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    • 3. 发明申请
    • METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
    • 制造半导体器件的方法
    • US20090298242A1
    • 2009-12-03
    • US12327362
    • 2008-12-03
    • Joong Sik KimSung Woong Chung
    • Joong Sik KimSung Woong Chung
    • H01L21/336
    • H01L29/7841H01L27/108H01L27/10802
    • Disclosed herein is a method for manufacturing a semiconductor device that includes forming a gate pattern on a substrate having a stacked structure including a lower silicon layer, an insulating layer, and an upper silicon layer. The method further includes forming spacers on sidewalls of the gate pattern. Still further, the method includes etching the upper silicon layer using the gate pattern as a mask to form a floating body and expose a portion of the insulating layer. The method further includes depositing a conductive layer over the gate pattern and exposed insulating layer, and performing a thermal process on the conductive layer to form a source/drain region in the floating body.
    • 本文公开了一种半导体器件的制造方法,其包括在具有下硅层,绝缘层和上硅层的层叠结构的基板上形成栅极图案。 该方法还包括在栅极图案的侧壁上形成间隔物。 此外,该方法包括使用栅极图案作为掩模蚀刻上硅层,以形成浮体并暴露绝缘层的一部分。 该方法还包括在栅极图案和暴露的绝缘层上沉积导电层,以及在导电层上执行热处理以在浮体中形成源极/漏极区域。
    • 4. 发明授权
    • Semiconductor device having a recess channel transistor
    • 具有凹槽通道晶体管的半导体器件
    • US07615449B2
    • 2009-11-10
    • US11529420
    • 2006-09-29
    • Sung Woong ChungSang Don Lee
    • Sung Woong ChungSang Don Lee
    • H01L29/94H01L29/78
    • H01L29/66621H01L27/10876
    • The semiconductor device having a recess channel transistor includes a device isolation structure formed in a semiconductor substrate to define an active region having a recess region at a lower part of sidewalls thereof and a recess channel region formed in the semiconductor substrate under the active region. A method for fabricating the semiconductor device includes forming a device isolation structure in a semiconductor substrate to form an active region having a recess region at a lower part of sidewalls thereof, a gate insulating film formed over the semiconductor substrate including the recess channel region, and a gate electrode formed over the gate insulating film to fill up the recess channel region.
    • 具有凹陷沟道晶体管的半导体器件包括形成在半导体衬底中的器件隔离结构,以限定其侧壁下部具有凹陷区域的有源区域和在有源区域下形成在半导体衬底中的凹槽沟道区域。 一种制造半导体器件的方法包括:在半导体衬底中形成器件隔离结构,以形成在其侧壁的下部具有凹陷区域的有源区,形成在包括凹槽沟道区域的半导体衬底上的栅极绝缘膜,以及 形成在所述栅极绝缘膜上方以填充所述凹陷沟道区域的栅电极。
    • 5. 发明申请
    • Semiconductor device having a recess channel transistor
    • 具有凹槽通道晶体管的半导体器件
    • US20070252199A1
    • 2007-11-01
    • US11529420
    • 2006-09-29
    • Sung Woong ChungSang Don Lee
    • Sung Woong ChungSang Don Lee
    • H01L29/94
    • H01L29/66621H01L27/10876
    • The semiconductor device having a recess channel transistor includes a device isolation structure formed in a semiconductor substrate to define an active region having a recess region at a lower part of sidewalls thereof and a recess channel region formed in the semiconductor substrate under the active region. A method for fabricating the semiconductor device includes forming a device isolation structure in a semiconductor substrate to form an active region having a recess region at a lower part of sidewalls thereof, a gate insulating film formed over the semiconductor substrate including the recess channel region, and a gate electrode formed over the gate insulating film to fill up the recess channel region.
    • 具有凹陷沟道晶体管的半导体器件包括形成在半导体衬底中的器件隔离结构,以限定其侧壁下部具有凹陷区域的有源区域和在有源区域下形成在半导体衬底中的凹槽沟道区域。 一种制造半导体器件的方法包括:在半导体衬底中形成器件隔离结构,以形成在其侧壁的下部具有凹陷区域的有源区,形成在包括凹槽沟道区域的半导体衬底上的栅极绝缘膜,以及 形成在所述栅极绝缘膜上方以填充所述凹陷沟道区域的栅电极。
    • 8. 发明授权
    • Semiconductor device having a recess channel transistor
    • 具有凹槽通道晶体管的半导体器件
    • US07960761B2
    • 2011-06-14
    • US12615210
    • 2009-11-09
    • Sung Woong ChungSang Don Lee
    • Sung Woong ChungSang Don Lee
    • H01L29/78H01L29/94
    • H01L29/66621H01L27/10876
    • The semiconductor device having a recess channel transistor includes a device isolation structure formed in a semiconductor substrate to define an active region having a recess region at a lower part of sidewalls thereof and a recess channel region formed in the semiconductor substrate under the active region. A method for fabricating the semiconductor device includes forming a device isolation structure in a semiconductor substrate to form an active region having a recess region at a lower part of sidewalls thereof, a gate insulating film formed over the semiconductor substrate including the recess channel region, and a gate electrode formed over the gate insulating film to fill up the recess channel region.
    • 具有凹陷沟道晶体管的半导体器件包括形成在半导体衬底中的器件隔离结构,以限定其侧壁下部具有凹陷区域的有源区域和在有源区域下形成在半导体衬底中的凹槽沟道区域。 一种制造半导体器件的方法包括:在半导体衬底中形成器件隔离结构,以形成在其侧壁的下部具有凹陷区域的有源区,形成在包括凹槽沟道区域的半导体衬底上的栅极绝缘膜,以及 形成在所述栅极绝缘膜上方以填充所述凹陷沟道区域的栅电极。