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    • 5. 发明申请
    • FABRICATING METHOD OF A PIXEL UNIT
    • 像素单元的制作方法
    • US20110070671A1
    • 2011-03-24
    • US12953472
    • 2010-11-24
    • Chin-Yueh LiaoChih-Chun YangChih-Hung ShihShine-Kai Tseng
    • Chin-Yueh LiaoChih-Chun YangChih-Hung ShihShine-Kai Tseng
    • H01L33/36
    • H01L27/1288H01L27/1214
    • A method for fabricating a pixel unit is provided. A TFT is formed on a substrate. A protection layer and a patterned photoresist layer are sequentially formed on the substrate entirely. A patterned protection layer is formed by using the patterned photoresist layer as a mask and partially removing the protection layer, wherein the patterned protection layer has an undercut located at a sidewall thereof. A pixel electrode material layer is formed to cover the substrate, the TFT and the patterned photoresist layer, wherein the electrode material layer is disconnected at the undercut and exposes the undercut. A pixel electrode electrically connected to the TFT is formed by lifting off the patterned photoresist layer and parts of the electrode material layer covering the patterned photoresist layer simultaneously through a stripper, wherein the stripper permeates from the undercut to an interface of the patterned photoresist layer and the patterned protection layer.
    • 提供了一种用于制造像素单元的方法。 在基板上形成TFT。 保护层和图案化的光致抗蚀剂层完全依次形成在基板上。 通过使用图案化的光致抗蚀剂层作为掩模并且部分地去除保护层来形成图案化的保护层,其中图案化的保护层具有位于其侧壁处的底切。 形成像素电极材料层以覆盖衬底,TFT和图案化光致抗蚀剂层,其中电极材料层在底切处断开并暴露底切。 电连接到TFT的像素电极通过剥离图案化的光致抗蚀剂层和覆盖图案化的光致抗蚀剂层的电极材料层的部分同时通过剥离器形成,其中剥离剂从底切渗透到图案化的光致抗蚀剂层和 图案化保护层。
    • 7. 发明申请
    • FABRICATING METHOD OF A PIXEL UNIT
    • 像素单元的制作方法
    • US20120208305A1
    • 2012-08-16
    • US13454106
    • 2012-04-24
    • Chin-Yueh LiaoChih-Chun YangChih-Hung ShihShine-Kai Tseng
    • Chin-Yueh LiaoChih-Chun YangChih-Hung ShihShine-Kai Tseng
    • H01L33/36
    • H01L27/1288H01L27/1214
    • A method for fabricating a pixel unit is provided. A TFT is formed on a substrate. A protection layer and a patterned photoresist layer are sequentially formed on the substrate entirely. A patterned protection layer is formed by using the patterned photoresist layer as a mask and partially removing the protection layer, wherein the patterned protection layer has an undercut located at a sidewall thereof A pixel electrode material layer is formed to cover the substrate, the TFT and the patterned photoresist layer, wherein the electrode material layer is disconnected at the undercut and exposes the undercut. A pixel electrode electrically connected to the TFT is formed by lifting off the patterned photoresist layer and parts of the electrode material layer covering the patterned photoresist layer simultaneously through a stripper, wherein the stripper permeates from the undercut to an interface of the patterned photoresist layer and the patterned protection layer.
