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    • 9. 发明授权
    • Method for making embedded cost-efficient SONOS non-volatile memory
    • 嵌入式经济高效SONOS非易失性存储器的方法
    • US08722496B1
    • 2014-05-13
    • US13756497
    • 2013-01-31
    • Tower Semiconductor Ltd.
    • Yakov RoizinEvgeny PikhayAlexey HeimanMicha Gutman
    • H01L21/336
    • H01L29/66833H01L21/28282H01L27/11573H01L29/792
    • A cost-efficient SONOS (CEONOS) non-volatile memory (NVM) cell production method for CMOS ICs, where the CEONOS NVM cell requires two or three additional masks, but can otherwise be formed using the same standard CMOS flow processes used to form NMOS transistors. A first additional mask is used to form an oxide-nitride-oxide (ONO) layer that replaces the standard NMOS gate oxide and serves to store NVM data (i.e., trapped charges). A second additional mask is used to perform drain engineering, including a special pocket implant and LDD extensions, which facilitates program/erase of the CEONOS NVM cells using low voltages (e.g., 5V). The polysilicon gate, source/drain contacts and metallization are formed using corresponding NMOS processes. The CEONOS NVM cells are arranged in a space-efficient X-array pattern such that each group of four cells share three bit lines. Programming involves standard CHE injection or pulse agitated interface substrate hot electron injection (PAISHEI).
    • 用于CMOS IC的具有成本效益的SONOS(CEONOS)非易失性存储器(NVM)电池制造方法,其中CEONOS NVM单元需要两个或三个附加掩模,但是否则可以使用用于形成NMOS的相同的标准CMOS流程形成 晶体管。 使用第一附加掩模来形成替代标准NMOS栅极氧化物并用于存储NVM数据(即,捕获的电荷)的氧化物 - 氮化物 - 氧化物(ONO)层。 第二个附加掩模用于执行漏极工程,包括特殊的口袋注入和LDD扩展,这有助于使用低电压(例如5V)对CEONOS NVM单元进行编程/擦除。 使用相应的NMOS工艺形成多晶硅栅极,源极/漏极接触和金属化。 CEONOS NVM单元以空间有效的X阵列模式排列,使得每组四个单元共享三个位线。 编程涉及标准CHE注入或脉冲搅拌界面基板热电子注入(PAISHEI)。