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    • 5. 发明授权
    • Semiconductor memory device with vertical channel transistor and method of fabricating the same
    • 具有垂直沟道晶体管的半导体存储器件及其制造方法
    • US07387931B2
    • 2008-06-17
    • US11546581
    • 2006-10-11
    • Hyeoung-won SeoJae-man YoonKang-yoon LeeDong-gun ParkBong-soo KimSeong-goo Kim
    • Hyeoung-won SeoJae-man YoonKang-yoon LeeDong-gun ParkBong-soo KimSeong-goo Kim
    • H01L21/8242H01L21/336
    • H01L29/66666H01L27/0207H01L27/10814H01L27/10823H01L27/10876H01L27/10885H01L27/10891H01L29/7827
    • In a semiconductor memory device having a vertical channel transistor a body of which is connected to a substrate and a method of fabricating the same, the semiconductor memory device includes a semiconductor substrate including a plurality of pillars arranged spaced apart from one another, and each of the pillars includes a body portion and a pair of pillar portions extending from the body portion and spaced apart from each other. A gate electrode is formed to surround each of the pillar portions. A bitline is disposed on the body portion to penetrate a region between a pair of the pillar portions of each of the first pillars arranged to extend in a first direction. A wordline is disposed over the bitline, arranged to extend in a second direction intersecting the first direction, and configured to contact the side surface of the gate electrode. A first doped region is formed in the upper surface of each of the pillar portions of the pillar. A second doped region is formed on the body portion of the pillar and connected electrically to the bitline. Storage node electrodes are connected electrically to the first doped region and disposed on each of the pillar portions.
    • 在具有其主体连接到基板的垂直沟道晶体管的半导体存储器件及其制造方法中,半导体存储器件包括:半导体衬底,其包括彼此间隔布置的多个柱,并且每个 支柱包括主体部分和从主体部分延伸并彼此间隔开的一对柱部分。 形成围绕每个支柱部分的栅电极。 位于所述主体部分上的位线穿过所述第一支柱中的所述第一支柱的一对支柱之间的区域,所述第一支柱布置成沿第一方向延伸。 字线布置在位线之外,布置成沿与第一方向相交的第二方向延伸,并且被配置为接触栅电极的侧表面。 第一掺杂区域形成在柱的每个柱部分的上表面中。 第二掺杂区形成在柱的主体部分上并与电位线连接。 存储节点电极与第一掺杂区域电连接并设置在每个柱部分上。
    • 8. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE WITH VERTICAL CHANNEL TRANSISTOR AND METHOD OF FABRICATING THE SAME
    • 具有垂直通道晶体管的半导体存储器件及其制造方法
    • US20080211013A1
    • 2008-09-04
    • US12118268
    • 2008-05-09
    • Hyeoung-won SeoJae-man YoonKang-yoon LeeDong-gun ParkBong-soo KimSeong-goo Kim
    • Hyeoung-won SeoJae-man YoonKang-yoon LeeDong-gun ParkBong-soo KimSeong-goo Kim
    • H01L29/78
    • H01L29/66666H01L27/0207H01L27/10814H01L27/10823H01L27/10876H01L27/10885H01L27/10891H01L29/7827
    • In a semiconductor memory device having a vertical channel transistor a body of which is connected to a substrate and a method of fabricating the same, the semiconductor memory device includes a semiconductor substrate including a plurality of pillars arranged spaced apart from one another, and each of the pillars includes a body portion and a pair of pillar portions extending from the body portion and spaced apart from each other. A gate electrode is formed to surround each of the pillar portions. A bitline is disposed on the body portion to penetrate a region between a pair of the pillar portions of each of the first pillars arranged to extend in a first direction. A wordline is disposed over the bitline, arranged to extend in a second direction intersecting the first direction, and configured to contact the side surface of the gate electrode. A first doped region is formed in the upper surface of each of the pillar portions of the pillar. A second doped region is formed on the body portion of the pillar and connected electrically to the bitline. Storage node electrodes are connected electrically to the first doped region and disposed on each of the pillar portions.
