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1. 发明公开

US20240172405A1 ELECTROMAGNETIC WAVE SHIELDING FILM AND SHIELDED PRINTED WIRING BOARD 审中-公开
公开(公告)号：US20240172405A1
公开(公告)日：2024-05-23
申请号：US18553148
申请日：2022-03-29
申请人： TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
发明人： Takahiko KATSUKI , Hiroshi TAJIMA , Sirou YAMAUCHI
IPC分类号： H05K9/00 , H05K1/02
CPC分类号： H05K9/0086 , H05K1/0218 , H05K2201/0715
摘要： An electromagnetic wave shielding film has permeability to volatile components, shielding characteristics, and resistance to folding. The electromagnetic wave shielding film includes an adhesive layer; a metal layer made of a metal and placed on the adhesive layer; and an insulating layer placed on the metal layer. Multiple openings are formed in the metal layer; the openings include openings (A) including island-shaped metal layer fragments, each opening (A) having island-shaped metal layer fragments formed therein, and the openings (A) including island-shaped metal layer fragments include openings (A1) including one or more island-shaped metal layer fragments. Each opening (A1) defines an opening (A) including island-shaped metal layer fragments in which a total area of the island-shaped metal layer fragments accounts for 40 to 80% of an area inside a contour of the opening (A).

2. 发明申请

US20160205817A1 Shield Film, Shielded Printed Wiring Board, And Method for Manufacturing Shield Film 审中-公开
标题翻译：屏蔽膜，屏蔽印刷线路板，以及制造屏蔽膜的方法
公开(公告)号：US20160205817A1
公开(公告)日：2016-07-14
申请号：US15019775
申请日：2016-02-09
申请人： TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
发明人： Hiroshi TAJIMA , Sirou YAMAUCHI , Kenji KAMINO , Masahiro WATANABE
IPC分类号： H05K9/00 , H05K1/02
CPC分类号： H05K9/00 , H05K1/0216 , H05K3/28 , H05K9/0084 , H05K9/0088 , H05K2201/0715 , Y10T29/49226
摘要： To provide a shield film which is capable of suitably shielding electric field waves, magnetic field waves, and electromagnetic waves progressing from one side to the other side of the shield film and has good transmission characteristics, a shielded printed wiring board, and a method for manufacturing the shield film, a metal layer 3 which is 0.5 μm to 12 μm thick and an anisotropic conductive adhesive layer 4 which is anisotropic so as to be electrically conductive only in thickness directions are provided in a deposited manner, so that electric field waves, magnetic field waves, and electromagnetic waves progressing from one side to the other side of the shield film are suitably shielded.
摘要翻译：为了提供一种屏蔽膜，其能够适当地屏蔽从屏蔽膜的一侧向另一侧前进的电场波，磁场波和电磁波，并且具有良好的透射特性，屏蔽印刷线路板和用于制造屏蔽膜，以沉积的方式设置厚度为0.5μm至12μm的金属层3和各向异性的仅在厚度方向上导电的各向异性导电粘合剂层4，磁场波和从屏蔽膜的一侧向另一侧前进的电磁波被适当地屏蔽。

