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1. 发明申请

US20140290990A1 CURABLE COMPOSITION, CURED COATING FILM PREPARED FROM CURABLE COMPOSITION, AND PRINTED WIRING BOARD INCLUDING THE CURED FILM 有权
标题翻译：可固化组合物，可固化组合物制成的固化涂膜，以及包括固化膜的印刷电路板
公开(公告)号：US20140290990A1
公开(公告)日：2014-10-02
申请号：US14227249
申请日：2014-03-27
申请人： TAIYO INK MFG. CO., LTD.
发明人： Masayuki SHIMURA , Yoshiyuki FURUTA , Masao YUMOTO , Shoji MINEGISHI
IPC分类号： H05K1/03
CPC分类号： H05K3/287 , H05K1/0393 , H05K2201/0154 , H05K2203/013
摘要： A curable composition to be used for a printed wiring board is disclosed, which has an excellent flexibility and an excellent adhesive property with respect to both a plastic substrate and a conductive layer in the printed wiring board. The curable composition includes (A) a (meth)acrylate compound having a polyene structure, (B) a (meth)acrylate compound having a hydroxyl group; and (C) a photopolymerization initiator. From the curable composition, a cured coating film, and a printed wiring board including the cured coating film in the form of a predetermined pattern are obtained.
摘要翻译：公开了一种用于印刷电路板的可固化组合物，其对于印刷电路板中的塑料基板和导电层都具有优异的柔性和优异的粘合性能。可固化组合物包括（A）具有多烯结构的（甲基）丙烯酸酯化合物，（B）具有羟基的（甲基）丙烯酸酯化合物; 和（C）光聚合引发剂。从固化性组合物得到固化涂膜和包含固化涂膜的印刷线路板，其形式为预定图案。

2. 发明申请

US20170048974A1 RESIN COMPOSITION FOR PERMANENT INSULATING FILM, PERMANENT INSULATING FILM, MULTILAYER PRINTED WIRING BOARD, AND PROCESS FOR PRODUCING THE SAME 审中-公开
标题翻译：用于永久绝缘膜，永久绝缘膜，多层印刷线路板的树脂组合物及其制造方法
公开(公告)号：US20170048974A1
公开(公告)日：2017-02-16
申请号：US15306300
申请日：2015-03-19
申请人： TAIYO INK MFG. CO., LTD.
发明人： Touko SHIINA , Shoji MINEGISHI
IPC分类号： H05K1/03 , H05K3/00 , H05K3/46 , H05K3/42 , H05K1/02 , H05K1/11
CPC分类号： H05K1/0353 , H05K1/0298 , H05K1/0373 , H05K1/115 , H05K3/0047 , H05K3/184 , H05K3/429 , H05K3/46 , H05K3/4602 , H05K2201/0212 , H05K2201/0236
摘要： A resin composition for a permanent insulating film is provided, by which, in particular, partial through-holes obtained by partitioning a through-hole can be easily and precisely formed as designed without a deposition of catalytic species (seed) in a plating resist portion. The present invention provides a resin composition for a permanent insulating film, including a thermosetting resin, a resin filler, and a compound containing at least one atom selected from a sulfur atom and a nitrogen atom. The present invention also provides a multilayer printed wiring board in which conductive layers having a circuit pattern and insulation layers are alternately overlaid with each other, and a through-hole enabling electric conductivity among conductive layers via a through-hole. The through-hole includes a plating resist portion provided on either of an interlaminar part between the conductive layer and the insulation layer or another interlaminar part between the insulation layers, or both. The plating portion(s) is/are provided on the interlaminar parts which had been exposed in an opening as the through-hole, and on an exposed region other than the plating resist portion, and the plating resist portion is made of a cured product of the resin composition.
摘要翻译：提供了一种用于永久绝缘膜的树脂组合物，特别地，通过分隔通孔获得的部分通孔可以容易且精确地形成，而不会在电镀抗蚀剂部分中沉积催化物质（种子）。本发明提供一种用于永久绝缘膜的树脂组合物，其包含热固性树脂，树脂填料和含有至少一个选自硫原子和氮原子的原子的化合物。本发明还提供一种多层印刷布线板，其中具有电路图案和绝缘层的导电层彼此交替地叠置，并且通孔经由通孔使导电层之间能够导电。通孔包括设置在导电层和绝缘层之间的层间部分之间或绝缘层之间的另一层间部分或两者之间的电镀抗蚀剂部分。电镀部分设置在作为通孔的开口中露出的层间部分上，以及在电镀抗蚀剂部分以外的暴露区域上，并且电镀抗蚀部分由固化产物的树脂组合物。

3. 发明申请

US20150010735A1 CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, PRINTED CIRCUIT BOARD COMPRISING THE SAME, AND METHOD FOR PRODUCING THE CURED PRODUCT 有权
标题翻译：可固化树脂组合物，其固化产品，包括其的印刷电路板以及生产固化产品的方法
公开(公告)号：US20150010735A1
公开(公告)日：2015-01-08
申请号：US14324358
申请日：2014-07-07
申请人： Taiyo Ink MFG. Co., Ltd.
发明人： Kazuya OKADA , Shuichi YAMAMOTO , Shoji MINEGISHI , Daichi OKAMOTO , Xiaozhu WEI
IPC分类号： G03F7/038 , G03F7/20
CPC分类号： G03F7/40 , G03F7/038 , H05K1/03 , Y10T428/24802
摘要： An alkaline development-type curable resin composition having an excellent strength against tearing, breaking, distortion and torsion, and excellent toughness, a cured product of the curable resin composition, a printed circuit board having the cured product, and a process for manufacturing the cured product are disclosed. A curable resin composition is obtained, which contains (A) a thermoplastic resin, (B) a thermosetting component, (C) an alkali-soluble component, and at least one of (D-1) a photopolymerization initiator and (D-2) a photo-base generator, the thermoplastic resin (A) having two or more glass transition points including two glass transition points Tgx and Tgy, which satisfy Tgx>30° C. and Tgy
摘要翻译：具有优异的撕裂，断裂，变形和扭转强度以及优异的韧性的固化性树脂组合物的固化产物，具有固化产物的印刷电路板的碱性显影型固化性树脂组合物和固化产品被公开。得到固化性树脂组合物，其含有（A）热塑性树脂，（B）热固性组分，（C）碱溶性组分，和（D-1）光聚合引发剂和（D-2）中的至少一种）光源发生器，所述热塑性树脂（A）具有两个或更多个玻璃化转变点，包括两个玻璃化转变点Tgx和Tgy，其满足Tgx> 30℃和Tgy <0℃，并且所述热固性组分（B ），其玻璃化转变点Tgz满足Tgz≥Tgy+ 20℃。此外，得到固化性树脂组合物的固化物，具有固化物的印刷电路板和固化物的制造方法。

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