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    • 8. 发明授权
    • Method and apparatus for improving SRAM cell stability by using boosted word lines
    • 通过使用升压字线来提高SRAM单元稳定性的方法和装置
    • US07934181B2
    • 2011-04-26
    • US12130472
    • 2008-05-30
    • Hussein I. HanafiRichard Q. Williams
    • Hussein I. HanafiRichard Q. Williams
    • G06F17/50G11C16/06G11C7/00G11C8/00
    • G11C7/02G11C8/08G11C11/413
    • The present invention relates to methods and apparatus for improving the stability of static random access memory (SRAM) cells by using boosted word lines. Specifically, a boosted word line voltage (Vdd′) is applied to the word line of a selected SRAM cell, while such a boosted word line voltage (Vdd′) is sufficiently higher than the power supply voltage (Vdd) of the SRAM cell so as to improve the cell stability to a desired level. Specifically, a specific boosted word line voltage is predetermined for each SRAM cell based on the specific cell configuration, by using a circuit simulation program, such as the BERKELEY-SPICE simulation program. A boost voltage generator is then used to apply the predetermined boosted word line voltage to the selected SRAM cell.
    • 本发明涉及通过使用增强字线来提高静态随机存取存储器(SRAM)单元的稳定性的方法和装置。 具体地说,将升压的字线电压(Vdd')施加到所选择的SRAM单元的字线,而这样的升压字线电压(Vdd')比SRAM单元的电源电压(Vdd)充分高 以将细胞稳定性提高到所需水平。 具体地,通过使用例如BERKELEY-SPICE仿真程序的电路仿真程序,基于特定单元配置为每个SRAM单元预定特定的升压字线电压。 然后使用升压电压发生器将预定的升压字线电压施加到所选择的SRAM单元。
    • 9. 发明申请
    • BACK GATED SRAM CELL
    • US20100188889A1
    • 2010-07-29
    • US12752286
    • 2010-04-01
    • Hussein I. Hanafi
    • Hussein I. Hanafi
    • G11C11/00
    • H01L27/1108G11C11/412G11C11/413H01L29/785
    • Methods, devices and systems for a back gated static random access memory (SRAM) cell are provided. One method embodiment for operating an SRAM cell includes applying a potential to a back gate of a pair of cross coupled p-type pull up transistors in the SRAM during a write operation. The method includes applying a ground to the back gate of the pair of cross coupled p-type pull up transistors during a read operation. The charge stored on a pair of cross coupled storage nodes of the SRAM is coupled to a front gate and a back gate of a pair of cross coupled n-type pull down transistors in the SRAM during the write operation and during a read operation.
    • 提供了用于后门控静态随机存取存储器(SRAM)单元的方法,装置和系统。 用于操作SRAM单元的一个方法实施例包括在写入操作期间将电位施加到SRAM中的一对交叉耦合p型上拉晶体管的背栅极。 该方法包括在读取操作期间将接地施加到该对交叉耦合p型上拉晶体管的背栅极。 存储在SRAM的一对交叉耦合的存储节点上的电荷在写入操作期间和在读取操作期间耦合到SRAM中的一对交叉耦合的n型下拉晶体管的前栅极和后栅极。
    • 10. 发明授权
    • Buried biasing wells in FETs (Field Effect Transistors)
    • FET中的埋置偏置阱(场效应晶体管)
    • US07732286B2
    • 2010-06-08
    • US11845244
    • 2007-08-27
    • Hussein I. HanafiEdward J. Nowak
    • Hussein I. HanafiEdward J. Nowak
    • H01L21/336
    • H01L29/105H01L29/0653H01L29/66628H01L29/7834
    • A method for fabricating a semiconductor structure. The semiconductor structure comprises first and second source/drain regions; a channel region disposed between the first and second source/drain regions; a buried well region in physical contact with the channel region; and a buried barrier region being disposed between the buried well region and the first source/drain region and being disposed between the buried well region and the second source/drain region, wherein the buried barrier region is adapted for preventing current leakage and dopant diffusion between the buried well region and the first source/drain region and between the buried well region and the second source/drain region.
    • 一种半导体结构的制造方法。 半导体结构包括第一和第二源极/漏极区域; 设置在所述第一和第二源极/漏极区之间的沟道区; 与通道区域物理接触的掩埋阱区域; 并且埋置的阻挡区域设置在所述掩埋阱区域和所述第一源极/漏极区域之间并且设置在所述掩埋阱区域和所述第二源极/漏极区域之间,其中所述掩埋势垒区域适于防止所述掩埋阻挡区域之间的电流泄漏和掺杂剂扩散 埋入阱区域和第一源极/漏极区域以及掩埋阱区域和第二源极/漏极区域之间。