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1. 发明授权

US10633564B2 Thermally and electrically conductive adhesive composition 有权
公开(公告)号：US10633564B2
公开(公告)日：2020-04-28
申请号：US15313206
申请日：2015-05-28
申请人： TANAKA KIKINZOKU KOGYO K.K.
发明人： Shintaro Abe , Rikia Furusho
IPC分类号： C09J9/02 , C09J163/04 , H01L23/00 , C09J11/08 , C09K5/14 , C09J163/00 , C09J11/04 , C08G59/50 , C09J11/06 , H01L23/373 , C09J121/00 , H01B1/22 , H01B1/02 , C08G59/62 , C08K3/08
CPC分类号： C09J9/02 , C08G59/504 , C08G59/5033 , C08G59/621 , C09J11/04 , C09J11/06 , C09J11/08 , C09J121/00 , C09J163/00 , C09J163/04 , C09K5/14 , H01B1/02 , H01B1/22 , H01L23/3737 , H01L24/29 , C08K2003/0806 , H01L2224/2929 , H01L2224/29298 , H01L2224/29339 , H01L2924/0665 , H01L2924/07811 , H01L2924/12041 , H01L2924/2075 , H01L2924/20751 , C09J163/00 , C08K2003/0806 , C08L63/00 , C09J163/00 , C08K2201/001 , C08L63/00 , H01L2924/12041 , H01L2924/00012
摘要： The present invention relates to a thermally and electrically conductive adhesive composition, which includes (A) an electrically conductive filler, (B) an epoxy resin, (C) a reactive diluent, and (D) a curing agent, wherein the component (A) is a silver powder having an average particle diameter of 1 to 10 μm, the component (B) has two or more epoxy functional groups and aromatic rings in each molecule, the component (C) is a compound having two or more glycidyl ether functional groups in an aliphatic hydrocarbon chain and also having a molecular weight of 150 to 600, and the component (D) is a compound having two or more phenol functional groups in each molecule, a compound having two or more aniline functional groups in each molecule, or a mixture of these compounds, and the content of each of the components (A), (B), (C), and (D) is within a specific range.

2. 发明授权

US09668343B2 Photocurable electroconductive ink composition 有权
公开(公告)号：US09668343B2
公开(公告)日：2017-05-30
申请号：US14354736
申请日：2012-10-24
申请人： TANAKA KIKINZOKU KOGYO K.K.
发明人： Rikia Furusho , Yoshito Imai
IPC分类号： C09D11/52 , C09D11/101 , C09D11/037 , H01B1/22 , H05K1/09
CPC分类号： H05K1/097 , C09D11/037 , C09D11/101 , C09D11/52 , H01B1/22
摘要： Disclosed is a photocurable electroconductive ink composition including: (A) an oligomer of urethane acrylates, (B) three types of acrylates composed of either tetrafunctional acrylates or trifunctional acrylates, difunctional acrylates and monofunctional acrylates, (C) an electroconductive filler, (D) two or more types of photopolymerization initiators and (E) a polymeric dispersing agent, wherein the amount of the electroconductive filler (C) to be mixed is from 77 to 85% by mass based on the total mass of the photocurable electroconductive ink composition, and 80% by mass or more of the electroconductive filler (C) is a scaly, foil-like or flakey silver powder having a particle size corresponding to a particle size distribution at 50% of more than 5 μm.

