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1. 发明申请

US20110317328A1 CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：陶瓷电子元件及其制造方法
公开(公告)号：US20110317328A1
公开(公告)日：2011-12-29
申请号：US13166993
申请日：2011-06-23
申请人： Susumu TANIGUCHI , Satoshi Kurimoto , Shintaro Tokumitsu , Ryugen Yanagibashi , Miyuki Yanagida , Hisayuki Abe
发明人： Susumu TANIGUCHI , Satoshi Kurimoto , Shintaro Tokumitsu , Ryugen Yanagibashi , Miyuki Yanagida , Hisayuki Abe
IPC分类号： H01G4/12 , H01C7/10
CPC分类号： H01G4/12 , H01G4/005 , H01G4/228 , H01G4/232 , H01G4/30
摘要： An array-type ceramic electronic component C1 includes a ceramic body 1 in which internal electrodes are buried and a plurality of terminal electrodes 11 to 16 formed on the ceramic body 1. The terminal electrodes 11 to 16 have electrode layers formed by baking a conductive green sheet.
摘要翻译：阵列型陶瓷电子部件C1包括埋设有内部电极的陶瓷体1和形成在陶瓷体1上的多个端子电极11〜16。端子电极11〜16具有通过将导电性绿色片。

2. 发明授权

US08553390B2 Ceramic electronic component 有权
标题翻译：陶瓷电子元件
公开(公告)号：US08553390B2
公开(公告)日：2013-10-08
申请号：US13177878
申请日：2011-07-07
申请人： Susumu Taniguchi , Miyuki Yanagida , Hisayuki Abe , Yukari Inoue , Masataka Kitagami
发明人： Susumu Taniguchi , Miyuki Yanagida , Hisayuki Abe , Yukari Inoue , Masataka Kitagami
IPC分类号： H01G4/06 , H01G4/228 , H01G4/005
CPC分类号： H01G4/12 , H01F17/0013 , H01F27/292 , H01G4/005 , H01G4/232
摘要： A ceramic electronic component 100 includes a ceramic body 1 in which internal electrodes containing a metal component is buried, and a pair of terminal electrodes 3 provided to cover both end surfaces 11 of the ceramic body to which the internal electrodes are exposed. Each of the terminal electrodes 3 has a first electrode layer and a second electrode layer formed by baking a conductive green sheet from a side close to the ceramic body 1. The second electrode layer contains the metal component diffused from the internal electrodes.
摘要翻译：陶瓷电子部件100包括陶瓷体1，其中埋设有包含金属成分的内部电极和设置成覆盖内部电极暴露于陶瓷体的两个端面11的一对端子电极3。端子电极3中的每一个具有第一电极层和通过从靠近陶瓷体1的一侧烘烤导电性生片而形成的第二电极层。第二电极层包含从内部电极扩散的金属成分。

3. 发明申请

US20120007709A1 CERAMIC ELECTRONIC COMPONENT 有权
标题翻译：陶瓷电子元件
公开(公告)号：US20120007709A1
公开(公告)日：2012-01-12
申请号：US13177878
申请日：2011-07-07
申请人： Susumu Taniguchi , Miyuki Yanagida , Hisayuki Abe , Yukari Inoue , Masataka Kitagami
发明人： Susumu Taniguchi , Miyuki Yanagida , Hisayuki Abe , Yukari Inoue , Masataka Kitagami
IPC分类号： H01F5/00 , H01G4/12
CPC分类号： H01G4/12 , H01F17/0013 , H01F27/292 , H01G4/005 , H01G4/232
摘要： A ceramic electronic component 100 includes a ceramic body 1 in which internal electrodes containing a metal component is buried, and a pair of terminal electrodes 3 provided to cover both end surfaces 11 of the ceramic body to which the internal electrodes are exposed. Each of the terminal electrodes 3 has a first electrode layer and a second electrode layer formed by baking a conductive green sheet from a side close to the ceramic body 1. The second electrode layer contains the metal component diffused from the internal electrodes.
摘要翻译：陶瓷电子部件100包括陶瓷体1，其中埋设有包含金属成分的内部电极和设置成覆盖内部电极暴露于陶瓷体的两个端面11的一对端子电极3。端子电极3中的每一个具有第一电极层和通过从靠近陶瓷体1的一侧烘烤导电性生片所形成的第二电极层。第二电极层包含从内部电极扩散的金属成分。

