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1. 发明申请

US20070164771A1 Apparatus for testing a chip and methods of making and using the same 有权
标题翻译：用于测试芯片的装置及其制造和使用方法
公开(公告)号：US20070164771A1
公开(公告)日：2007-07-19
申请号：US11474108
申请日：2006-06-23
申请人： Tai-Hung Lin , Chih-Ming Chiang , Yi-Hsien Lee , Chi-Ming Lee
发明人： Tai-Hung Lin , Chih-Ming Chiang , Yi-Hsien Lee , Chi-Ming Lee
IPC分类号： G01R31/26
CPC分类号： G01R31/2846
摘要： An apparatus and method for testing an integrated circuit in a target electronic application, wherein the apparatus comprises a socket for receiving the integrated circuit, a modified commercial electronic product which models the target electronic application, and an electrical connection between the socket and the modified commercial electronic product. The method of testing an integrated circuit comprises placing an integrated circuit in a socket that is coupled to a circuit board substantially identical to that of a circuit board configured to include the integrated circuit, but which does not include the integrated circuit, and testing the integrated circuit. A method of making such a tester mechanically attaching a socket to a modified commercial electronic product and electrically connencting an integrated circuit and the modified commercial electronic product. This approach allows for cheaper, more comprehensive, and more accurate testing of an integrated circuit.
摘要翻译：一种用于测试目标电子应用中的集成电路的装置和方法，其中所述装置包括用于接收所述集成电路的插座，对所述目标电子应用进行建模的经修改的商业电子产品以及所述插座与所述经修改的商业广告之间的电连接电子产品。测试集成电路的方法包括将集成电路放置在插座中，该插座耦合到电路板，其基本上与被配置为包括集成电路但不包括集成电路的电路板的电路板相同，并且测试集成电路电路。一种使这种测试器将插座机械地附接到经修改的商业电子产品并且电连接集成电路和改进的商业电子产品的方法。这种方法允许对集成电路进行便宜，更全面和更准确的测试。

2. 发明授权

US07800391B2 Apparatus for testing a chip and methods of making and using the same 有权
标题翻译：用于测试芯片的装置及其制造和使用方法
公开(公告)号：US07800391B2
公开(公告)日：2010-09-21
申请号：US11474108
申请日：2006-06-23
申请人： Tai-Hung Lin , Chih-Ming Chiang , Yi-Hsien Lee , Chi-Ming Lee
发明人： Tai-Hung Lin , Chih-Ming Chiang , Yi-Hsien Lee , Chi-Ming Lee
IPC分类号： G01R31/26
CPC分类号： G01R31/2846
摘要： An apparatus and method for testing an integrated circuit in a target electronic application, wherein the apparatus includes a socket for receiving the integrated circuit, a modified commercial electronic product which models the target electronic application, and an electrical connection between the socket and the modified commercial electronic product. The method of testing an integrated circuit includes placing an integrated circuit in a socket that is coupled to a circuit board substantially identical to that of a circuit board configured to include the integrated circuit, but which does not include the integrated circuit, and testing the integrated circuit. A method of making such a tester mechanically attaching a socket to a modified commercial electronic product and electrically connecting an integrated circuit and the modified commercial electronic product. This approach allows for cheaper, more comprehensive, and more accurate testing of an integrated circuit.
摘要翻译：一种用于测试目标电子应用中的集成电路的装置和方法，其中所述装置包括用于接收所述集成电路的插座，对所述目标电子应用进行建模的经修改的商业电子产品以及所述插座与所述经修改的商业之间的电连接电子产品。测试集成电路的方法包括将集成电路放置在插座中，该插座耦合到电路板，其基本上与被配置为包括集成电路但不包括集成电路的电路板的电路板相同，并且测试集成电路电路。一种使这种测试器将插座机械地连接到改进的商业电子产品并电连接集成电路和改进的商业电子产品的方法。这种方法允许对集成电路进行便宜，更全面和更准确的测试。

