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1. 发明申请

US20200126938A1 3D Packages and Methods for Forming the Same 审中-公开
公开(公告)号：US20200126938A1
公开(公告)日：2020-04-23
申请号：US16716811
申请日：2019-12-17
申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
发明人： Shang-Yun Hou , Sao-Ling Chiu , Ping-Kang Huang , Wen-Hsin Wei , Wen-Chih Chiou , Shin-Puu Jeng , Bruce C.S. Chou
IPC分类号： H01L23/00 , H01L23/522 , H01L23/31 , H01L21/56 , H01L21/306 , H01L21/304 , H01L23/498 , H01L21/44 , H01L25/00
摘要： Embodiments of the present disclosure include a semiconductor device and methods of forming a semiconductor device. An embodiment is a method of forming a semiconductor device, the method comprising forming a conductive pad in a first substrate, forming an interconnecting structure over the conductive pad and the first substrate, the interconnecting structure comprising a plurality of metal layers disposed in a plurality of dielectric layers, bonding a die to a first side of the interconnecting structure, and etching the first substrate from a second side of the interconnecting structure, the etching exposing a portion of the conductive pad.

2. 发明授权

US10164133B2 Image sensor device and method 有权
公开(公告)号：US10164133B2
公开(公告)日：2018-12-25
申请号：US15664588
申请日：2017-07-31
申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
发明人： Kuo-Chin Huang , Tzu-Jui Wang , Szu-Ying Chen , Dun-Nian Yaung , Jen-Cheng Liu , Bruce C.S. Chou , Jung-Kuo Tu , Cheng-Chieh Hsieh
IPC分类号： H01L31/024 , H01L27/146 , H01L31/02
摘要： A system and method for blocking heat from reaching an image sensor in a three dimensional stack with a semiconductor device. In an embodiment a heat sink is formed in a back end of line process either on the semiconductor device or else on the image sensor itself when the image sensor is in a backside illuminated configuration. The heat sink may be a grid in either a single layer or in two layers, a zig-zag pattern, or in an interleaved fingers configuration.

3. 发明申请

US20160035771A1 Image Sensor Device and Method 审中-公开
公开(公告)号：US20160035771A1
公开(公告)日：2016-02-04
申请号：US14880720
申请日：2015-10-12
申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
发明人： Kuo-Chin Huang , Tzu-Jui Wang , Szu-Ying Chen , Dun-Nian Yaung , Jen-Cheng Liu , Bruce C.S. Chou , Jung-Kuo Tu , Cheng-Chieh Hsieh
IPC分类号： H01L27/146 , H01L31/024
CPC分类号： H01L31/024 , H01L27/14618 , H01L27/14634 , H01L27/14636 , H01L27/14645 , H01L27/14689 , H01L27/1469 , H01L31/02019 , H01L2224/45144 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： A system and method for blocking heat from reaching an image sensor in a three dimensional stack with a semiconductor device. In an embodiment a heat sink is formed in a back end of line process either on the semiconductor device or else on the image sensor itself when the image sensor is in a backside illuminated configuration. The heat sink may be a grid in either a single layer or in two layers, a zig-zag pattern, or in an interleaved fingers configuration.

4. 发明申请

US20140264948A1 Air Trench in Packages Incorporating Hybrid Bonding 有权
标题翻译：封装中的空气沟槽并入混合接合
公开(公告)号：US20140264948A1
公开(公告)日：2014-09-18
申请号：US13895122
申请日：2013-05-15
申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
发明人： Bruce C.S. Chou , Chen-Jong Wang , Ping-Yin Liu , Jung-Kuo Tu , Tsung-Te Chou , Xin-Hua Huang , Xin-Chung Kuang , Lan-Lin Chao , Chia-Shiung Tsai , Xiaomeng Chen
IPC分类号： H01L23/498 , H01L23/00
CPC分类号： H01L24/80 , H01L21/3081 , H01L21/764 , H01L23/498 , H01L23/5226 , H01L23/53204 , H01L23/53228 , H01L23/5329 , H01L23/53295 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/08 , H01L24/09 , H01L24/83 , H01L24/93 , H01L25/0657 , H01L25/50 , H01L2224/03845 , H01L2224/05554 , H01L2224/05571 , H01L2224/05647 , H01L2224/0601 , H01L2224/08147 , H01L2224/0901 , H01L2224/80895 , H01L2224/80896 , H01L2225/06524 , H01L2924/00011 , H01L2924/01322 , H01L2924/351 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2224/81805
摘要： A package component includes a surface dielectric layer including a planar top surface, a metal pad in the surface dielectric layer and including a second planar top surface level with the planar top surface, and an air trench on a side of the metal pad. The sidewall of the metal pad is exposed to the air trench.
摘要翻译：封装部件包括表面电介质层，其包括平面顶表面，表面电介质层中的金属焊盘，并且包括具有平坦顶表面的第二平面顶表面水平面和在金属焊盘一侧的空气沟槽。金属垫的侧壁暴露于空气沟槽。

