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1. 发明申请

US20120134609A1 Coupling Structure and Method of Bearing For EPS Motor 审中-公开
标题翻译： EPS电机轴承的耦合结构和方法
公开(公告)号：US20120134609A1
公开(公告)日：2012-05-31
申请号：US13307430
申请日：2011-11-30
申请人： Taehwan Kim , Jaejun Eom
发明人： Taehwan Kim , Jaejun Eom
IPC分类号： F16C35/00 , B23P17/00
CPC分类号： H02K5/1732 , F16C35/04 , F16C35/067 , F16C2380/26 , H02K15/14 , Y10T29/49888
摘要： Disclosed is a coupling structure of a bearing for an EPS motor to eliminate a gap caused by a tolerance between the bearing and a pocket of a housing of the EPS motor, thereby improving assembling precision and reducing noise, the coupling structure supporting rotation of a rotating shaft through the bearing coupled to a lower portion of the housing and including a bearing pocket bent upwards from a lower surface of the housing and having a cylindrical space to support an outer circumference of the bearing at an inner wall thereof, whereby a gap between the inner wall of the bearing pocket and the outer circumference of the bearing is eliminated by deforming the inner wall towards an inner circumference thereof by caulking, coupling force between the bearing and the housing can be increased, and thereby reliability in assembly and operation of the motor is improved.
摘要翻译：公开了一种用于EPS电动机的轴承的联接结构，以消除由EPS电动机的壳体的轴承和口袋之间的公差引起的间隙，从而提高组装精度并降低噪音，支撑旋转的联接结构轴通过联接到壳体的下部的轴承，并且包括从壳体的下表面向上弯曲的轴承腔，并且具有用于在其内壁处支撑轴承的外圆周的圆柱形空间，由此在轴承座的内壁和轴承的外周通过铆接而使内壁朝向内周变形而消除，从而可以增加轴承和壳体之间的联接力，从而可以提高电机的组装和运行改进了

2. 发明申请

US20090315840A1 Liquid crystal display 有权
标题翻译：液晶显示器
公开(公告)号：US20090315840A1
公开(公告)日：2009-12-24
申请号：US12318422
申请日：2008-12-29
申请人： Changkeun Park , Suhwan Moon , Minkyung Lee , Deuksu Lee , Taehwan Kim , Miyoung Do , Kyohyuck Choo , Ilho Kim , Shinkwon Park
发明人： Changkeun Park , Suhwan Moon , Minkyung Lee , Deuksu Lee , Taehwan Kim , Miyoung Do , Kyohyuck Choo , Ilho Kim , Shinkwon Park
IPC分类号： G06F3/041
CPC分类号： G06F3/0412 , G02F1/13338 , G02F1/133528 , G06F3/042
摘要： A liquid crystal display is disclosed. The liquid crystal display includes a liquid crystal display panel including a pixel array and touch sensors, a transparent conductive layer on one substrate of the liquid crystal display panel transmitting display light, a polarizing plate on the transparent conductive layer, a driving voltage supply circuit, and a signal transmitting unit electrically connecting the transparent conductive layer to the driving voltage supply circuit. A portion of the transparent conductive layer is connected to a ground level voltage source. The driving voltage supply circuit generates a driving voltage required to perform light sensing operations of the touch sensors during a touch period based on changes in an amount of surface charge of the transparent conductive layer depending on whether or not the polarizing plate is touched.
摘要翻译：公开了一种液晶显示器。液晶显示器包括：液晶显示面板，包括像素阵列和触摸传感器，透明显示面板的液晶显示面板的一个基板上的透明导电层，透明导电层上的偏振片，驱动电压供给电路，以及将透明导电层电连接到驱动电压电路的信号发送单元。透明导电层的一部分连接到地电平电压源。驱动电压供给电路根据是否触摸了偏振片，生成在触摸时段期间，根据透明导电层的表面电荷量的变化，进行触摸传感器的感光操作所需的驱动电压。