3. 发明申请

US20120248606A1 INTEGRATED CIRCUIT DEVICE 有权
标题翻译：集成电路设备
公开(公告)号：US20120248606A1
公开(公告)日：2012-10-04
申请号：US13423264
申请日：2012-03-18
申请人： Tai-Hung Lin , Chang-Tien Tsai
发明人： Tai-Hung Lin , Chang-Tien Tsai
IPC分类号： H01L23/49 , H01L23/488
CPC分类号： H01L24/05 , H01L23/49 , H01L23/60 , H01L24/06 , H01L24/42 , H01L24/45 , H01L24/48 , H01L27/0248 , H01L2224/02166 , H01L2224/04042 , H01L2224/05095 , H01L2224/05124 , H01L2224/05147 , H01L2224/05553 , H01L2224/05624 , H01L2224/05647 , H01L2224/45015 , H01L2224/451 , H01L2224/48091 , H01L2224/4813 , H01L2224/48465 , H01L2924/00014 , H01L2924/01029 , H01L2924/2064 , H01L2924/00 , H01L2924/00015 , H01L2224/43
摘要： An integrated circuit device including a substrate, a first internal bonding pad, a second internal bonding pad, an external bonding pad and a bonding wire is provided. A first circuit, a second circuit, at least one interconnect line and an electrostatic discharge protection circuit are embedded in the substrate. The first internal bonding pad is disposed on a surface of the substrate and electrically connected to the first circuit. The second internal bonding pad is disposed on the surface of the substrate and electrically connected to the second circuit. The first internal bonding pad is electrically connected to the second internal bonding pad via the bonding wire. The first internal bonding pad is electrically connected to the electrostatic discharge protection circuit via the interconnect line. The electrostatic discharge protection circuit is electrically connected to the external bonding pad which is used for electrically connecting an external package lead.
摘要翻译：提供一种集成电路装置，包括基板，第一内部接合焊盘，第二内部焊盘，外部焊盘和接合线。第一电路，第二电路，至少一个互连线和静电放电保护电路嵌入在基板中。第一内部接合焊盘设置在基板的表面上并电连接到第一电路。第二内部接合焊盘设置在基板的表面上并电连接到第二电路。第一内部接合焊盘经由接合线电连接到第二内部接合焊盘。第一内部接合焊盘经由互连线电连接到静电放电保护电路。静电放电保护电路电连接到用于电连接外部封装引线的外部焊盘。

4. 发明授权

US07888611B2 Limit switch control device 有权
标题翻译：限位开关控制装置
公开(公告)号：US07888611B2
公开(公告)日：2011-02-15
申请号：US12164054
申请日：2008-06-29
申请人： Tai-Hung Lin
发明人： Tai-Hung Lin
IPC分类号： H01H3/16
CPC分类号： H01H19/18 , Y10T307/74 , Y10T307/826
摘要： A limit switch control device comprises a shaft, a sensor, an upper limit reed switch, a lower limit reed switch and a drive element that cooperate with a control circuit. The sensor is combined on the shaft which is driven by the drive element, which is provided with an upper limit witch and a lower limit switch, so that when the sensor detects the upper limit and the lower limit reed switches, the upper and the lower limit switches will be triggered to power off the drive element.
摘要翻译：限位开关控制装置包括与控制电路配合的轴，传感器，上限簧片开关，下限簧片开关和驱动元件。传感器组合在由驱动元件驱动的轴上，该驱动元件设置有上限和下限开关，使得当传感器检测到上限和下限簧片开关时，上部和下部将触发限位开关关闭驱动元件的电源。

5. 发明申请

US20080252258A1 Charging Method for a Lead-acid Battery 审中-公开
标题翻译：铅酸蓄电池充电方法
公开(公告)号：US20080252258A1
公开(公告)日：2008-10-16
申请号：US11735064
申请日：2007-04-13
申请人： Tzu-Fen CHANG , Tai-Hung Lin
发明人： Tzu-Fen CHANG , Tai-Hung Lin
IPC分类号： H02J7/00
CPC分类号： H02J7/0073 , H01M10/06 , H01M10/44 , H01M10/443 , H02J7/0093
摘要： A charging method for a lead-acid battery allows the lead-acid battery to finish charging within an hour, and keeps the temperature of the lead-acid battery below 40 C. The charging method comprises three important parts, which are charging period, rest period, and discharging period. The three parts cooperate together to achieve an objective that allows the lead-acid battery to finish charging within an hour, and keeps the temperature of the lead-acid battery below 40° C., otherwise the service life of the lead-acid battery will be shortened, and the lead-acid battery will even be destroyed.
摘要翻译：铅酸电池的充电方法允许铅酸电池在一小时内完成充电，并将铅酸蓄电池的温度保持在40℃以下。充电方法包括三个重要部分，即充电周期，休息时间期间和放电期间。三部分配合在一起，实现了铅酸电池在一小时内完成充电的目标，并将铅酸电池的温度保持在40℃以下，否则铅酸电池的使用寿命将会缩短铅酸蓄电池甚至会被破坏。

