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    • 4. 发明授权
    • Method for fabricating semiconductor device
    • 制造半导体器件的方法
    • US06391764B1
    • 2002-05-21
    • US09705704
    • 2000-11-06
    • Sung Kwon Lee
    • Sung Kwon Lee
    • H01L214763
    • H01L21/76801H01L21/76828
    • A method for fabricating a semiconductor device includes the steps of: forming a transistor on a semiconductor substrate; forming a first interlayer insulating film over the entire structure including the transistor; planarizing the first interlayer insulating film; forming a stabilized insulating film consisting of an insulating material having low thermal expansion and shrinkage on the first interlayer insulating film; forming an interconnection line on the stabilized insulating film; forming a second interlayer insulating film on the stabilized insulating film to cover the interconnection line; and forming a metal electrode on the second interlayer insulating film in order to contact the semiconductor substrate. The interconnection line on the interlayer insulating film does not move as a result of the thermal treatment process, and thus does not cause shorts with the metal electrode. As a result, the leakage current is prevented and the electrical properties of the semiconductor is improved.
    • 一种制造半导体器件的方法包括以下步骤:在半导体衬底上形成晶体管; 在包括晶体管的整个结构上形成第一层间绝缘膜; 平面化第一层间绝缘膜; 在第一层间绝缘膜上形成由热膨胀和收缩率低的绝缘材料构成的稳定绝缘膜; 在稳定绝缘膜上形成互连线; 在所述稳定绝缘膜上形成第二层间绝缘膜以覆盖所述互连线; 以及在所述第二层间绝缘膜上形成金属电极以与所述半导体衬底接触。 作为热处理工艺的结果,层间绝缘膜上的互连线不会移动,因此不会引起金属电极的短路。 结果,防止了漏电流,提高了半导体的电特性。
    • 5. 发明授权
    • Fabricating a thin film transistor having better punch through resistance and hot carrier effects
    • 制造具有更好的穿通电阻和热载流子效应的薄膜晶体管
    • US06589828B2
    • 2003-07-08
    • US09737774
    • 2000-12-18
    • Sung Kwon Lee
    • Sung Kwon Lee
    • H01L2100
    • H01L27/127H01L27/11H01L27/1108H01L27/1214H01L29/66765H01L29/78624
    • Fabricating thin film transistors. A gate electrode is formed on a substrate. A gate oxide film is then formed on the gate electrode. A polysilicon layer is deposited on the gate oxide film. An impurity ion is implanted into the polysilicon layer to control a threshold voltage of the polysilicon layer. A mask is formed on the polysilicon layer above the gate electrode, having the same width as the gate electrode. A second impurity ion is implanted into the exposed portion of the polysilicon layer using the mask, to form a lightly doped offset region on a drain region. The mask is removed. A second mask is formed on the polysilicon layer so as to cover a portion of the gate electrode and the light doped offset region. A Third impurity ion is implanted into the polysilicon layer using the second mask to form source/drain regions. The mask is removed.
    • 制造薄膜晶体管。 在基板上形成栅电极。 然后在栅电极上形成栅极氧化膜。 在栅极氧化膜上沉积多晶硅层。 将杂质离子注入到多晶硅层中以控制多晶硅层的阈值电压。 掩模形成在栅电极上方的多晶硅层上,具有与栅电极相同的宽度。 使用掩模将第二杂质离子注入到多晶硅层的暴露部分中,以在漏区上形成轻掺杂的偏移区域。 去除面具。 在多晶硅层上形成第二掩模,以覆盖栅极电极和掺杂光的偏移区域的一部分。 使用第二掩模将第三杂质离子注入到多晶硅层中以形成源/漏区。 去除面具。
    • 6. 发明授权
    • Semiconductor device manufacturing method for preventing electrical shorts between lower and upper interconnection layers
    • 用于防止下互连层和上互连层之间的电短路的半导体器件制造方法
    • US06436806B2
    • 2002-08-20
    • US09750229
    • 2000-12-29
    • Sung Kwon Lee
    • Sung Kwon Lee
    • H01L214763
    • H01L21/02129H01L21/02126H01L21/022H01L21/31625H01L21/76801H01L21/76819
    • A method for manufacturing a semiconductor device is provided which suppresses migration of lower interconnectors formed on a borophosphosilicate glass (BPSG) layer toward upper interconnectors as a result of secondary reflowing of the BPSG layer during subsequent thermal processing, thereby preventing the formation of electrical shorts. The semiconductor device manufacturing method includes: forming a transistor; depositing a first interlevel dielectric film (ILD) to cover the transistor; depositing a BPSG layer as a planarization layer on the first interlevel dielectric film; reflowing the BPSG layer; etching the BPSG layer using Ar ion sputtering until a portion of the film is exposed, thereby planarizing the surfaces of the first ILD and the BPSG layers forming an interconnector on the exposed portion of the first interlevel dielectric film; depositing a second interlevel dielectric film to cover the interconnector and the BPSG layer; and forming metal electrodes on the second interlevel dielectric film, the metal electrodes being in contact with predetermined regions of the transistor.