3. 发明授权

US09982155B2 Photocurable electroconductive ink composition 有权
公开(公告)号：US09982155B2
公开(公告)日：2018-05-29
申请号：US15318913
申请日：2015-06-22
申请人： TANAKA KIKINZOKU KOGYO K.K.
发明人： Kanako Furutachi , Rikia Furusho , Yoshito Imai , Kenichiro Takaoka
IPC分类号： C08F2/46 , C08F2/50 , C08G61/04 , C09D11/52 , C09D11/101 , C09D11/105 , H01B1/22 , H01B5/14 , H01B13/00 , H05K3/12 , B41F15/06 , C09D11/03 , C09D11/107 , H05K1/09 , H05K3/22 , C09D11/037
CPC分类号： C09D11/52 , B41F15/06 , C09D11/03 , C09D11/037 , C09D11/101 , C09D11/105 , C09D11/107 , H01B1/22 , H01B5/14 , H01B13/00 , H05K1/095 , H05K3/12 , H05K3/1216 , H05K3/22 , H05K2203/0514
摘要： [Problem] Provided is a photocurable electroconductive ink composition for screen printing which can provide printability, printing precision and adhesiveness on a substrate good enough for screen printing, and can show stable electroconductive properties.[Solution] A photocurable electroconductive ink composition for screen printing, comprising: (A) an electroconductive filler, (B) a photopolymerizable resin precursor consisting of an oligomer of urethane acrylate, monofunctional acrylate and polyfunctional acrylate, (C) an alkyd resin, (D) two or more photopolymerization initiators and (E) a polymer dispersant, in which the content of the electroconductive filler (A) is 70 to 90 mass % relative to the total mass of the photocurable electroconductive ink composition, and more than 50 mass % of the electroconductive filler is silver powder in a scale-like, foil-like or flake-like form having a particle diameter at 50 % particle size distribution of 0.3 to 3.0 μm, and the total content of the photopolymerizable resin precursor (B) is 10 to 24 mass % relative to the total mass of the photocurable electroconductive ink composition, and the content of the oligomer of urethane acrylate is 5 mass % or less relative to the total mass of the photocurable electroconductive ink composition, and the content of the alkyd resin (C) is 1 to 10 mass % relative to the total mass of the photocurable electroconductive ink composition.

4. 发明申请

US20140311779A1 PHOTOCURABLE ELECTROCONDUCTIVE INK COMPOSITION 有权
标题翻译：可光电导电墨水组合物
公开(公告)号：US20140311779A1
公开(公告)日：2014-10-23
申请号：US14354736
申请日：2012-10-24
申请人： TANAKA KIKINZOKU KOGYO K.K.
发明人： Rikia Furusho , Yoshito Imai
IPC分类号： H05K1/09
CPC分类号： H05K1/097 , C09D11/037 , C09D11/101 , C09D11/52 , H01B1/22
摘要： Disclosed is a photocurable electroconductive ink composition including: (A) an oligomer of urethane acrylates, (B) three types of acrylates composed of either tetrafunctional acrylates or trifunctional acrylates, difunctional acrylates and monofunctional acrylates, (C) an electroconductive filler, (D) two or more types of photopolymerization initiators and (E) a polymeric dispersing agent, wherein the amount of the electroconductive filler (C) to be mixed is from 77 to 85% by mass based on the total mass of the photocurable electroconductive ink composition, and 80% by mass or more of the electroconductive filler (C) is a scaly, foil-like or flakey silver powder having a particle size corresponding to a particle size distribution at 50% of more than 5 μm.
摘要翻译：公开了一种光固化导电油墨组合物，其包含：（A）聚氨酯丙烯酸酯的低聚物，（B）由四官能丙烯酸酯或三官能丙烯酸酯组成的三种丙烯酸酯，二官能丙烯酸酯和单官能丙烯酸酯，（C）导电填料，（D）两种或更多种类型的光聚合引发剂和（E）聚合物分散剂，其中待混合的导电填料（C）的量相对于可光固化导电油墨组合物的总质量为77-85质量％，和 80质量％以上的导电性填料（C）是鳞片状，箔状或鳞片状银粉末，其粒径对应于50％以上的粒径分布大于5μm。

5. 发明授权

US11118089B2 Thermally-conductive and electrically-conductive adhesive composition 有权
公开(公告)号：US11118089B2
公开(公告)日：2021-09-14
申请号：US16619356
申请日：2018-06-06
申请人： TANAKA KIKINZOKU KOGYO K.K.
发明人： Shintaro Abe , Kanako Furutachi , Takeshi Kondo , Rikia Furusho
IPC分类号： C09J9/02 , C09J163/00 , C09K5/14 , H01B1/22
摘要： The purpose of the present invention is to provide a thermally-conductive and electrically-conductive adhesive composition which is for use as a die bonding material and which has high heat-conducting properties and high-temperature adhesiveness. The present invention relates to a thermally-conductive and electrically-conductive adhesive composition including (A) an electrically conductive filler, (B) an epoxy resin, (C) a reactive diluent, and (D) a curing agent.

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