6. 发明授权

US06999010B2 Table look-up method for abstract syntax notation encoding/decoding system 失效
标题翻译：抽象语法符号编码/解码系统的表查找方法
公开(公告)号：US06999010B2
公开(公告)日：2006-02-14
申请号：US10825129
申请日：2004-04-16
申请人： Tai-Hung Lin
发明人： Tai-Hung Lin
IPC分类号： H03M7/00
CPC分类号： G06F17/272
摘要： A table look-up method for ASN.1 encoding/decoding systems is disclosed. Once the invention receives input data, it adds a specified index to the received data, then it analyzes whether the received data contains explicit reference data, implicit reference data or optional data. The invention further modifies the specified index of explicit, implicit or optional data. It compares the consistency of the modified specified index with the specified index in a reference table; if it is consistent, it declares the input data being fully decoded. The conventional method has four main steps: (1). Updating definition data. (2). Executing program generator. (3). Redoing encoding and decoding. (4). Applying new function. This invention simplifies the method into two main steps: (1). Updating definition data. (2). Applying new function. Furthermore, this method does not need to modify program for encoding/decoding a file. This method simplifies the conventional flow process for handling the tabulated data file.
摘要翻译：公开了一种用于ASN.1编码/解码系统的表查找方法。一旦本发明接收到输入数据，就向接收到的数据添加指定的索引，然后分析接收到的数据是否包含显式参考数据，隐含参考数据或可选数据。本发明进一步修改指定的显式，隐式或可选数据索引。它将修改后的指定索引的一致性与引用表中的指定索引进行比较; 如果它是一致的，它声明输入数据被完全解码。传统方法有四个主要步骤：（1）。更新定义数据。（2）。执行程序生成器（3）。重新编码和解码。（4）。应用新功能本发明将方法简化为两个主要步骤：（1）。更新定义数据。（2）。应用新功能此外，该方法不需要修改用于对文件进行编码/解码的程序。该方法简化了处理列表数据文件的常规流程。

7. 发明申请

US20050231400A1 Table look-up method for abstract syntax notation encoding/decoding system 失效
标题翻译：抽象语法符号编码/解码系统的表查找方法
公开(公告)号：US20050231400A1
公开(公告)日：2005-10-20
申请号：US10825129
申请日：2004-04-16
申请人： Tai-Hung Lin
发明人： Tai-Hung Lin
IPC分类号： G06F17/27 , H03M7/00
CPC分类号： G06F17/272
摘要： A table look-up method for ASN.1 encoding/decoding systems is disclosed. Once the invention receives input data, it adds a specified index to the received data, then it analyzes whether the received data contains explicit reference data, implicit reference data or optional data. The invention further modifies the specified index of explicit, implicit or optional data. It compares the consistency of the modified specified index with the specified index in a reference table; if it is consistent, it declares the input data being fully decoded. The conventional method has four main steps: (1). Updating definition data. (2). Executing program generator. (3). Redoing encoding and decoding. (4). Applying new function. This invention simplifies the method into two main steps: (1). Updating definition data. (2). Applying new function. Furthermore, this method does not need to modify program for encoding/decoding a file. This method simplifies the conventional flow process for handling the tabulated data file.
摘要翻译：公开了一种用于ASN.1编码/解码系统的表查找方法。一旦本发明接收到输入数据，就向接收到的数据添加指定的索引，然后分析接收到的数据是否包含显式参考数据，隐含参考数据或可选数据。本发明进一步修改指定的显式，隐式或可选数据索引。它将修改后的指定索引的一致性与引用表中的指定索引进行比较; 如果它是一致的，它声明输入数据被完全解码。常规方法有四个主要步骤：（1）。更新定义数据。（2）。执行程序生成器（3）。重新编码和解码。（4）。应用新功能本发明将方法简化为两个主要步骤：（1）。更新定义数据。（2）。应用新功能此外，该方法不需要修改用于对文件进行编码/解码的程序。该方法简化了处理列表数据文件的常规流程。

8. 发明授权

US08618660B2 Integrated circuit device 有权
标题翻译：集成电路器件
公开(公告)号：US08618660B2
公开(公告)日：2013-12-31
申请号：US13423264
申请日：2012-03-18
申请人： Tai-Hung Lin , Chang-Tien Tsai
发明人： Tai-Hung Lin , Chang-Tien Tsai
IPC分类号： H01L23/49
CPC分类号： H01L24/05 , H01L23/49 , H01L23/60 , H01L24/06 , H01L24/42 , H01L24/45 , H01L24/48 , H01L27/0248 , H01L2224/02166 , H01L2224/04042 , H01L2224/05095 , H01L2224/05124 , H01L2224/05147 , H01L2224/05553 , H01L2224/05624 , H01L2224/05647 , H01L2224/45015 , H01L2224/451 , H01L2224/48091 , H01L2224/4813 , H01L2224/48465 , H01L2924/00014 , H01L2924/01029 , H01L2924/2064 , H01L2924/00 , H01L2924/00015 , H01L2224/43
摘要： An integrated circuit device including a substrate, a first internal bonding pad, a second internal bonding pad, an external bonding pad and a bonding wire is provided. A first circuit, a second circuit, at least one interconnect line and an electrostatic discharge protection circuit are embedded in the substrate. The first internal bonding pad is disposed on a surface of the substrate and electrically connected to the first circuit. The second internal bonding pad is disposed on the surface of the substrate and electrically connected to the second circuit. The first internal bonding pad is electrically connected to the second internal bonding pad via the bonding wire. The first internal bonding pad is electrically connected to the electrostatic discharge protection circuit via the interconnect line. The electrostatic discharge protection circuit is electrically connected to the external bonding pad which is used for electrically connecting an external package lead.
摘要翻译：提供一种集成电路装置，包括基板，第一内部接合焊盘，第二内部焊盘，外部焊盘和接合线。第一电路，第二电路，至少一个互连线和静电放电保护电路嵌入在基板中。第一内部接合焊盘设置在基板的表面上并电连接到第一电路。第二内部接合焊盘设置在基板的表面上并电连接到第二电路。第一内部接合焊盘经由接合线电连接到第二内部接合焊盘。第一内部接合焊盘经由互连线电连接到静电放电保护电路。静电放电保护电路电连接到用于电连接外部封装引线的外部焊盘。

