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1. 发明授权

US09012074B2 Electrode for lithium secondary battery and lithium secondary battery including same 有权
标题翻译：锂二次电池用电极及包含锂二次电池的锂二次电池
公开(公告)号：US09012074B2
公开(公告)日：2015-04-21
申请号：US13558320
申请日：2012-07-25
申请人： Tae-Hyun Bae , Woo-Cheol Shin , Sang-Il Han , Myung-Hwan Jeong , Jung-Yi Yu , Min-Ju Lee , Sang-Geun Kim , Mi-Hyun Lee
发明人： Tae-Hyun Bae , Woo-Cheol Shin , Sang-Il Han , Myung-Hwan Jeong , Jung-Yi Yu , Min-Ju Lee , Sang-Geun Kim , Mi-Hyun Lee
IPC分类号： H01M4/02 , H01M4/04
CPC分类号： H01M4/02 , H01M4/04 , H01M4/13 , H01M4/139 , H01M4/1393 , H01M10/052 , H01M2004/021 , H01M2300/0034 , Y10T29/49108
摘要： An electrode for a lithium secondary battery, including a surface having surface roughness of about 800 nm to about 1000 nm, and a lithium secondary battery including the same. In one embodiment, the lithium secondary battery has improved cycle-life characteristics.
摘要翻译：一种用于锂二次电池的电极，包括具有约800nm至约1000nm的表面粗糙度的表面和包括该锂二次电池的锂二次电池。在一个实施例中，锂二次电池具有改善的循环寿命特性。

2. 发明申请

US20130183590A1 ELECTRODE FOR LITHIUM SECONDARY BATTERY AND LITHIUM SECONDARY BATTERY INCLUDING SAME 有权
标题翻译：用于锂二次电池和锂二次电池的电极
公开(公告)号：US20130183590A1
公开(公告)日：2013-07-18
申请号：US13558320
申请日：2012-07-25
申请人： Tae-Hyun Bae , Woo-Cheol Shin , Sang-Il Han , Myung-Hwan Jeong , Jung-Yi Yu , Min-Ju Lee , Sang-Geun Kim , Mi-Hyun Lee
发明人： Tae-Hyun Bae , Woo-Cheol Shin , Sang-Il Han , Myung-Hwan Jeong , Jung-Yi Yu , Min-Ju Lee , Sang-Geun Kim , Mi-Hyun Lee
IPC分类号： H01M4/02 , H01M4/64 , H01M10/0564 , H01M4/60
CPC分类号： H01M4/02 , H01M4/04 , H01M4/13 , H01M4/139 , H01M4/1393 , H01M10/052 , H01M2004/021 , H01M2300/0034 , Y10T29/49108
摘要： An electrode for a lithium secondary battery, including a surface having surface roughness of about 800 nm to about 1000 nm, and a lithium secondary battery including the same. In one embodiment, the lithium secondary battery has improved cycle-life characteristics.
摘要翻译：一种用于锂二次电池的电极，包括具有约800nm至约1000nm的表面粗糙度的表面和包括该锂二次电池的锂二次电池。在一个实施例中，锂二次电池具有改善的循环寿命特性。

3. 发明授权

US08546938B2 Stacked package including spacers and method of manufacturing the same 有权
标题翻译：堆叠包装，包括垫片及其制造方法
公开(公告)号：US08546938B2
公开(公告)日：2013-10-01
申请号：US13311681
申请日：2011-12-06
申请人： Sang-Geun Kim , Dong-Chul Han , Seok Goh , Jeong-Hoon Kim
发明人： Sang-Geun Kim , Dong-Chul Han , Seok Goh , Jeong-Hoon Kim
IPC分类号： H01L23/34
CPC分类号： H01L23/49811 , H01L21/565 , H01L23/3128 , H01L23/49816 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/85 , H01L25/105 , H01L25/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/45144 , H01L2224/48227 , H01L2224/73265 , H01L2224/85 , H01L2224/92247 , H01L2225/1023 , H01L2225/1052 , H01L2225/1058 , H01L2924/00014 , H01L2924/15159 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2924/00012 , H01L2924/00 , H01L2224/05599 , H01L2224/0401
摘要： A stacked package and method of manufacture are provided. The stacked package may include a first semiconductor package, a second semiconductor package, plugs and spacers. The second semiconductor package may be stacked on the first semiconductor package. The plugs may electrically connect the first semiconductor to the second semiconductor package. The spacer may be interposed between the first semiconductor package and the second semiconductor package to form a gap between the first semiconductor package and the second semiconductor package, thereby preventing an electrical short between the plugs.
摘要翻译：提供堆叠的包装和制造方法。堆叠封装可以包括第一半导体封装，第二半导体封装，插头和间隔件。第二半导体封装可以堆叠在第一半导体封装上。插头可以将第一半导体电连接到第二半导体封装。间隔件可以插入在第一半导体封装和第二半导体封装之间以在第一半导体封装和第二半导体封装之间形成间隙，从而防止插头之间的电短路。