3. 发明授权

US08590501B1 Variable intake system and method 失效
标题翻译：可变进气系统和方法
公开(公告)号：US08590501B1
公开(公告)日：2013-11-26
申请号：US12885590
申请日：2010-09-20
申请人： Taehwan Kim , Seunghyun Jang
发明人： Taehwan Kim , Seunghyun Jang
IPC分类号： F02M35/10
CPC分类号： F02B27/0284 , F02B27/0263 , F02D9/16 , Y02T10/146
摘要： An intake manifold assembly is disclosed that utilizes a barrel valve apparatus comprised of segments and connectors. The barrel valve apparatus and its housing component can be tapered and flexible. A protrusion such as a draft can be used to seal the performance of the barrel valve apparatus without a seal. Openings in the barrel valve apparatus can possess an integrated bellmouth shape.
摘要翻译：公开了一种使用由段和连接器组成的桶式阀装置的进气歧管组件。桶形阀装置及其壳体部件可以是锥形和柔性的。可以使用诸如通风的突起来密封没有密封的桶形阀装置的性能。桶形阀装置中的开口可以具有一体式的喇叭形状。

4. 发明申请

US20110206364A1 CAMERA SHUTTER DEVICE AND OPTICAL APPARATUS HAVING THE SAME 审中-公开
标题翻译：相机快门设备和具有该相机的光学设备
公开(公告)号：US20110206364A1
公开(公告)日：2011-08-25
申请号：US13031870
申请日：2011-02-22
申请人： Jinsuk Han , Seungki Kim , Taehwan Kim
发明人： Jinsuk Han , Seungki Kim , Taehwan Kim
IPC分类号： G03B9/14
CPC分类号： G03B9/14 , H02K33/16
摘要： A camera shutter device and an optical apparatus having the same are disclosed. The shutter device includes a core wrapped by a coil, wherein a first distal end and a second distal end of the core are arranged in parallel, and when a voltage is applied to the coil, the first and second distal ends exhibit a mutually opposite polarity with respect to each other. A magnet is arranged with a side facing the first and second distal ends of the core for linearly and reciprocally moving between the first and second distal ends. In addition, a slider opens and closes a shutter blade as the magnet linearly and reciprocally moves. Thus, the driving unit of the core, magnet, and slider can be miniaturized and thinned, and a reciprocatively moving distance of a magnet can he minimally shortened to quicken the opening/shutting operation.
摘要翻译：公开了一种相机快门装置及具有该相机快门装置的光学装置。快门装置包括由线圈包裹的芯，其中芯的第一远端和第二远端平行布置，并且当电压施加到线圈时，第一和第二远端呈现相互相反的极性相对于彼此。磁体被布置成具有面对芯的第一和第二远端的一侧，用于在第一和第二远端之间线性和往复运动。此外，当磁体线性地并且往复移动时，滑块打开和关闭快门叶片。因此，芯，磁体和滑块的驱动单元可以小型化和薄化，并且可以最小限度地缩短磁体的往复移动距离以加快打开/关闭操作。

5. 发明申请

US20110042797A1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：半导体封装及其制造方法
公开(公告)号：US20110042797A1
公开(公告)日：2011-02-24
申请号：US12857928
申请日：2010-08-17
申请人： Ji-hyun Park , Heungkyu Kwon , Min-Ok Na , Taehwan Kim
发明人： Ji-hyun Park , Heungkyu Kwon , Min-Ok Na , Taehwan Kim
IPC分类号： H01L23/00 , H01L23/488 , H01L23/498
CPC分类号： H01L21/56 , H01L21/563 , H01L23/13 , H01L23/3128 , H01L23/3142 , H01L25/0657 , H01L25/105 , H01L2224/16145 , H01L2224/16225 , H01L2224/26175 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83051 , H01L2224/83385 , H01L2225/1023 , H01L2225/1058 , H01L2924/01078 , H01L2924/09701 , H01L2924/15311 , H01L2924/15331 , H01L2924/00
摘要： A semiconductor package includes a substrate having an insulation layer. The insulation layer has a first region having a first surface roughness and a second region having a second surface roughness. A semiconductor chip is mounted in the first region, and an underfill resin solution is filled into the space between the semiconductor chip and the insulation layer. The roughness of the second region prevents the underfill resin from flowing out from the semiconductor chip to thereby reduce a size of the semiconductor package.
摘要翻译：半导体封装包括具有绝缘层的衬底。绝缘层具有第一表面粗糙度的第一区域和具有第二表面粗糙度的第二区域。半导体芯片安装在第一区域中，底部填充树脂溶液填充到半导体芯片和绝缘层之间的空间中。第二区域的粗糙度防止底部填充树脂从半导体芯片流出，从而减小半导体封装的尺寸。

