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1. 发明申请

US20170125644A1 METHOD OF MANUFACTURING LIGHT EMITTING DEVICE 审中-公开
公开(公告)号：US20170125644A1
公开(公告)日：2017-05-04
申请号：US15341761
申请日：2016-11-02
申请人： TOYODA GOSEI CO., LTD.
发明人： Yosuke TSUCHIYA , Yuhki ITO , Aya KAWAOKA
IPC分类号： H01L33/48 , H01L33/60
CPC分类号： H01L33/486 , H01L33/60 , H01L33/62 , H01L2224/16225 , H01L2933/0033 , H01L2933/0058 , H01L2933/0066
摘要： A method of manufacturing a light emitting device, includes: temporarily connecting light emitting elements to a wiring layer through connection members, the wiring layer being formed on a mounting board provided with reflectors; contacting a pressing surface of a press-bonding jig with upper surfaces of the light emitting elements and pressing the light emitting elements toward the mounting board while being heated at the same time to deform the connection members and to contact the pressing surface with tops of the reflectors; and connecting the light emitting elements to the wiring layer in a flip chip manner, wherein when the light emitting elements are temporarily connected to the wiring layer, a sum of height of a light emitting element of the light emitting elements and a connection member of the connection members is set to be larger than a height of a reflector of the reflectors.

2. 发明申请

US20170278834A1 METHOD OF MANUFACTURING LIGHT EMITTING ELEMENT AND LIGHT EMITTING DEVICE 审中-公开
公开(公告)号：US20170278834A1
公开(公告)日：2017-09-28
申请号：US15446968
申请日：2017-03-01
申请人： TOYODA GOSEI CO., LTD.
发明人： Motoyuki TANAKA , Yosuke TSUCHIYA , Aya KAWAOKA , Makoto ISHIDA
IPC分类号： H01L25/00 , H01L33/48 , H01L25/075 , H01L33/50
CPC分类号： H01L25/50 , H01L25/0756 , H01L33/0095 , H01L33/44 , H01L33/486 , H01L33/505 , H01L33/507 , H01L33/54 , H01L2224/0401 , H01L2224/131 , H01L2224/16227 , H01L2224/16245 , H01L2224/1703 , H01L2224/94 , H01L2924/18161 , H01L2933/0025 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2924/014 , H01L2924/00014 , H01L2224/03
摘要： A method of manufacturing a light emitting element includes forming a resin film including a phosphor containing layer on a transparent board side surface of a wafer including a transparent board and a plurality of light emitting parts formed on the transparent board, forming a scribing line along a scheduled separation surface in a surface of the transparent board by scribing before or after forming the resin film, cutting the resin film along the scheduled separation surface before or after forming the scribing line, and separating the transparent board along the scheduled separation surface by breaking after forming the scribing line and cutting the resin film.

3. 发明申请

US20220231205A1 ULTRAVIOLET LIGHT EMITTING DEVICE 有权
公开(公告)号：US20220231205A1
公开(公告)日：2022-07-21
申请号：US17573915
申请日：2022-01-12
申请人： TOYODA GOSEI CO., LTD.
发明人： Takeshi MATSUSHIMA , Shota SHIMONISHI , Kenichi MATSUURA , Aya KAWAOKA , Takashi SHUGO , Shintaro HAKAMATA , Yuki GOTO
IPC分类号： H01L33/56 , H01L33/62
摘要： An ultraviolet light emitting device includes a substrate, an ultraviolet light emitting element, a bonding layer, a fluororesin film, and a fluorocarbon compound. The substrate includes a mounting surface. The ultraviolet light emitting element includes a first surface, a second surface, and a side surface. The bonding layer bonds the electrode on the first surface of the ultraviolet light emitting element and a part of the mounting surface of the substrate. The fluororesin film is a flexible material configured to transmit ultraviolet light. The substrate and the fluororesin film are disposed in a state where the ultraviolet light emitting element is sandwiched therebetween. The fluorocarbon compound is a liquid at normal temperature and pressure. The fluorocarbon compound fills a gap between the side surface of the ultraviolet light emitting element and the fluororesin film in a state of being in contact with the side surface and the fluororesin film.

4. 发明申请

US20150204494A1 Light-Emitting Device and Method of Manufacturing the Same 有权
标题翻译：发光装置及其制造方法
公开(公告)号：US20150204494A1
公开(公告)日：2015-07-23
申请号：US14599308
申请日：2015-01-16
申请人： TOYODA GOSEI CO., LTD.
发明人： Satoshi WADA , Aya KAWAOKA
IPC分类号： F21K99/00
CPC分类号： H01L25/0753 , H01L24/83 , H01L24/95 , H01L33/505 , H01L33/507 , H01L33/60
摘要： A light-emitting device includes a plurality of light-emitting elements face-down mounted on a substrate, a plurality of structures each including a transparent plate, a phosphor-containing film provided on a lower surface of the transparent plate and a transparent covering layer provided on the lower surface of the transparent plate so as to cover lower and side surfaces of the phosphor-containing film, the structures being each provided on each of the plurality of light-emitting elements such that a lower surface of the transparent covering layer contacts a top surface of the plurality of light-emitting elements, and a white reflector to cover a side surface of the plurality of light-emitting elements and a side surfaces of the transparent covering layer. At least a portion of a region directly above a gap between the plurality of light-emitting elements is not covered with the phosphor-containing film.
摘要翻译：发光装置包括面朝下安装在基板上的多个发光元件，多个结构，每个结构均包括透明板，设置在透明板的下表面上的含磷光体膜和透明覆盖层设置在所述透明板的下表面上以覆盖所述含磷光体膜的下表面和所述侧表面，所述结构各自设置在所述多个发光元件中的每一个上，使得所述透明覆盖层的下表面接触多个发光元件的上表面和覆盖多个发光元件的侧面的白色反射体和透明被覆层的侧面。多个发光元件之间的间隙正上方的区域的至少一部分不被含荧光体膜覆盖。

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