4. 发明授权

US06820792B2 Die bonding equipment 失效
标题翻译：焊接设备
公开(公告)号：US06820792B2
公开(公告)日：2004-11-23
申请号：US09923480
申请日：2001-08-06
申请人： Sang-Geun Kim , Seung-Chul Ahn
发明人： Sang-Geun Kim , Seung-Chul Ahn
IPC分类号： B23K3700
CPC分类号： H01L21/67144 , H01L22/20 , H01L2924/0002 , H01L2924/014 , H01L2924/00
摘要： Die bonding equipment for fine pitch ball grid array package includes: a semiconductor chip pickup stage for inspecting a status of a loaded semiconductor chip and a corresponding position thereof; an alignment stage on which the semiconductor chip fixed on a mount head is aligned; a chip transfer unit for transferring the semiconductor chip from the semiconductor chip pickup stage to the alignment stage; a guide rail for guiding a mount tape frame; a status inspecting unit disposed at a selected position over the guide rail, for inspecting a status and a position of the land pattern on the mount tape frame; and a bonding unit for bonding the land pattern to the semiconductor chip which is mounted on the mount head. The equipment only bonds semiconductor chips (good or defective) to lands patterns having the same status (good or defective).
摘要翻译：用于细间距球栅阵列封装的贴片设备包括：用于检查加载的半导体芯片的状态及其对应位置的半导体芯片拾取台; 固定在安装头上的半导体芯片对准的对准台; 芯片传送单元，用于将半导体芯片从半导体芯片拾取级传送到对准级; 用于引导安装胶带框架的导轨; 位于所述导轨上方的选定位置的状态检查单元，用于检查所述安装带框架上的所述焊盘图案的状态和位置; 以及用于将焊盘图案接合到安装在安装头上的半导体芯片的接合单元。该设备仅将半导体芯片（良好或有缺陷的）结合到具有相同状态（良好或有缺陷）的焊盘图案。

5. 发明授权

US5818885A Method for minimizing time to establish initial synchronization between a mobile station and a base station in a mobile communication system 失效
标题翻译：用于最小化在移动通信系统中在移动台和基站之间建立初始同步的时间的方法
公开(公告)号：US5818885A
公开(公告)日：1998-10-06
申请号：US664912
申请日：1996-06-17
申请人： Sang-Geun Kim
发明人： Sang-Geun Kim
IPC分类号： H04B1/713 , H04B7/26 , H04L7/00
CPC分类号： H04W56/0035 , H04B1/7156 , H04B7/2681 , H04B2001/71563
摘要： A frequency using method for minimizing a time for an initial synchronization between a mobile station and a base station in a mobile telecommunication system. The frequency using method includes the steps of inputting current time data; reading out an initial synchronization frequency from an internal memory; determining an initial synchronization hopping frequency and an initial synchronization hopping cycle according to a hopping pattern polynomial and the current time data; and sequentially searching for frequencies within a communication channel on a one-by-one basis according to the initial synchronization hopping frequency and the initial synchronization hopping cycle to produce a synchronized frequency to establish synchronization between the mobile station and the base station.
摘要翻译：一种用于在移动电信系统中最小化移动台和基站之间的初始同步的时间的频率使用方法。频率使用方法包括输入当前时间数据的步骤; 从内部存储器读出初始同步频率; 根据跳频图案多项式和当前时间数据确定初始同步跳频和初始同步跳频周期; 并根据初始同步跳频和初始同步跳频周期逐一依次搜索通信信道内的频率，以产生同步频率，以建立移动台与基站之间的同步。

