating the slurry; a thermal insulating pipe for transporting the slurry sent with a pump from the storage tank with a heating mechanism to a position before a position where the wire is incorporated into the workpiece, while keeping the slurry at a predetermined temperature; a thermostat for keeping a temperature in a vicinity of the workpiece fixed to a stage at the predetermined temperature; and a wire heating mechanism for heating the wire to the predetermined temperature. Consequently, the cutting resistance decreases during cutting machining of a silicon ingot, and the variation in the cutting resistance also decreases, whereby a high-quality wafer can be obtained at a high efficiency and a low cost.
    • 根据本发明的多线锯在将含有碱或混合酸的浆料供给到工件和线材之间的切割界面的同时切割工件,并且包括:具有用于储存和加热浆料的加热机构的储罐 ; 绝热管,用于将具有加热机构的从所述储存罐输送的浆料输送到所述线材并入所述工件的位置之前,同时将所述浆料保持在预定温度; 用于将工件附近的温度固定在预定温度的台上的恒温器; 以及用于将线材加热到预定温度的线材加热机构。 因此,在硅锭的切割加工期间切削阻力降低,并且切削阻力的变化也降低,从而可以以高效率和低成本获得高质量的晶片。