5. 发明申请

US20140213008A1 Capacitive Sensors and Methods for Forming the Same 审中-公开
标题翻译：电容式传感器及其形成方法
公开(公告)号：US20140213008A1
公开(公告)日：2014-07-31
申请号：US14244029
申请日：2014-04-03
申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
发明人： Bruce C.S. Chou , Jung-Kuo Tu , Chen-Chih Fan
IPC分类号： B81C1/00
CPC分类号： B81C1/00158 , B81C1/00301 , G01P15/125 , H01G5/18 , H01L28/60
摘要： A device includes a semiconductor substrate, and a capacitive sensor having a back-plate, wherein the back-plate forms a first capacitor plate of the capacitive sensor. The back-plate is a portion of the semiconductor substrate. A conductive membrane is spaced apart from the semiconductor substrate by an air-gap. A capacitance of the capacitive sensor is configured to change in response to a movement of the polysilicon membrane.
摘要翻译：一种器件包括半导体衬底和具有背板的电容传感器，其中所述背板形成所述电容式传感器的第一电容器板。背板是半导体衬底的一部分。导电膜通过气隙与半导体衬底间隔开。电容传感器的电容被配置成响应于多晶硅膜的移动而改变。

6. 发明申请

US20130307095A1 Composite Wafer Semiconductor 有权
标题翻译：复合晶片半导体
公开(公告)号：US20130307095A1
公开(公告)日：2013-11-21
申请号：US13957875
申请日：2013-08-02
申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
发明人： Bruce C.S. Chou
IPC分类号： B81B7/00
CPC分类号： B81B7/0032 , B81B2201/025 , B81C1/00246 , B81C2203/0109 , B81C2203/0714 , H01L2224/83805
摘要： A composite wafer semiconductor device includes a first wafer and a second wafer. The first wafer has a first side and a second side, and the second side is substantially opposite the first side. The composite wafer semiconductor device also includes an isolation set is formed on the first side of the first wafer and a free space is etched in the isolation set. The second wafer is bonded to the isolation set. A floating structure, such as an inertia sensing device, is formed in the second wafer over the free space. In an embodiment, a surface mount pad is formed on the second side of the first wafer. Then, the floating structure is electrically coupled to the surface mount pad using a through silicon via (TSV) conductor.
摘要翻译：复合晶片半导体器件包括第一晶片和第二晶片。第一晶片具有第一侧和第二侧，第二侧基本上与第一侧相对。复合晶片半导体器件还包括在第一晶片的第一侧上形成隔离组件，并且在隔离组件中蚀刻自由空间。第二个晶片结合到隔离组件上。在自由空间中的第二晶片中形成诸如惯性感测装置的浮动结构。在一个实施例中，表面安装焊盘形成在第一晶片的第二侧上。然后，使用硅通孔（TSV）导体将浮动结构电耦合到表面安装焊盘。