    • 提供一种制造半导体器件的方法,其在随后的热处理期间由于BPSG层的二次回流而抑制了形成在硼磷硅酸盐玻璃(BPSG)层上的下部互连器向上部互连器的迁移,从而防止形成电气短路。 半导体器件制造方法包括:形成晶体管; 沉积第一层间绝缘膜(ILD)以覆盖晶体管; 在第一层间绝缘膜上沉积BPSG层作为平坦化层; 回流BPSG层; 使用Ar离子溅射对BPSG层进行蚀刻,直到膜的一部分露出,从而在第一层间绝缘膜的暴露部分上平坦化形成互连器的第一ILD和BPSG层的表面; 沉积第二层间绝缘膜以覆盖互连器和BPSG层; 以及在所述第二层间电介质膜上形成金属电极,所述金属电极与所述晶体管的预定区域接触。
    • 7. 发明授权
    • Predriver and output driver circuit using the same
    • 前驱和输出驱动电路使用相同
    • US07956654B2
    • 2011-06-07
    • US12455595
    • 2009-06-04
    • Sung Kwon Lee
    • Sung Kwon Lee
    • H03B1/00
    • H03K19/018521
    • An output driver circuit includes a predriver control signal generation unit receiving a pull-up code signal, a pull-down code signal, a predriver selection signal and a read control signal and generating a pull-up control signal and a pull-down control signal; a predriver driven in response to the pull-up control signal and the pull-down control signal and receiving an internal data to drive a pull-up driving signal and a pull-down driving signal; and a driver receiving the pull-up driving signal and the pull-down driving signal and driving an output data outputted to a DQ pad, wherein the pull-up control signal and the pull-down control signal are enabled when the predriver is selected in a read operation period and a preset combination of the code signals is inputted.
    • 输出驱动器电路包括接收上拉代码信号的预驱动控制信号生成单元,下拉代码信号,预驱动选择信号和读控制信号,并产生上拉控制信号和下拉控制信号 ; 响应于上拉控制信号和下拉控制信号驱动的预驱动器,并接收内部数据以驱动上拉驱动信号和下拉驱动信号; 以及接收上拉驱动信号和下拉驱动信号并驱动输出到DQ焊盘的输出数据的驱动器的驱动器,其中当选择预驱动器时,上拉控制信号和下拉控制信号被使能 输入读取操作期间和代码信号的预设组合。
    • 8. 发明申请
    • Predriver and output driver circuit using the same
    • 前驱和输出驱动电路使用相同
    • US20100194448A1
    • 2010-08-05
    • US12455595
    • 2009-06-04
    • Sung Kwon Lee
    • Sung Kwon Lee
    • H03K3/00
    • H03K19/018521
    • An output driver circuit includes a predriver control signal generation unit receiving a pull-up code signal, a pull-down code signal, a predriver selection signal and a read control signal and generating a pull-up control signal and a pull-down control signal; a predriver driven in response to the pull-up control signal and the pull-down control signal and receiving an internal data to drive a pull-up driving signal and a pull-down driving signal; and a driver receiving the pull-up driving signal and the pull-down driving signal and driving an output data outputted to a DQ pad, wherein the pull-up control signal and the pull-down control signal are enabled when the predriver is selected in a read operation period and a preset combination of the code signals is inputted.
    • 输出驱动器电路包括接收上拉代码信号的预驱动控制信号生成单元,下拉代码信号,预驱动选择信号和读控制信号,并产生上拉控制信号和下拉控制信号 ; 响应于上拉控制信号和下拉控制信号驱动的预驱动器,并接收内部数据以驱动上拉驱动信号和下拉驱动信号; 以及接收上拉驱动信号和下拉驱动信号并驱动输出到DQ焊盘的输出数据的驱动器的驱动器,其中当选择预驱动器时,上拉控制信号和下拉控制信号被使能 输入读取操作期间和代码信号的预设组合。