    • 在具有其主体连接到基板的垂直沟道晶体管的半导体存储器件及其制造方法中,半导体存储器件包括:半导体衬底,其包括彼此间隔布置的多个柱,并且每个 支柱包括主体部分和从主体部分延伸并彼此间隔开的一对柱部分。 形成围绕每个支柱部分的栅电极。 位于所述主体部分上的位线穿过所述第一支柱中的所述第一支柱的一对支柱之间的区域,所述第一支柱布置成沿第一方向延伸。 字线布置在位线之外,布置成沿与第一方向相交的第二方向延伸,并且被配置为接触栅电极的侧表面。 第一掺杂区域形成在柱的每个柱部分的上表面中。 第二掺杂区形成在柱的主体部分上并与电位线连接。 存储节点电极与第一掺杂区域电连接并设置在每个柱部分上。
    • 9. 发明授权
    • MethodS of fabricating profiled device wells for improved device
isolation
    • 制造异型设备井的方法,以改进设备隔离
    • US5795801A
    • 1998-08-18
    • US694641
    • 1996-08-09
    • Kang-yoon Lee
    • Kang-yoon Lee
    • H01L21/302H01L21/3065H01L21/336H01L21/76H01L21/762H01L21/763H01L29/78H01L21/8238
    • H01L21/763H01L21/76232H01L21/76237Y10S148/085Y10S148/086
    • A trench is formed in a substrate, the trench defining an active region surface on the substrate, the trench having a trench sidewall. A trench insulation region is then formed in the trench. The substrate underlying the trench sidewall is doped with impurities, and after the first doping, the substrate underlying the active region surface is doped with impurities to form a well having an impurity concentration which increases towards the trench sidewall in a predetermined manner. To form the trench, an insulation layer preferably is formed on the substrate, a barrier layer is formed on the insulation layer, and the barrier layer and the insulation layer are patterned to form an insulation region on the substrate and a barrier region on the insulation region. The substrate is then etched using the barrier region and the insulation region as a mask to thereby form a trench in the substrate. Preferably, the first doping includes implanting ions into the substrate through the trench insulation region and the trench sidewall using the barrier region as a mask. The second doping preferably is preceded by removal of the barrier region, and includes implanting ions into the substrate through the active region surface. The first implantation preferably occurs at a predetermined angle of incidence oblique to the active region surface or, more preferably, over a predetermined range of angles of incidence. The first and second doping steps may include doping with impurities of the same conductivity type or with opposite conductivity types.
    • 在衬底中形成沟槽,沟槽在衬底上限定有源区表面,沟槽具有沟槽侧壁。 然后在沟槽中形成沟槽绝缘区域。 在沟槽侧壁下面的衬底掺杂有杂质,并且在第一掺杂之后,有源区表面下面的衬底掺杂杂质以形成具有以预定方式朝向沟槽侧壁增加的杂质浓度的阱。 为了形成沟槽,优选在衬底上形成绝缘层,在绝缘层上形成阻挡层,并对阻挡层和绝缘层进行图案化以在衬底上形成绝缘区域,并且在绝缘体上形成阻挡区域 地区。 然后使用阻挡区域和绝缘区域作为掩模蚀刻衬底,从而在衬底中形成沟槽。 优选地,第一掺杂包括通过沟槽绝缘区域和使用屏障区域作为掩模的沟槽侧壁将离子注入到衬底中。 优选在第二掺杂之前除去阻挡区,并且包括通过有源区表面将离子注入到衬底中。 第一植入优选地以与活性区域表面倾斜的预定入射角发生,或者更优选地在预定的入射角范围内发生。 第一和第二掺杂步骤可以包括掺杂相同导电类型或相反导电类型的杂质。