7. 发明申请

US20160233347A1 Image Sensor Device and Method 审中-公开
标题翻译：图像传感器装置及方法
公开(公告)号：US20160233347A1
公开(公告)日：2016-08-11
申请号：US15131207
申请日：2016-04-18
申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
发明人： Kuo-Chin Huang , Tzu-Jui Wang , Szu-Ying Chen , Dun-Nian Yaung , Jen-Cheng Liu , Bruce C.S. Chou , Jung-Kuo Tu , Cheng-Chieh Hsieh
IPC分类号： H01L31/024 , H01L27/146
CPC分类号： H01L31/024 , H01L27/14618 , H01L27/14634 , H01L27/14636 , H01L27/14645 , H01L27/14689 , H01L27/1469 , H01L31/02019 , H01L2224/45144 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： A system and method for blocking heat from reaching an image sensor in a three dimensional stack with a semiconductor device. In an embodiment a heat sink is formed in a back end of line process either on the semiconductor device or else on the image sensor itself when the image sensor is in a backside illuminated configuration. The heat sink may be a grid in either a single layer or in two layers, a zig-zag pattern, or in an interleaved fingers configuration.
摘要翻译：一种用于阻挡热量到达具有半导体器件的三维堆叠中的图像传感器的系统和方法。在一个实施例中，当图像传感器处于背面照明配置时，在半导体器件上或者在图像传感器本身上的线后处理中形成散热器。散热器可以是单层或两层，锯齿形图案或交错手指配置中的网格。

8. 发明申请

US20140306341A1 3D Packages and Methods for Forming the Same 审中-公开
标题翻译： 3D封装及其形成方法
公开(公告)号：US20140306341A1
公开(公告)日：2014-10-16
申请号：US14315042
申请日：2014-06-25
申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
发明人： Shang-Yun Hou , Sao-Ling Chiu , Ping-Kang Huang , Wen Hsin Wei , Wen-Chih Chiou , Shin-Puu Jeng , Bruce C.S. Chou
IPC分类号： H01L23/498 , H01L23/522
CPC分类号： H01L24/17 , H01L21/304 , H01L21/30604 , H01L21/44 , H01L21/565 , H01L23/3107 , H01L23/49811 , H01L23/522 , H01L23/5226 , H01L24/03 , H01L24/09 , H01L24/11 , H01L24/81 , H01L25/50 , H01L2224/0382 , H01L2224/0401 , H01L2224/05026 , H01L2224/05111 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/1182 , H01L2224/13 , H01L2224/16113 , H01L2224/16227 , H01L2224/73204 , H01L2224/81815 , H01L2224/97 , H01L2924/0002 , H01L2924/181 , H01L2924/00
摘要： Embodiments of the present disclosure include a semiconductor device and methods of forming a semiconductor device. An embodiment is a method of forming a semiconductor device, the method comprising forming a conductive pad in a first substrate, forming an interconnecting structure over the conductive pad and the first substrate, the interconnecting structure comprising a plurality of metal layers disposed in a plurality of dielectric layers, bonding a die to a first side of the interconnecting structure, and etching the first substrate from a second side of the interconnecting structure, the etching exposing a portion of the conductive pad.
摘要翻译：本公开的实施例包括半导体器件和形成半导体器件的方法。一个实施例是一种形成半导体器件的方法，所述方法包括在第一衬底中形成导电焊盘，在导电焊盘和第一衬底之上形成互连结构，所述互连结构包括多个设置在多个介电层，将管芯连接到互连结构的第一侧，并且从互连结构的第二侧蚀刻第一衬底，蚀刻暴露导电焊盘的一部分。