    • 提供了一种用于制造像素单元的方法。 在基板上形成TFT。 保护层和图案化的光致抗蚀剂层完全依次形成在基板上。 通过使用图案化的光致抗蚀剂层作为掩模并且部分地去除保护层来形成图案化的保护层,其中图案化的保护层具有位于其侧壁处的底切。形成像素电极材料层以覆盖基板,TFT和 图案化的光致抗蚀剂层,其中电极材料层在底切处断开并暴露底切。 电连接到TFT的像素电极通过剥离图案化的光致抗蚀剂层和覆盖图案化的光致抗蚀剂层的电极材料层的部分同时通过剥离器形成,其中剥离剂从底切渗透到图案化的光致抗蚀剂层和 图案化保护层。
    • 9. 发明申请
    • PIXEL UNIT AND FABRICATING METHOD THEREOF
    • 像素单元及其制作方法
    • US20100258810A1
    • 2010-10-14
    • US12482433
    • 2009-06-10
    • Chin-Yueh LiaoChih-Chun YangChih-Hung ShihShine-Kai Tseng
    • Chin-Yueh LiaoChih-Chun YangChih-Hung ShihShine-Kai Tseng
    • H01L29/786H01L21/336H01L29/92H01L21/02
    • H01L27/1288H01L27/1214
    • A method for fabricating a pixel unit is provided. A TFT is formed on a substrate. A protection layer and a patterned photoresist layer are sequentially formed on the substrate entirely. A patterned protection layer is formed by using the patterned photoresist layer as a mask and partially removing the protection layer, wherein the patterned protection layer has an undercut located at a sidewall thereof. A pixel electrode material layer is formed to cover the substrate, the TFT and the patterned photoresist layer, wherein the electrode material layer is disconnected at the undercut and exposes the undercut. A pixel electrode electrically connected to the TFT is formed by lifting off the patterned photoresist layer and parts of the electrode material layer covering the patterned photoresist layer simultaneously through a stripper, wherein the stripper permeates from the undercut to an interface of the patterned photoresist layer and the patterned protection layer.
    • 提供了一种用于制造像素单元的方法。 在基板上形成TFT。 保护层和图案化的光致抗蚀剂层完全依次形成在基板上。 通过使用图案化的光致抗蚀剂层作为掩模并且部分地去除保护层来形成图案化的保护层,其中图案化的保护层具有位于其侧壁处的底切。 形成像素电极材料层以覆盖衬底,TFT和图案化光致抗蚀剂层,其中电极材料层在底切处断开并暴露底切。 电连接到TFT的像素电极通过剥离图案化的光致抗蚀剂层和覆盖图案化的光致抗蚀剂层的电极材料层的部分同时通过剥离器形成,其中剥离剂从底切渗透到图案化的光致抗蚀剂层和 图案化保护层。
    • 10. 发明授权
    • Method of fabricating pixel structure
    • 制作像素结构的方法
    • US07749821B2
    • 2010-07-06
    • US12489451
    • 2009-06-23
    • Hsiang-Chih HsiaoChih-Chun YangChin-Yueh Liao
    • Hsiang-Chih HsiaoChih-Chun YangChin-Yueh Liao
    • H01L21/28
    • H01L27/1259H01L27/1214H01L27/1255H01L27/1288
    • A method of fabricating a pixel structure includes first forming a first, a second, and a third dielectric layers over an active device and a substrate. Etching rates of the first and the third dielectric layers are lower than an etching rate of the second dielectric layer. A contact opening exposing a portion of the active device is formed in the third, the second, and the first dielectric layers. The third and the second dielectric layers are patterned to form a number of stacked structures. An electrode material layer is formed and fills the contact opening. The electrode material layer located on the stacked structures and the electrode material layer located on the first dielectric layer are separated. The stacked structures and the electrode material layer thereon are simultaneously removed to define a pixel electrode and to form at least an alignment slit in the pixel electrode.
    • 制造像素结构的方法包括首先在有源器件和衬底上形成第一,第二和第三电介质层。 第一和第三介电层的蚀刻速率低于第二介电层的蚀刻速率。 在第三,第二和第一电介质层中形成暴露有源器件的一部分的接触开口。 图案化第三和第二介电层以形成多个层叠结构。 形成电极材料层并填充接触开口。 位于堆叠结构上的电极材料层和位于第一介电层上的电极材料层被分离。 同时去除其上的层叠结构和电极材料层以限定像素电极并且在像素电极中形成至少一个对准狭缝。