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    • 4. 发明授权
    • Semiconductor device and method of manufacturing the same
    • 半导体装置及其制造方法
    • US09281362B2
    • 2016-03-08
    • US14286441
    • 2014-05-23
    • Ja-Young LeeSe-myeong Jang
    • Ja-Young LeeSe-myeong Jang
    • H01L29/06H01L21/762H01L27/108H01L27/115
    • H01L29/0649H01L21/76229H01L27/10894H01L27/10897H01L27/11531
    • According to an example embodiment, a semiconductor device includes a substrate having a cell array region and a peripheral circuit region. The substrate includes first active regions defined by a first trench isolation region in the cell array region, a second active region defined by a second trench isolation region in the peripheral circuit region, and at least one deep trench isolation region. The first active regions may be aligned to extend longitudinally in a first direction in the cell array region. The at least one deep trench isolation region is recessed in the substrate to a level lower than those of other points of a bottom surface of the second trench isolation region in the peripheral circuit region. The at least one deep trench isolation region includes at least one point that is spaced apart in the first direction from a corresponding one of the first active regions.
    • 根据示例性实施例,半导体器件包括具有单元阵列区域和外围电路区域的衬底。 衬底包括由电池阵列区域中的第一沟槽隔离区域限定的第一有源区,由外围电路区域中的第二沟槽隔离区限定的第二有源区和至少一个深沟槽隔离区。 第一有源区可以对齐以在单元阵列区域中沿第一方向纵向延伸。 所述至少一个深沟槽隔离区域在所述衬底中凹陷到比所述外围电路区域中的所述第二沟槽隔离区域的底表面的其它点的电平低的水平。 所述至少一个深沟槽隔离区域包括在第一方向上与相应的第一有源区域间隔开的至少一个点。