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1. 发明申请

US20180151466A1 HEAT TRANSFER STRUCTURES AND METHODS FOR IC PACKAGES 审中-公开
公开(公告)号：US20180151466A1
公开(公告)日：2018-05-31
申请号：US15658948
申请日：2017-07-25
申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
发明人： Ying-Chih HSU , Alan ROTH , Chuei-Tang WANG , Chih-Yuan CHANG , Eric SOENEN , Chih-Lin CHEN
IPC分类号： H01L23/367 , H01L23/48 , H01L23/498 , H01L21/48
CPC分类号： H01L23/3677 , H01L21/486 , H01L23/481 , H01L23/49822 , H01L2224/18
摘要： A package structure includes a first package layer, a second package layer, and a chip layer positioned between the first package layer and the second package layer. The first package layer includes an electrical signal structure electrically isolated from a first thermal conduction structure. The chip layer includes an integrated circuit (IC) chip electrically connected to the electrical signal structure, a molding material, and a through-via positioned in the molding material. The first thermal conduction structure, the through-via, and the second thermal conduction structure are configured as a low thermal resistance path from the IC chip to a surface of the second package layer opposite the chip layer.

2. 发明申请

US20190157180A1 HEAT TRANSFER STRUCTURES AND METHODS FOR IC PACKAGES 审中-公开
公开(公告)号：US20190157180A1
公开(公告)日：2019-05-23
申请号：US16204953
申请日：2018-11-29
申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
发明人： Ying-Chih HSU , Alan ROTH , Chuei-Tang WANG , Chih-Yuan CHANG , Eric SOENEN , Chih-Lin CHEN
IPC分类号： H01L23/367 , H01L23/498 , H01L23/48 , H01L21/48
CPC分类号： H01L23/3677 , H01L21/486 , H01L23/481 , H01L23/49822 , H01L23/5389 , H01L2224/18
摘要： An integrated circuit (IC) package structure includes an electrical signal path, a low thermal resistance path and a substrate that includes a first device and a second device. The first device and the second device are part of an IC chip. The electrical signal path is from the first device to a top surface of the IC chip. The low thermal resistance path extends from the second device to the top surface of the IC chip. The low thermal resistance path is electrically isolated from the electrical signal path. The second device is thermally coupled to the first device by a low thermal resistance substrate path.

3. 发明申请

US20200176349A1 HEAT TRANSFER STRUCTURES AND METHODS FOR IC PACKAGES 审中-公开
公开(公告)号：US20200176349A1
公开(公告)日：2020-06-04
申请号：US16785248
申请日：2020-02-07
申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
发明人： Ying-Chih HSU , Alan ROTH , Chuei-Tang WANG , Chih-Yuan CHANG , Eric SOENEN , Chih-Lin CHEN
IPC分类号： H01L23/367 , H01L21/48 , H01L23/48 , H01L23/498
摘要： A method of transferring heat in a package includes conducting heat from a first device to a second device by a low thermal resistance substrate path in a chip layer of the package, conducting heat from an integrated circuit (IC) to a first package layer of the package, conducting heat from the first package layer of the package to at least a first set of through-vias positioned in the chip layer, and conducting heat from the first set of through-vias to a surface of a second package layer opposite the chip layer. The first device and the second device is part of the IC chip. The first package layer is adjacent to the chip layer.

4. 发明申请

US20150077078A1 SELF-ADJUSTING REGULATOR AND METHOD OF USING SAME 有权
标题翻译：自调节调节器及其使用方法
公开(公告)号：US20150077078A1
公开(公告)日：2015-03-19
申请号：US14030573
申请日：2013-09-18
申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
发明人： Ying-Chih HSU , Alan ROTH , Eric SOENEN
IPC分类号： H02M3/156
CPC分类号： H02M3/156 , H02M1/36 , H02M3/157 , H02M3/1588 , H02M2001/0025 , H02M2003/1566 , Y02B70/1466
摘要： A self-adjusting regulator includes a power stage adjusting an output voltage and a control loop for controlling the power stage. The control loop includes a compensator adjusting a bandwidth in response to at least one compensator control signal, and an oscillator controlling a switching speed in response to at least one oscillator control signal. The self-adjusting regulator further includes a voltage sensing control circuit controlling the control loop. The voltage sensing control circuit generating the at least one compensator control signal and the at least one oscillator control signal based on a comparison of the output voltage and a reference voltage. In a low speed mode, the compensator outputs a first bandwidth, and the oscillator outputs a first switching speed. In a high speed mode, the compensator outputs a second bandwidth greater than the first bandwidth, and the oscillator outputs a second switching speed faster than the first switching speed.
摘要翻译：自调节调节器包括调节输出电压的功率级和用于控制功率级的控制回路。控制回路包括响应于至少一个补偿器控制信号调整带宽的补偿器和响应于至少一个振荡器控制信号来控制切换速度的振荡器。自调节调节器还包括控制控制回路的电压感测控制电路。电压感测控制电路基于输出电压和参考电压的比较来产生至少一个补偿器控制信号和至少一个振荡器控制信号。在低速模式下，补偿器输出第一带宽，并且振荡器输出第一切换速度。在高速模式中，补偿器输出大于第一带宽的第二带宽，并且振荡器比第一切换速度输出第二切换速度。

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