9. 发明授权

US08448540B2 Assembling mechanism of a self-locking linear actuator 有权
标题翻译：自锁线性执行器的组装机构
公开(公告)号：US08448540B2
公开(公告)日：2013-05-28
申请号：US12631971
申请日：2009-12-07
申请人： Hsin-An Chiang , Tung-Hsin Chen , Tai-Hung Lin , Shih-Yuan Tseng , Kuo-En Tseng
发明人： Hsin-An Chiang , Tung-Hsin Chen , Tai-Hung Lin , Shih-Yuan Tseng , Kuo-En Tseng
IPC分类号： F16H25/20 , F16H57/02
CPC分类号： F16H25/20 , F16H2025/2031 , F16H2025/2084 , F16H2025/209 , Y10T74/18568 , Y10T74/18576 , Y10T74/18672 , Y10T74/18688 , Y10T74/2186
摘要： An assembling mechanism of a self-locking linear actuator includes a gearbox, a one-piece rear retainer seat and a casing. The gearbox is composed of two half pieces, which are mated with each other for accommodating and locating a transmission mechanism of the actuator. The rear retainer seat is fixedly held in the gearbox for supporting a bearing of a threaded rod of the transmission mechanism and bearing the stress from the threaded rod. The contact faces of the rear retainer seat and the gearbox are regular polygonal to facilitate adjustment of fixing angle of the rear retainer seat. The casing is composed of two half casings, which are mated with each other to accommodate the transmission mechanism, the gearbox and the rear retainer seat. The mating faces of the half casings are parallel to the axis of the output shaft of a motor to facilitate connection operation of the casing.
摘要翻译：自锁线性致动器的组装机构包括齿轮箱，一体式后保持器座和外壳。齿轮箱由两个半部构成，彼此配合以容纳和定位致动器的传动机构。后保持器座固定地保持在齿轮箱中，用于支撑传动机构的螺杆的轴承并承受来自螺杆的应力。后保持器座和齿轮箱的接触面是规则的多边形，以便于调整后保持器座的固定角度。壳体由两个半壳体组成，彼此配合以容纳传动机构，齿轮箱和后保持器座。半壳体的配合面平行于电动机的输出轴的轴线，以便于壳体的连接操作。

10. 发明申请

US20130049192A1 STACKED CHIP PACKAGE AND FABRICATION METHOD THEREOF 审中-公开
标题翻译：堆叠芯片包装及其制造方法
公开(公告)号：US20130049192A1
公开(公告)日：2013-02-28
申请号：US13591225
申请日：2012-08-22
申请人： Hong-Dyi Chang , Tai-Hung Lin
发明人： Hong-Dyi Chang , Tai-Hung Lin
IPC分类号： H01L23/48 , H01L21/60
CPC分类号： H01L24/05 , H01L23/525 , H01L24/13 , H01L24/14 , H01L25/0657 , H01L2224/02372 , H01L2224/02377 , H01L2224/0401 , H01L2224/05548 , H01L2224/131 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/16145 , H01L2924/15788 , H01L2924/00014 , H01L2924/014 , H01L2924/00
摘要： A semiconductor package for a stacked chip includes a first semiconductor chip, comprising a metal layer; a through-silicon-via, penetrating a top surface of the first semiconductor chip and electrically connected to the metal layer; a redistribution layer, formed on the top surface of the first semiconductor chip, and electrically connected to the through-silicon-via; and a second semiconductor chip, disposed on the first semiconductor chip and electrically connected to the first semiconductor chip via the redistribution layer.
摘要翻译：一种用于堆叠芯片的半导体封装包括：第一半导体芯片，包括金属层; 穿透硅通孔，穿透第一半导体芯片的顶表面并电连接到金属层; 再分布层，形成在第一半导体芯片的顶表面上，并且电连接到穿硅通孔; 以及第二半导体芯片，设置在所述第一半导体芯片上，并且经由所述再分配层与所述第一半导体芯片电连接。

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