6. 发明申请

US20120133852A1 Liquid crystal display apparatus and array substrate thereof 失效
标题翻译：液晶显示装置及其阵列基板
公开(公告)号：US20120133852A1
公开(公告)日：2012-05-31
申请号：US13200320
申请日：2011-09-23
申请人： Sang-Geun Kim , Jerry Shim , Doo-In Nam , Gee-Hyun Lee
发明人： Sang-Geun Kim , Jerry Shim , Doo-In Nam , Gee-Hyun Lee
IPC分类号： G02F1/133
CPC分类号： G02F1/136204 , G02F2001/136254
摘要： A liquid crystal display (LCD) apparatus having an improved a wiring structure for preventing circuits from being damaged due to static electricity. The LCD apparatus includes an array substrate body on which a pixel electrode is disposed, a common voltage wiring formed on the array substrate body in order to apply a common voltage to a common electrode facing the pixel electrode, a driving integrated circuit (IC) for applying an appropriate driving voltage to the pixel electrode and the common electrode, and a flexible circuit board for connecting the driving IC and an external power source to each other, wherein the common voltage wiring is connected to the driving IC through the flexible circuit board. Accordingly, electrical shock applied to the driving IC due to static electricity is reduced, and thus circuits are prevented from being damaged, thereby reducing errors of products and improving reliability of products.
摘要翻译：一种具有改进的布线结构的液晶显示器（LCD）装置，用于防止电路由于静电而被损坏。液晶显示装置包括阵列基板主体，其上配置有像素电极，公共电压布线形成在阵列基板主体上以便向与像素电极相对的公共电极施加公共电压;驱动集成电路（IC），用于向像素电极和公共电极施加适当的驱动电压，以及用于将驱动IC和外部电源彼此连接的柔性电路板，其中，公共电压布线通过柔性电路板连接到驱动IC。因此，由于静电而对驱动IC施加的电击减少，从而防止电路损坏，从而减少产品的错误并提高产品的可靠性。

7. 发明授权

US08128311B2 Grass protection mat and mat assembly having the same 有权
标题翻译：防草垫和垫组件有相同的
公开(公告)号：US08128311B2
公开(公告)日：2012-03-06
申请号：US11793588
申请日：2005-10-12
申请人： Chang-Sub Son , Sang-Geun Kim
发明人： Chang-Sub Son , Sang-Geun Kim
IPC分类号： E01C9/08 , E01C5/00 , B25G3/18
CPC分类号： A63C19/04 , E01C5/005 , E01C9/004 , E01C13/083 , Y10T403/60
摘要： A grass protection mat and a mat assembly having the same are provided. The grass protection mat of the invention includes a body made of polygonal portions, pillars protruded upward from the body, buffer wings protruded upward from the body between the pillars for distributing weights, an outer frame at the periphery of the body, lug members protruded from lower parts of the body and the outer frame. The mat also includes slide-type hooking means laterally protruded for connection of the mats, an opening formed at the inner surface of the outer frame. The mat assembly includes various forms of mat fastening members for connecting the grass protection mats. The invention facilitates connection of the mats and enhances assemblability of the mat assembly, effectively preventing sinking of the mats into the ground, thereby maintaining protection of grass.
摘要翻译：提供了防草垫和具有该防草垫的垫组件。本发明的防草垫包括由多边形部分制成的主体，从主体向上突出的支柱，从用于分配重物的支柱之间的主体向上突出的缓冲翼，位于主体周边的外框架，凸出部件从身体的下部和外框。垫子还包括用于连接垫的横向突出的滑动式钩挂装置，形成在外框架的内表面处的开口。垫组件包括用于连接草地保护垫的各种形式的垫紧固构件。本发明有利于垫子的连接并提高垫组件的可组装性，有效地防止垫子落入地面，从而保持草的保护。

8. 发明授权

US06337221B1 Die bonding method for manufacturing fine pitch ball grid array packages 失效
标题翻译：用于制造细间距球栅阵列封装的芯片焊接方法
公开(公告)号：US06337221B1
公开(公告)日：2002-01-08
申请号：US09406916
申请日：1999-09-24
申请人： Sang-Geun Kim , Seung-Chui Ahn
发明人： Sang-Geun Kim , Seung-Chui Ahn
IPC分类号： H01L2166
CPC分类号： H01L21/67144 , H01L22/20 , H01L2924/0002 , H01L2924/014 , H01L2924/00
摘要： Die bonding equipment for fine pitch ball grid array package includes: a semiconductor chip pickup stage for inspecting a status of a loaded semiconductor chip and a corresponding position thereof; an alignment stage on which the semiconductor chip fixed on a mount head is aligned; a chip transfer unit for transferring the semiconductor chip from the semiconductor chip pickup stage to the alignment stage; a guide rail for guiding a mount tape frame; a status inspecting unit disposed at a selected position over the guide rail, for inspecting a status and a position of the land pattern on the mount tape frame; and a bonding unit for bonding the land pattern to the semiconductor chip which is mounted on the mount head. The equipment only bonds semiconductor chips (good or defective) to lands patterns having the same status (good or defective).
摘要翻译：用于细间距球栅阵列封装的贴片设备包括：用于检查加载的半导体芯片的状态及其对应位置的半导体芯片拾取台; 固定在安装头上的半导体芯片对准的对准台; 芯片传送单元，用于将半导体芯片从半导体芯片拾取级传送到对准级; 用于引导安装胶带框架的导轨; 位于所述导轨上方的选定位置的状态检查单元，用于检查所述安装带框架上的所述焊盘图案的状态和位置; 以及用于将焊盘图案接合到安装在安装头上的半导体芯片的接合单元。该设备仅将半导体芯片（良好或有缺陷的）结合到具有相同状态（良好或有缺陷）的焊盘图案。