4. 发明授权

US08183463B2 Plating film, printed wiring board, and module substrate 有权
标题翻译：电镀膜，印刷电路板和模块基板
公开(公告)号：US08183463B2
公开(公告)日：2012-05-22
申请号：US12869095
申请日：2010-08-26
申请人： Atsushi Sato , Hisayuki Abe , Takashi Ota , Miyuki Yanagida , Masumi Kameda
发明人： Atsushi Sato , Hisayuki Abe , Takashi Ota , Miyuki Yanagida , Masumi Kameda
IPC分类号： H05K1/09
CPC分类号： H05K3/244 , H05K1/141 , H05K3/3436 , H05K3/3442 , H05K2201/10636 , H05K2203/1476 , Y02P70/611 , Y02P70/613 , Y10T428/12458 , Y10T428/12889
摘要： The present invention provides a plating film 50 including a nickel plating layer containing phosphorus and a gold plating layer formed on the nickel plating layer, wherein the nickel plating layer has a phosphorus content of 11 to 16 mass %, and wherein (3×σ×100)/X is 10 or less, where X and σ are the average value and standard deviation of the phosphorus content in a surface of the nickel plating layer on the gold plating layer side, respectively; and a module substrate 100 having the plating film 50.
摘要翻译：本发明提供一种镀镍膜，它包括含镍的镀镍层和形成在镀镍层上的镀金层，其中镀镍层的磷含量为11〜16质量％，其中（3×＆ ×100）/ X为10以下，其中X和＆sgr; 分别是镀金层侧的镀镍层的表面的磷含量的平均值和标准偏差; 以及具有镀膜50的模块基板100。

5. 发明授权

US08383964B2 Terminal structure, printed wiring board, module substrate, and electronic device 有权
标题翻译：端子结构，印刷线路板，模块基板和电子设备
公开(公告)号：US08383964B2
公开(公告)日：2013-02-26
申请号：US12868410
申请日：2010-08-25
申请人： Atsushi Sato , Hisayuki Abe , Takashi Ota , Miyuki Yanagida , Masumi Kameda
发明人： Atsushi Sato , Hisayuki Abe , Takashi Ota , Miyuki Yanagida , Masumi Kameda
IPC分类号： H01L23/49
CPC分类号： H05K3/24 , H01G2/065 , H01G4/228 , H01L24/16 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01327
摘要： The present invention provides a terminal structure 14 including a terminal 12 having a conductor 40 containing at least one metal selected from the group consisting of gold, silver, and copper, a first layer containing phosphorus and nickel disposed on the conductor 40, and a second layer having a nickel/phosphorus atomic ratio smaller than that of the first layer and containing Ni3P disposed on the first layer; and solder 70 disposed on the second layer of the terminal 12, while the second layer has a thickness of at least 0.35 μm; and a module substrate 100 having the terminal structure.
摘要翻译：本发明提供一种端子结构14，其包括具有导体40的端子12，该导体40包含选自金，银和铜中的至少一种金属，设置在导体40上的含有磷和镍的第一层，以及第二层层，其镍/磷原子比小于第一层的镍/磷原子比，并且包含设置在第一层上的Ni 3 P; 和设置在端子12的第二层上的焊料70，而第二层具有至少0.35μm的厚度; 以及具有端子结构的模块基板100。