6. 发明申请

US20210149115A1 PHOTONIC WAVELENGTH DIVISION MULTIPLEXING (WDM) RECEIVER WITH POLARIZATION DIVERSITY AND/OR LOW REFLECTANCE 有权
公开(公告)号：US20210149115A1
公开(公告)日：2021-05-20
申请号：US17133347
申请日：2020-12-23
申请人： Duanni Huang , Saeed Fathololoumi , Meer Nazmus Sakib , Mohammad Montazeri Najafabadi , Chaoxuan Ma , David Hui , Taehwan Kim , Ling Liao , Hao Li , Ganesh Balamurugan , Haisheng Rong , Aliasghar Eftekhar
发明人： Duanni Huang , Saeed Fathololoumi , Meer Nazmus Sakib , Mohammad Montazeri Najafabadi , Chaoxuan Ma , David Hui , Taehwan Kim , Ling Liao , Hao Li , Ganesh Balamurugan , Haisheng Rong , Aliasghar Eftekhar
IPC分类号： G02B6/27 , G02B6/26
摘要： The present disclosure is directed to photonic wavelength division multiplexing (WDM) receivers with polarization diversity and/or low reflectance. In embodiments, a WDM receiver is provided with a splitter, a plurality of waveguides and a plurality of photodetectors in series. The waveguides having particular equal path lengths relationship from the splitter to respective ones of the photodetectors. In other embodiments, the WDM receiver is provided with a splitter, a looped waveguide, a plurality of photodetectors, and a plurality of variable optical attenuators (VOAs). The VOAs are configured to suppress reflection of signal beams back to the transmitter. In various embodiments, the WDM receiver is a receiver sub-assembly of a silicon photonic transceiver disposed in a silicon package. Other embodiments may be described and/or claimed.

7. 发明授权

US09843242B2 Anti-separating structure of sensing magnet for EPS motor 有权
公开(公告)号：US09843242B2
公开(公告)日：2017-12-12
申请号：US13552226
申请日：2012-07-18
申请人： Taehwan Kim , Shunghun Woo , Donggeun Chang , Byungyong Kim
发明人： Taehwan Kim , Shunghun Woo , Donggeun Chang , Byungyong Kim
IPC分类号： H02K11/00 , H02K11/215 , H02K29/08 , H02K1/28 , G01D5/20 , G01D5/14 , H02K11/21 , H02K5/22
CPC分类号： H02K11/215 , G01D5/142 , G01D5/20 , H02K1/28 , H02K5/22 , H02K5/225 , H02K11/21 , H02K29/08
摘要： Disclosed is an anti-separating structure of a sensing magnet for EPS motor, the structure being a coupling structure between the sensing magnet and a plate of the EPS motor, the structure including a disk-shaped plate formed with a magnet accommodation unit protrusively formed near at a rotation shaft, a ring-shaped sensing magnet centrally formed with a through hole having a diameter corresponding to the magnet accommodation unit, and magnet grip units each formed at a predetermined gap along a circumferential surface of the magnet accommodation unit.

8. 发明申请

US20160187381A1 SEMICONDUCTOR TEST APPARATUS HAVING POGO PINS COATED WITH CONDUCTION FILMS 有权
标题翻译：具有导电膜的POGO引脚的半导体测试装置
公开(公告)号：US20160187381A1
公开(公告)日：2016-06-30
申请号：US14955545
申请日：2015-12-01
申请人： Sunghoon Jang , Minsuk Choi , Byungho Choi , Taehwan Kim
发明人： Sunghoon Jang , Minsuk Choi , Byungho Choi , Taehwan Kim
IPC分类号： G01R1/067
CPC分类号： G01R1/06722
摘要： A semiconductor test apparatus includes a pogo pin that is provided on a board and is in contact with an inspected object. The pogo pin includes a barrel fixedly disposed on the board, a plunger movably coupled to the barrel, and a conduction film covering the pogo pin. The conduction film contacts a portion of the plunger to be electrically connected to the plunger while being electrically insulated from the barrel.
摘要翻译：半导体测试装置包括设置在板上并与检测对象接触的弹簧销。弹簧销包括固定地设置在板上的筒，可移动地联接到筒的柱塞和覆盖弹簧销的导电膜。导电膜接触柱塞的一部分以与柱塞电绝缘而与柱塞电连接。

