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1. 发明授权

US07121934B2 Carrier head for chemical mechanical polishing apparatus 有权
标题翻译：化学机械抛光装置用载体头
公开(公告)号：US07121934B2
公开(公告)日：2006-10-17
申请号：US11133148
申请日：2005-05-18
申请人： Taek-Soo Jung
发明人： Taek-Soo Jung
IPC分类号： B24B29/00
CPC分类号： B24B37/30 , B24B37/0053
摘要： Disclosed is a carrier head of a chemical mechanical polishing apparatus for planarizing a semiconductor wafer. An adjustment chamber is provided in a space section formed between a membrane lower holder and a membrane upper holder of a wafer support assembly. Pressure applied to the adjustment chamber is transferred to a rear surface of a membrane during a polishing process through a perforated hole formed at a center of the membrane lower holder. A center portion of the membrane is connected to a vacuum pipe by passing through a hole of the membrane lower holder and the adjustment chamber. Vacuum pressure is directly applied to a wafer so that the wafer is easily attached to the carrier head at lower pressure. Pressure is evenly distributed over the whole area of the wafer so that the wafer is evenly polished.
摘要翻译：公开了一种用于平坦化半导体晶片的化学机械抛光装置的承载头。调节室设置在形成在薄膜下支架和晶片支撑组件的薄膜上支架之间的空间部分中。施加到调节室的压力在抛光过程中通过形成在膜下支架的中心的穿孔而被转移到膜的后表面。膜的中心部分通过膜下部保持器和调节室的孔连接到真空管。将真空压力直接施加到晶片，使得晶片在较低的压力下容易地附接到载体头。压力均匀分布在晶片的整个区域上，从而使晶片均匀抛光。

2. 发明申请

US20050272355A1 Carrier head for chemical mechanical polishing apparatus 有权
标题翻译：化学机械抛光装置用载体头
公开(公告)号：US20050272355A1
公开(公告)日：2005-12-08
申请号：US11133148
申请日：2005-05-18
申请人： Taek-Soo Jung
发明人： Taek-Soo Jung
IPC分类号： H01L21/304 , B24B1/00 , B24B37/04 , B24B41/06 , H01L21/302
CPC分类号： B24B37/30 , B24B37/0053
摘要： Disclosed is a carrier head of a chemical mechanical polishing apparatus for planarizing a semiconductor wafer. An adjustment chamber is provided in a space section formed between a membrane lower holder and a membrane upper holder of a wafer support assembly. Pressure applied to the adjustment chamber is transferred to a rear surface of a membrane during a polishing process through a perforated hole formed at a center of the membrane lower holder. A center portion of the membrane is connected to a vacuum pipe by passing through a hole of the membrane lower holder and the adjustment chamber. Vacuum pressure is directly applied to a wafer so that the wafer is easily attached to the carrier head at lower pressure. Pressure is evenly distributed over the whole area of the wafer so that the wafer is evenly polished.
摘要翻译：公开了一种用于平坦化半导体晶片的化学机械抛光装置的承载头。调节室设置在形成在薄膜下支架和晶片支撑组件的薄膜上支架之间的空间部分中。施加到调节室的压力在抛光过程中通过形成在膜下支架的中心的穿孔而被转移到膜的后表面。膜的中心部分通过膜下部保持器和调节室的孔连接到真空管。将真空压力直接施加到晶片，使得晶片在较低的压力下容易地附接到载体头。压力均匀分布在晶片的整个区域上，从而使晶片均匀抛光。

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