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    • 6. 发明授权
    • Method for handling a thin substrate and for substrate capping
    • 处理薄基板和基板封盖的方法
    • US09266724B2
    • 2016-02-23
    • US14330210
    • 2014-07-14
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Kuei-Sung ChangYi Heng Tsai
    • B81C1/00H01L21/683
    • B81C1/00539B81C1/00269B81C1/00634B81C2201/0194B81C2203/0127H01L21/6835H01L2221/68318H01L2221/68331H01L2221/68381
    • An embodiment is a method for bonding. The method comprises bonding a handle substrate to a capping substrate; thinning the capping substrate; etching the capping substrate; and after the thinning and the etching the capping substrate, bonding the capping substrate to an active substrate. The handle substrate has an opening therethrough. The method also comprises removing the handle substrate from the capping substrate. The removing comprises providing an etchant through the opening to separate the handle substrate from the capping substrate. Other embodiments further include forming a bonding material on a surface of at least one of the handle substrate and the capping substrate such that the capping substrate is bonded to the handle substrate by the bonding material. The bonding material may be removed by using a dry etching to remove the handle substrate from the capping substrate.
    • 实施例是一种粘合方法。 该方法包括将手柄基板粘合到封盖基板上; 减薄封盖基板; 蚀刻封盖基板; 并且在减薄和蚀刻封盖衬底之后,将覆盖衬底粘合到活性衬底上。 手柄基板具有穿过其中的开口。 该方法还包括从封盖基板上移除手柄基板。 除去包括通过开口提供蚀刻剂以将手柄衬底与封盖衬底分离。 其他实施例还包括在手柄基板和封盖基板中的至少一个的表面上形成接合材料,使得封盖基板通过接合材料结合到手柄基板。 可以通过使用干法蚀刻来去除接合材料以从封盖基板去除手柄基板。