3. 发明申请

US20210410272A1 Method for Manufacturing Shielded Printed Wiring Board and Shielded Printed Wiring Board 有权
公开(公告)号：US20210410272A1
公开(公告)日：2021-12-30
申请号：US17298394
申请日：2019-12-10
申请人： Tatsuta Electric Wire & Cable Co., Ltd.
发明人： Sirou YAMAUCHI , Hiroshi TAJIMA , Yuusuke HARUNA , Takahiko KATSUKI
IPC分类号： H05K1/02 , H05K9/00
摘要： Provided is a method of producing a shielded printed wiring board capable of sufficiently adhering to each other a printed wiring board, an adhesive layer of an electromagnetic wave shielding film on one face of the printed wiring board, and an adhesive layer of an electromagnetic wave shielding film on the other face of the printed wiring board. The method of producing a shielded printed wiring board of the present invention includes a printed wiring board preparing step of preparing a printed wiring board including a base film, a printed circuit formed on the base film, and a coverlay covering the printed circuit; a first electromagnetic wave shielding film preparing step of preparing a first electromagnetic wave shielding film sequentially including a first protective film, a first insulating layer, and a first adhesive layer; a second electromagnetic wave shielding film preparing step of preparing a second electromagnetic wave shielding film sequentially including a second protective film, a second insulating layer, and a second adhesive layer; a first electromagnetic wave shielding film placing step of placing the first electromagnetic wave shielding film on the printed wiring board so that the first adhesive layer is in contact with one face of the printed wiring board, and part of the first adhesive layer protrudes from an end of the printed wiring board to form a first extending end portion; a second electromagnetic wave shielding film placing step of placing the second electromagnetic wave shielding film on the printed wiring board so that the second adhesive layer is in contact with the other face of the printed wiring board, and part of the second adhesive layer protrudes from an end of the printed wiring board to form a second extending end portion; a stacking step of stacking the first extending end portion on the second extending end portion so that a gap is created between the first extending end portion and the second extending end portion, whereby a shielded printed wiring board before pre-pressing is prepared; a pre-pressing step of pressurizing and heating the shielded printed wiring board before pre-pressing to the extent that the first adhesive layer and the second adhesive layer are not completely cured, whereby a pre-pressed shielded printed wiring board is prepared; a protective film peeling step of peeling off the first protective film and the second protective film from the pre-pressed shielded printed wiring board, whereby a shielded printed wiring board before post-pressing is prepared; and a post-pressing step of pressurizing and heating the shielded printed wiring board before post-pressing to cure the first adhesive layer and the second adhesive layer, whereby a shielded printed wiring board is prepared.

4. 发明申请

US20210059042A1 Electromagnetic Shielding Film and Shielded Printed Wiring Board Including the Same 有权
公开(公告)号：US20210059042A1
公开(公告)日：2021-02-25
申请号：US16626436
申请日：2017-07-10
申请人： Tatsuta Electric Wire & Cable Co., Ltd.
发明人： Sirou YAMAUCHI , Masahiro WATANABE , Hiroshi TAJIMA
IPC分类号： H05K1/02 , H05K9/00 , H01J11/44
摘要： It is an object of the present invention to provide an electromagnetic shielding film having excellent high frequency signal transmission characteristics and excellent shielding characteristics against electromagnetic waves in a high frequency region and a shielded printed wiring board including the same. An electromagnetic shielding film 1 includes a shielding layer that is formed by a first metal layer mainly comprised of nickel and a second metal layer mainly comprised of copper, an adhesive layer formed on the second metal layer side of the shielding layer, and a protective layer formed on the first metal layer side of the shielding layer which is the opposite side of the shielding layer from the second metal layer side. The first metal layer has a thickness T1 of 2 μm or more and 10 μm or less, and the second metal layer has a thickness T2 of 2 μm or more and 10 μm or less.

5. 发明申请

US20150305144A1 SHIELD FILM AND SHIELD PRINTED WIRING BOARD 审中-公开
标题翻译：屏蔽膜和屏蔽印刷线路板
公开(公告)号：US20150305144A1
公开(公告)日：2015-10-22
申请号：US14405774
申请日：2013-06-04
申请人： TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
发明人： Hiroshi TAJIMA , Sirou YAMAUCHI
IPC分类号： H05K1/02 , H05K9/00
CPC分类号： H05K1/0221 , B32B7/02 , B32B7/12 , B32B15/08 , B32B15/20 , B32B27/32 , B32B2307/202 , B32B2307/206 , B32B2457/08 , H05K1/0215 , H05K1/0218 , H05K1/0298 , H05K1/0393 , H05K9/0088 , H05K2201/0355 , H05K2201/0715
摘要： Provided is a shield film having good shielding characteristics in the high frequency region, and a shield printed wiring board. A shield film, provided with, in a layered state: a plurality of metal layers (12, 14) (metal thin film (12), metal foil (14)); an insulating layer (13) disposed between the metal layers; and an electroconductive adhesive layer (15) disposed on the surface of the metal foil (14), from amongst the metal layers (12, 14), on which the insulating layer (13) is not disposed.
摘要翻译：提供了在高频区域具有良好屏蔽特性的屏蔽膜和屏蔽印刷布线板。以分层状态设置有多个金属层（12,14）（金属薄膜（12），金属箔（14））的屏蔽膜。设置在所述金属层之间的绝缘层（13）以及从未设置绝缘层（13）的金属层（12,14）中设置在金属箔（14）的表面上的导电粘合剂层（15）。

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