9. 发明申请

US20140216698A1 MODULAR COMPOSITE INTERCOOLER 审中-公开
标题翻译：模块化复合介质
公开(公告)号：US20140216698A1
公开(公告)日：2014-08-07
申请号：US14167282
申请日：2014-01-29
申请人： Donald Carbone , Timothy Collins , Jongkyu Kim , Taehwan Kim , Terry Schiefer , Douglas Sehr
发明人： Donald Carbone , Timothy Collins , Jongkyu Kim , Taehwan Kim , Terry Schiefer , Douglas Sehr
IPC分类号： F28F9/00
CPC分类号： F28D7/106 , F28D2021/0082
摘要： A modular heat exchanger assembly comprising: a plurality of interlocking housings each having a heat-exchanging element, a first and second side each having a mating connector and a first end and a second end, wherein the interlocking housings interlock to each other by the second side having a mating connector interlocking with the first side having a mating connector to provide a heat exchanger core, the first end has a plurality of first end mating connector openings and the second end has a plurality of second end mating connector openings; there may be at least one first-type end cap, at least one second-type end cap and/or at least one third-type end cap for connection to either one of the first end mating connector openings or one of the second end mating connector openings and there is at least one access opening.
摘要翻译：一种模块化热交换器组件，包括：多个互锁壳体，每个互锁壳体具有热交换元件，第一和第二侧面各自具有配合连接器以及第一端部和第二端部，其中所述互锁壳体通过第二具有与所述第一侧互锁的配合连接器，所述配合连接器具有配合连接器以提供热交换器芯，所述第一端具有多个第一端配合连接器开口，并且所述第二端具有多个第二端配合连接器开口; 可以存在至少一个第一类型端盖，至少一个第二类型端盖和/或至少一个第三类型端盖，用于连接到第一端配合连接器开口中的任一个或者第二端配合中的一个连接器开口和至少一个进入开口。

10. 发明授权

US08709879B2 Method of forming a semiconductor package 有权
标题翻译：形成半导体封装的方法
公开(公告)号：US08709879B2
公开(公告)日：2014-04-29
申请号：US13835683
申请日：2013-03-15
申请人： Ji-hyun Park , Heungkyu Kwon , Min-Ok Na , Taehwan Kim
发明人： Ji-hyun Park , Heungkyu Kwon , Min-Ok Na , Taehwan Kim
IPC分类号： H01L21/56
CPC分类号： H01L21/56 , H01L21/563 , H01L23/13 , H01L23/3128 , H01L23/3142 , H01L25/0657 , H01L25/105 , H01L2224/16145 , H01L2224/16225 , H01L2224/26175 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83051 , H01L2224/83385 , H01L2225/1023 , H01L2225/1058 , H01L2924/01078 , H01L2924/09701 , H01L2924/15311 , H01L2924/15331 , H01L2924/00
摘要： A semiconductor package includes a substrate having an insulation layer. The insulation layer has a first region having a first surface roughness and a second region having a second surface roughness. A semiconductor chip is mounted in the first region, and an underfill resin solution is filled into the space between the semiconductor chip and the insulation layer. The roughness of the second region prevents the underfill resin from flowing out from the semiconductor chip to thereby reduce a size of the semiconductor package.
摘要翻译：半导体封装包括具有绝缘层的衬底。绝缘层具有第一表面粗糙度的第一区域和具有第二表面粗糙度的第二区域。半导体芯片安装在第一区域中，底部填充树脂溶液填充到半导体芯片和绝缘层之间的空间中。第二区域的粗糙度防止底部填充树脂从半导体芯片流出，从而减小半导体封装的尺寸。

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