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    • 8. 发明申请
    • Thin-type surface-mount capacitor
    • 薄型表面贴装电容器
    • US20050013093A1
    • 2005-01-20
    • US10891203
    • 2004-07-13
    • Toshihisa NagasawaAkihiro KawaiYuichi Maruko
    • Toshihisa NagasawaAkihiro KawaiYuichi Maruko
    • H01G9/012H01G9/00H01G9/15H01G9/04
    • H01G9/15H01G11/56Y02E60/13Y10T29/417
    • A thin-type surface-mount capacitor is a solid electrolytic capacitor. The capacitor includes a capacitor element having an anode body in the form of a plate-like or foil-like valve-action metal that is area-increased, and a conductive functional polymer film used as a solid electrolyte. The capacitor further includes thermal adhesive insulating resin impregnated tapes that are stuck to the capacitor element on upper and lower sides thereof, and an element reinforcing metal plate and a solderable cathode terminal metal plate 67 that are stuck to the tapes, respectively. The capacitor is finally formed by applying a curing treatment under high temperature and pressure. Each of the metal plates is applied with a stepping process that provides a difference in level corresponding to a predetermined thickness.
    • 薄型表面贴装电容器是固体电解电容器。 电容器包括电容器元件,其具有面积增加的板状或箔状阀作用金属形式的阳极体和用作固体电解质的导电功能聚合物膜。 电容器还包括粘附到电容器元件的上侧和下侧的热粘合绝缘树脂浸渍带,以及分别粘附在带上的元件加强金属板和可焊接阴极端子金属板67。 最后通过在高温高压下进行固化处理形成电容器。 每个金属板被施加有提供对应于预定厚度的水平差的步进过程。
    • 9. 发明申请
    • Surface-mount capacitor and method of producing the same
    • 表面贴装电容器及其制造方法
    • US20060087795A1
    • 2006-04-27
    • US11260831
    • 2005-10-27
    • Toshihisa NagasawaKenji ArakiHitoshi TakataAkihiro KawaiShinji Arai
    • Toshihisa NagasawaKenji ArakiHitoshi TakataAkihiro KawaiShinji Arai
    • H01G4/228
    • H01G9/008H01G9/08Y10T29/417
    • A surface-mount capacitor includes a multilayer capacitor structure formed by laminating plate-like capacitor elements each having anode lead portions 11 at opposite ends thereof and a cathode portion 12 at the center, an anode terminal 18 connected to each anode lead portion 11 via a strip-like plate 14, and a cathode terminal 19 connected to the cathode portion 12. The anode and the cathode terminals 18 and 19 have a flat shape and are formed on a common plane as a substrate-mounted surface. A mold resin case 20 has a bottom portion filling a gap between the anode and the cathode terminals 18 and 19 and mechanically connecting the anode and the cathode terminals 18 and 19, and side walls substantially perpendicular to the substrate-mounted surface. The anode and the cathode terminals 18 and 19 have upper surfaces exposed on an inner bottom surface of the mold resin case 20 to be connected to the anode lead portions 11 and the cathode portion 12.
    • 表面贴装电容器包括层叠电容器结构,该层叠电容器结构通过层叠板状电容器元件而形成,所述电容器元件的相对端部具有阳极引线部分11和位于其中心的阴极部分12,阳极端子18经由一个阳极引线部分11经由 条状板14和连接到阴极部分12的阴极端子19。 阳极和阴极端子18和19具有扁平形状并且形成在公共平面上作为基板安装表面。 模具树脂壳体20具有填充阳极和阴极端子18和19之间的间隙的底部,并且机构地连接阳极和阴极端子18和19以及基本垂直于基板安装表面的侧壁。 阳极和阴极端子18和19具有暴露在模制树脂壳体20的内底表面上的上表面,以连接到阳极引线部分11和阴极部分12。
    • 10. 发明授权
    • Surface-mount capacitor and method of producing the same
    • 表面贴装电容器及其制造方法
    • US07326261B2
    • 2008-02-05
    • US11681112
    • 2007-03-01
    • Toshihisa NagasawaKenji ArakiHitoshi TakataAkihiro KawaiShinji Arai
    • Toshihisa NagasawaKenji ArakiHitoshi TakataAkihiro KawaiShinji Arai
    • H01G9/00
    • H01G9/008H01G9/08Y10T29/417
    • A surface-mount capacitor includes a multilayer capacitor structure formed by laminating plate-like capacitor elements each having anode lead portions at opposite ends thereof and a cathode portion at the center, an anode terminal connected to each anode lead portion via a strip-like plate, and a cathode terminal connected to the cathode portion. The anode and the cathode terminals and have a flat shape and are formed on a common plane as a substrate-mounted surface. A mold resin case has a bottom portion filling a gap between the anode and the cathode terminals and mechanically connecting the anode and the cathode terminals and sidewalls substantially perpendicular to the substrate-mounted surface. The anode and the cathode terminals have upper surfaces exposed on an inner bottom surface of the mold resin case to be connected to the anode lead portions and the cathode portion.
    • 表面贴装电容器包括层叠电容器结构,该层叠电容器结构通过层压板状电容器元件而形成,所述电容器元件的相对端具有阳极引线部分,并且在中心部分具有阴极部分,阳极端子经由条状板连接到每个阳极引线部分 以及连接到阴极部分的阴极端子。 阳极和阴极端子并且具有平坦形状并且形成在公共平面上作为基板安装表面。 模具树脂壳体具有填充阳极和阴极端子之间的间隙的底部部分,并且将阳极和阴极端子和基本上垂直于衬底安装表面的侧壁机械连接。 阳极和阴极端子具有暴露在模制树脂壳体的内底表面上的上表面,以连接到阳极引线部分和阴极部分。