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    • 1. 发明授权
    • Method of manufacturing electromechanical vibration pick-ups
    • 制造机电振动拾取的方法
    • US3892025A
    • 1975-07-01
    • US40478373
    • 1973-10-09
    • THOMSON BRANDT
    • LAINEZ LUCIENDUIKER FOKKEBAYARD JOELDI CAMPLI DOMINIQUE
    • H04R23/00H04R31/00B29D17/00
    • H04R23/006Y10T29/49002Y10T29/49577
    • Electromechanical vibration transducers or pick-ups of this kind are manufactured from a single beam of ceramic material having at least one flat face provided with a deep slot at about its middle, separating it into two portions. This slot is being bridged by means of a transistor-type electromechanical transducer whose extremities are respectively fixed to the flat faces of the first and the second beam portions, one of which is mounted in a damping block and the second of which carries a pick-up stylus. After the mounting of the transistor and the stylus, the assembly is inserted into a protective housing from which only the stylus protrudes through an opening and the two beam portions are completely separated by cutting through the base of the slot, so as to become interconnected solely by means of the transistor substrate. The means preferably used for this cutting operation is a laser beam made to pass through the protective housing.
    • 这种类型的机电振动传感器或拾取器由具有至少一个在其中部附近设置有深槽的平面的单个陶瓷材料制造,将其分成两部分。 该槽正在通过晶体管型机电换能器桥接,其四肢分别固定在第一和第二梁部分的平坦表面上,其中一个安装在阻尼块中, 手写笔。 在安装晶体管和触针之后,将组件插入保护壳体中,只有触针从其中突出通过开口,并且两个梁部分通过切割槽的基部而完全分开,以便仅仅变得互连 借助于晶体管衬底。 优选用于该切割操作的装置是通过保护壳体的激光束。