6. 发明申请

US20110056744A1 TERMINAL STRUCTURE, PRINTED WIRING BOARD, MODULE SUBSTRATE, AND ELECTRONIC DEVICE 有权
标题翻译：端子结构，印刷电路板，模块基板和电子设备
公开(公告)号：US20110056744A1
公开(公告)日：2011-03-10
申请号：US12868410
申请日：2010-08-25
申请人： Atsushi Sato , Hisayuki Abe , Takashi Ota , Miyuki Yanagida , Masumi Kameda
发明人： Atsushi Sato , Hisayuki Abe , Takashi Ota , Miyuki Yanagida , Masumi Kameda
IPC分类号： H01B5/00 , H05K1/11 , H05K5/00
CPC分类号： H05K3/24 , H01G2/065 , H01G4/228 , H01L24/16 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01327
摘要： The present invention provides a terminal structure 14 including a terminal 12 having a conductor 40 containing at least one metal selected from the group consisting of gold, silver, and copper, a first layer containing phosphorus and nickel disposed on the conductor 40, and a second layer having a nickel/phosphorus atomic ratio smaller than that of the first layer and containing Ni3P disposed on the first layer; and solder 70 disposed on the second layer of the terminal 12, while the second layer has a thickness of at least 0.35 μm; and a module substrate 100 having the terminal structure.
摘要翻译：本发明提供一种端子结构14，其包括具有导体40的端子12，该导体40包含选自金，银和铜中的至少一种金属，设置在导体40上的含有磷和镍的第一层，以及第二层层，其镍/磷原子比小于第一层的镍/磷原子比，并且包含设置在第一层上的Ni 3 P; 和设置在端子12的第二层上的焊料70，而第二层具有至少0.35μm的厚度; 以及具有端子结构的模块基板100。

7. 发明申请

US20110048774A1 PLATING FILM, PRINTED WIRING BOARD, AND MODULE SUBSTRATE 有权
标题翻译：电镀胶片，印刷电路板和模块基板
公开(公告)号：US20110048774A1
公开(公告)日：2011-03-03
申请号：US12869095
申请日：2010-08-26
申请人： Atsushi SATO , Hisayuki Abe , Takashi Ota , Miyuki Yanagida , Masumi Kameda
发明人： Atsushi SATO , Hisayuki Abe , Takashi Ota , Miyuki Yanagida , Masumi Kameda
IPC分类号： H05K1/09 , B32B15/01 , B32B5/14
CPC分类号： H05K3/244 , H05K1/141 , H05K3/3436 , H05K3/3442 , H05K2201/10636 , H05K2203/1476 , Y02P70/611 , Y02P70/613 , Y10T428/12458 , Y10T428/12889
摘要： The present invention provides a plating film 50 including a nickel plating layer containing phosphorus and a gold plating layer formed on the nickel plating layer, wherein the nickel plating layer has a phosphorus content of 11 to 16 mass %, and wherein (3×σ×100)/X is 10 or less, where X and σ are the average value and standard deviation of the phosphorus content in a surface of the nickel plating layer on the gold plating layer side, respectively; and a module substrate 100 having the plating film 50.
摘要翻译：本发明提供一种镀镍膜，它包括含镍的镀镍层和形成在镀镍层上的镀金层，其中镀镍层的磷含量为11〜16质量％，其中（3×＆ ×100）/ X为10以下，其中X和＆sgr; 分别是镀金层侧的镀镍层的表面的磷含量的平均值和标准偏差; 以及具有镀膜50的模块基板100。

8. 发明申请

US20090009370A1 TRANSCODER 失效
公开(公告)号：US20090009370A1
公开(公告)日：2009-01-08
申请号：US12144098
申请日：2008-06-23
申请人： Hiromu Hasegawa , Miyuki Yanagida
发明人： Hiromu Hasegawa , Miyuki Yanagida
IPC分类号： H03M7/00
CPC分类号： H04N19/40 , H04N19/124 , H04N19/149 , H04N19/61
摘要： A transcoder calculates a reference conversion factor on the basis of a ratio between a total target bit rate of a whole second stream and an total input bit rate of a whole first stream and calculates a coefficient of variation from the total target bit rate of the whole second stream and an average output bit rate of a converted second stream in the N period. Next, a quantization step conversion factor in the next (N+1) period is calculated by adding the coefficient of variation to the reference conversion factor. Then, a quantization step value of a second stream in the (N+1) period is calculated by multiplying a quantization step value of a first stream in the (N+1) period by the quantization step conversion factor.
摘要翻译：代码转换器基于整个第二流的总目标比特率与整个第一流的总输入比特率之间的比率来计算参考转换因子，并且从整体的总目标比特率计算变异系数第二流和在N个周期中转换的第二流的平均输出比特率。接下来，通过将变化系数与参考转换因子相加来计算下一个（N + 1）周期中的量化步长转换因子。然后，通过将第（N + 1）个周期中的第一流的量化步长值乘以量化步长转换因子来计算第（N + 1）周期中的第二流的量化步长值。