9. 发明申请

US20140217604A1 Package Structure and Methods of Forming Same 有权
标题翻译：包装结构和形成方法相同
公开(公告)号：US20140217604A1
公开(公告)日：2014-08-07
申请号：US13758665
申请日：2013-02-04
申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
发明人： Bruce C.S. Chou , Chih-Hsien Lin , Hsiang-Tai Lu , Jung-Kuo Tu , Tung-Hung Hsieh , Chen-Hua Lin , Mingo Liu
IPC分类号： H01L23/48 , H01L23/00
CPC分类号： H01L21/56 , H01L21/486 , H01L21/563 , H01L21/76898 , H01L23/147 , H01L23/3135 , H01L23/3185 , H01L23/49811 , H01L23/49827 , H01L23/5389 , H01L24/05 , H01L24/11 , H01L24/16 , H01L24/19 , H01L24/20 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/85 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/131 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13184 , H01L2224/16225 , H01L2224/16235 , H01L2224/2101 , H01L2224/214 , H01L2224/215 , H01L2224/2919 , H01L2224/32225 , H01L2224/48091 , H01L2224/73204 , H01L2224/73265 , H01L2224/81193 , H01L2224/81424 , H01L2224/81444 , H01L2224/81447 , H01L2224/81815 , H01L2224/81895 , H01L2224/82101 , H01L2224/83104 , H01L2224/85 , H01L2225/06513 , H01L2924/00014 , H01L2924/01322 , H01L2924/12042 , H01L2924/1431 , H01L2924/1434 , H01L2924/15192 , H01L2924/1531 , H01L2924/181 , H01L2924/18161 , H01L2924/19107 , H01L2924/00012 , H01L2224/16145 , H01L2224/32145 , H01L2924/014 , H01L2924/01029 , H01L2924/01013 , H01L2924/01047 , H01L2924/01079 , H01L2924/01074 , H01L2924/01028 , H01L2924/00 , H01L2224/45099
摘要： A semiconductor device includes a first die having a first active surface and a first backside surface opposite the first active surface, a second die having a second active surface and a second backside surface opposite the second active surface, and an interposer, the first active surface of the first die being electrically coupled to a first side of the interposer, the second active surface of the second die being electrically coupled to a second side of the interposer. The semiconductor device also includes a first connector over the interposer, a first encapsulating material surrounding the second die, the first encapsulating material having a first surface over the interposer, and a via electrically coupling the first connector and the interposer. A first end of the via is substantially coplanar with the first surface of the first encapsulating material.
摘要翻译：半导体器件包括具有第一有源表面和与第一有源表面相对的第一背面的第一管芯，具有第二有源表面和与第二有源表面相对的第二背面的第二管芯，以及插入件，第一有源表面所述第一管芯电耦合到所述插入件的第一侧，所述第二管芯的所述第二有源表面电连接到所述插入件的第二侧。半导体器件还包括位于插入器上的第一连接器，围绕第二管芯的第一封装材料，第一封装材料具有位于插入件上的第一表面，以及电连接第一连接器和插入件的通孔。通孔的第一端与第一封装材料的第一表面基本共面。

10. 发明申请

US20170069593A1 Air Trench in Packages Incorporating Hybrid Bonding 审中-公开
标题翻译：封装中的空气沟槽并入混合接合
公开(公告)号：US20170069593A1
公开(公告)日：2017-03-09
申请号：US15356887
申请日：2016-11-21
申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
发明人： Bruce C.S. Chou , Chen-Jong Wang , Ping-Yin Liu , Jung-Kuo Tu , Tsung-Te Chou , Xin-Hua Huang , Hsun-Chung Kuang , Lan-Lin Chao , Chia-Shiung Tsai , Xiaomeng Chen
IPC分类号： H01L23/00 , H01L25/00 , H01L25/065
CPC分类号： H01L24/80 , H01L21/3081 , H01L21/764 , H01L23/498 , H01L23/5226 , H01L23/53204 , H01L23/53228 , H01L23/5329 , H01L23/53295 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/08 , H01L24/09 , H01L24/83 , H01L24/93 , H01L25/0657 , H01L25/50 , H01L2224/03845 , H01L2224/05554 , H01L2224/05571 , H01L2224/05647 , H01L2224/0601 , H01L2224/08147 , H01L2224/0901 , H01L2224/80895 , H01L2224/80896 , H01L2225/06524 , H01L2924/00011 , H01L2924/01322 , H01L2924/351 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2224/81805
摘要： A package component includes a surface dielectric layer including a planar top surface, a metal pad in the surface dielectric layer and including a second planar top surface level with the planar top surface, and an air trench on a side of the metal pad. The sidewall of the metal pad is exposed to the air trench.
摘要翻译：封装部件包括表面电介质层，其包括平面顶表面，表面电介质层中的金属焊盘，并且包括具有平坦顶表面的第二平面顶表面水平面和在金属焊盘一侧的空气沟槽。金属垫的侧壁暴露于空气沟槽。

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