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    • 1. 发明申请
    • High heat dissipation LED device and its manufacturing method
    • 高散热LED器件及其制造方法
    • US20060046327A1
    • 2006-03-02
    • US10928322
    • 2004-08-30
    • Sung-Yueh ShiehDein-Run FungChi-Ming ChangMing-Fa Yang
    • Sung-Yueh ShiehDein-Run FungChi-Ming ChangMing-Fa Yang
    • H01L21/00
    • H01L33/641H01L33/56H01L2224/48091H01L2224/48247H01L2924/00014
    • A LED device with high heat dissipation capability has heat dissipating package formed by transparent epoxy and heat dissipating packing epoxy which is a mixture of heat dissipating particles and packing epoxy; during packing process the upper light emitting portion of the LED device is firstly packed with transparent packing epoxy which will not influence the illumination function of the LED device, and then the lower heat dissipating portion of the LED device is packed with heat dissipating packing epoxy through which the heat generated by the LED device may be dissipated to the ambient air when the LED device is lit by high electric current, so that the LED device of this invention may greatly improve the heat accumulation problem and increase light emission efficiency when it is lit; and, since the manufacturing method disclosed in the invention is suitable for the production of the frame type LED device, the process and equipment for producing the conventional frame type LED device could be directly employed for mass production of the high heat dissipation LED device of the invention without further modification.
    • 具有高散热能力的LED器件具有由透明环氧树脂和散热填料环氧树脂形成的散热封装,其是散热颗粒和填料环氧树脂的混合物; 在包装过程中,LED装置的上部发光部分首先用透明包装环氧树脂填充,不会影响LED装置的照明功能,然后LED装置的下部散热部分装有散热填料环氧树脂 当LED装置被高电流点亮时,LED装置产生的热量可能被耗散到环境空气中,使得本发明的LED装置可以大大地改善热积聚问题并且在点亮时增加发光效率 ; 并且由于本发明所公开的制造方法适用于框架式LED器件的生产,所以用于生产传统的框式LED器件的工艺和设备可以直接用于批量生产高散热LED器件 发明,无需进一步修改。