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    • 4. 发明授权
    • Method and apparatus for depositing thin films on a surface
    • 用于在表面上沉积薄膜的方法和装置
    • US07537662B2
    • 2009-05-26
    • US10428207
    • 2003-04-29
    • Pekka J. SoininenSven Lindfors
    • Pekka J. SoininenSven Lindfors
    • C23C16/455C23F1/00H01L21/306C23C16/52
    • C23C16/4412C23C16/45544C23C16/45565C23C16/45574
    • A method and apparatus for depositing thin films onto a substrate is provided. The apparatus includes a gas injection structure that is positioned within a reaction chamber that has a platform. The gas injection structure may be positioned above or below the platform and comprises a first gas injector and a second gas injector. The first gas injector is in fluid communication with a first reactant source and a purge gas source. Similarly, the second gas injector is in fluid communication with a second reactant source and a purge gas source. The first and second injectors include hollow tubes with apertures opening to the reaction chamber. In one configuration, the tubes are in the form of interleaved branching tubes forming showerhead rakes. Methods are provided for deposition, in which multiple pulses of purge and reactant gases are provided for each purge and reactant step.
    • 提供了一种用于在衬底上沉积薄膜的方法和装置。 该装置包括位于具有平台的反应室内的气体注入结构。 气体注入结构可以位于平台的上方或下方,并且包括第一气体喷射器和第二气体喷射器。 第一气体注射器与第一反应物源和净化气体源流体连通。 类似地,第二气体喷射器与第二反应物源和净化气体源流体连通。 第一和第二注射器包括具有通向反应室的孔的中空管。 在一种配置中,管是形成喷头耙的交错分支管的形式。 提供了用于沉积的方法,其中为每个吹扫和反应物步骤提供多个吹扫和反应气体脉冲。
    • 10. 发明申请
    • METHOD FOR GROWING THIN FILMS
    • 生长薄膜的方法
    • US20090181169A1
    • 2009-07-16
    • US12361139
    • 2009-01-28
    • Tuomo SuntolaSven Lindfors
    • Tuomo SuntolaSven Lindfors
    • C23C16/44
    • C23C16/45525C23C16/455C23C16/45527C23C16/45546C30B25/10C30B25/14
    • The invention relates to a method and apparatus for growing a thin film onto a substrate, in which method a substrate placed in a reaction space (21) is subjected to alternately repeated surface reactions of at least two vapor-phase reactants for the purpose of forming a thin film. According to the method, said reactants are fed in the form of vapor-phase pulses repeatedly and alternately, each reactant separately from its own source, into said reaction space (21), and said vapor-phase reactants are brought to react with the surface of the substrate for the purpose of forming a solid-state thin film compound on said substrate. According to the invention, the gas volume of said reaction space is evacuated by means of a vacuum pump essentially totally between two successive vapor-phase reactant pulses. By virtue of transporting the different starting material species at different times through the apparatus effectively isolates the starting materials from each other thus preventing their premature mutual reactions.
    • 本发明涉及一种用于将薄膜生长到基底上的方法和装置,其中放置在反应空间(21)中的基底经受至少两种气相反应物的交替重复的表面反应,以形成 一个薄膜。 根据该方法,所述反应物以气相脉冲的形式反复地且交替地以每种反应物与其自身源分开进入所述反应空间(21),并使所述气相反应物与表面反应 的基板,用于在所述基板上形成固态薄膜化合物。 根据本发明,通过基本上完全在两个连续的气相反应物脉冲之间的真空泵将所述反应空间的气体体积抽真空。 由于通过装置在不同时间运送不同的起始物质,有效地将原料彼此隔离,从而防止其过早的相互反应。