9. 发明授权

US08727116B2 Protection cover for portable terminal 有权
标题翻译：便携式终端防护罩
公开(公告)号：US08727116B2
公开(公告)日：2014-05-20
申请号：US13240169
申请日：2011-09-22
申请人： Yoon-Young Kim , Sang-Geun Kim , Sang-Yul Kim , Seog-Guen Kim , Jin-Soo Kim
发明人： Yoon-Young Kim , Sang-Geun Kim , Sang-Yul Kim , Seog-Guen Kim , Jin-Soo Kim
IPC分类号： B65D85/00
CPC分类号： A45C11/00 , A45C3/001 , A45C13/002 , A45C13/005 , A45C13/34 , A45C2011/003 , A45C2013/025
摘要： A protection cover for a portable terminal preferably includes a rear cover, on and from a surface of which the portable terminal is mountable and removable, and a front cover pivotally coupled to the rear cover to open or close access to the portable terminal mounted on the rear cover. Friction members may be provided on at least one of the rear cover and the front cover, respectively, in which the front cover is disposed at a predetermined angle with respect to the rear cover while facing another surface of the rear cover to support the friction members on a planar surface, thereby opening the portable terminal and cradling the portable terminal inclinedly with respect to the planar surface. The protection cover provides both a cradle and a cover in one device.
摘要翻译：用于便携式终端的保护盖优选地包括后盖，便携式终端可安装和拆卸的表面上的后盖，以及可枢转地联接到后盖以便打开或关闭对安装在所述便携式终端上的便携式终端的通道的前盖后盖。摩擦构件可以分别设置在后盖和前盖中的至少一个上，其中前盖相对于后盖以预定角度设置，同时面向后盖的另一表面以支撑摩擦构件在平坦表面上，从而打开便携式终端并相对于平面倾斜地携带便携式终端。保护盖在一个设备中同时提供支架和盖。

10. 发明授权

US08599324B2 Liquid crystal display apparatus and array substrate thereof 失效
标题翻译：液晶显示装置及其阵列基板
公开(公告)号：US08599324B2
公开(公告)日：2013-12-03
申请号：US13200320
申请日：2011-09-23
申请人： Sang-Geun Kim , Jerry Shim , Doo-In Nam , Gee-Hyun Lee
发明人： Sang-Geun Kim , Jerry Shim , Doo-In Nam , Gee-Hyun Lee
IPC分类号： G02F1/1333
CPC分类号： G02F1/136204 , G02F2001/136254
摘要： A liquid crystal display (LCD) apparatus having an improved a wiring structure for preventing circuits from being damaged due to static electricity. The LCD apparatus includes an array substrate body on which a pixel electrode is disposed, a common voltage wiring formed on the array substrate body in order to apply a common voltage to a common electrode facing the pixel electrode, a driving integrated circuit (IC) for applying an appropriate driving voltage to the pixel electrode and the common electrode, and a flexible circuit board for connecting the driving IC and an external power source to each other, wherein the common voltage wiring is connected to the driving IC through the flexible circuit board. Accordingly, electrical shock applied to the driving IC due to static electricity is reduced, and thus circuits are prevented from being damaged, thereby reducing errors of products and improving reliability of products.
摘要翻译：一种具有改进的布线结构的液晶显示器（LCD）装置，用于防止电路由于静电而被损坏。液晶显示装置包括阵列基板主体，其上配置有像素电极，公共电压布线形成在阵列基板主体上以便向与像素电极相对的公共电极施加公共电压;驱动集成电路（IC），用于向像素电极和公共电极施加适当的驱动电压，以及用于将驱动IC和外部电源彼此连接的柔性电路板，其中，公共电压布线通过柔性电路板连接到驱动IC。因此，由于静电而对驱动IC施加的电击减少，从而防止电路损坏，从而减少产品的错误并提高产品的可靠性。

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