9. 发明申请

US20070232480A1 Dielectric particles, dielectric ceramic composition, and method of production of same 审中-公开
标题翻译：电介质颗粒，介电陶瓷组合物及其制造方法
公开(公告)号：US20070232480A1
公开(公告)日：2007-10-04
申请号：US11725484
申请日：2007-03-20
申请人： Miyuki Yanagida , Mitsuru Kojima , Tomoyoshi Fujimura , Akira Sato
发明人： Miyuki Yanagida , Mitsuru Kojima , Tomoyoshi Fujimura , Akira Sato
IPC分类号： C04B35/468
CPC分类号： C04B35/4682 , C04B35/62605 , C04B35/62645 , C04B35/62685 , C04B2235/3203 , C04B2235/3206 , C04B2235/3208 , C04B2235/3213 , C04B2235/3215 , C04B2235/3224 , C04B2235/3225 , C04B2235/3227 , C04B2235/3229 , C04B2235/3239 , C04B2235/3241 , C04B2235/3256 , C04B2235/3258 , C04B2235/3262 , C04B2235/3409 , C04B2235/3418 , C04B2235/365 , C04B2235/449 , C04B2235/5445 , C04B2235/6025 , C04B2235/6582 , C04B2235/6588 , C04B2235/662 , H01G4/1227 , H01G4/30
摘要： Dielectric particles including a main component including barium titanate and R oxide (where R is at least one element selected from Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu), wherein when defining the size of the dielectric particles as “D” and defining the region of a depth from the particle surface of 0% to 10% of said D as a surface region, a region of a depth from the particle surface of more than 10% to less than 40% of the D as an intermediate region, and a region of a depth from the particle surface of 40% to 50% of the D as a center region, in the surface region, the ratio of content of the R oxide decreases from the surface side toward the center of the dielectric particles and in the center region, the ratio of content of the R oxide increases from the surface side toward the center of the dielectric particles.
摘要翻译：包含钛酸钡和R氧化物的主要成分的电介质粒子（其中，R为选自Y，La，Ce，Pr，Nd，Pm，Sm，Eu，Gd，Tb，Dy，Ho，Er，Tm， Yb和Lu），其中当将电介质颗粒的尺寸定义为“D”并且将所述D的颗粒表面的深度的区域定义为作为表面区域的所述D的0％至10％时，在作为中间区域的D的10％以上且小于40％的粒子表面以及作为中心区域的D的粒子表面的深度的40％〜50％的区域， R氧化物的含量比从电介质颗粒的表面侧朝向中心减小，在中心区域，R氧化物的含量比从电介质颗粒的表面侧向中心增加。

10. 发明授权

US08548046B2 Transcoder 有权
标题翻译：转码器
公开(公告)号：US08548046B2
公开(公告)日：2013-10-01
申请号：US12394513
申请日：2009-02-27
申请人： Makoto Saito , Hiromu Hasegawa , Miyuki Yanagida
发明人： Makoto Saito , Hiromu Hasegawa , Miyuki Yanagida
IPC分类号： H04N7/26 , H04N7/12 , H04N7/46 , H04B1/66 , H04N7/50 , H04N7/32
CPC分类号： H04N19/40 , H04N19/115 , H04N19/126 , H04N19/139 , H04N19/14 , H04N19/149 , H04N19/172 , H04N19/177 , H04N19/179 , H04N19/192 , H04N19/61
摘要： A category setting part sets a type of a decoded image based on characteristics of the decoded image which are fineness of the decoded image and an intensity of movement of the decoded image. A code amount setting part sets a target code amount of an output image based on the type of the decoded image. A quantization step value setting part sets a quantization step value of the output image based on the target code amount of the output image. A transcoder can set the target code amount of the output image depending on fineness of the decoded image. The transcoder can distribute the target code amount of the output image to a reference image and a predicted image depending on the intensity of movement of the decoded image.
摘要翻译：类别设定部根据作为解码图像的细度的解码图像的特性和解码图像的移动强度来设定解码图像的种类。代码量设定部根据解码图像的种类来设定输出图像的目标代码量。量化步长值设定部根据输出图像的目标码量设定输出图像的量化步长值。代码转换器可以根据解码图像的细度来设置输出图像的目标代码量。代码转换器可以根据解码图像的移动强度将输出图像的目标代码量分配给参考图像和预测图像。

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