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    • 4. 发明申请
    • REFRIGERATOR AND REFRIGERATOR DOOR
    • 制冷机和制冷器门
    • US20110220662A1
    • 2011-09-15
    • US12673137
    • 2008-08-27
    • Hyun-Cheol KimChang-Lim LeeBoo-Youn LeeSang-Hu Park
    • Hyun-Cheol KimChang-Lim LeeBoo-Youn LeeSang-Hu Park
    • F25D23/00F25D23/02
    • F25D23/028
    • Provided is a refrigerator and a refrigerator door. The refrigerator includes a main body configured to form a storage space, a door configured to selectively open and close the storage space, handle fixing parts coupled to the door and protruding from the door, a door handle disposed at the door and configured to be grasped by a user for opening and closing the door, holders disposed at both sides of the door handle for receiving the handle fixing parts, and a detachment preventing part. The detachment preventing part is coupled to a side of the holder at an acute angle with a front surface of the door and is configured to be locked by the handle fixing part for fixing the door handle. The door handle can be attached to the door more easily and firmly.
    • 提供冰箱和冰箱门。 冰箱包括构造成形成存储空间的主体,被构造成选择性地打开和关闭存储空间的门,处理结合到门并从门突出的固定部件,设置在门处并构造成被抓握的门把手 用于打开和关闭门的使用者,设置在门把手的两侧的保持器,用于容纳手柄固定部分,以及防脱部分。 分离防止部分以与车门前表面成锐角的方式联接到保持器的一侧,并被构造成由手柄固定部分锁定以固定门把手。 门把手可以更方便,牢固地安装在门上。
    • 8. 发明授权
    • Epoxy resin composition and laminate using the same
    • 环氧树脂组合物和使用其的层合物
    • US06703124B2
    • 2004-03-09
    • US10049117
    • 2002-02-08
    • Young-Sik KimHyun-Cheol KimDong-Rak Shin
    • Young-Sik KimHyun-Cheol KimDong-Rak Shin
    • D02G3100
    • B32B15/14C08G59/18C08G59/38C08G59/5073C08L63/00H05K1/0326Y10T428/24917Y10T428/249924Y10T428/2907Y10T428/2916Y10T428/2933Y10T428/2938
    • The present invention relates to a nonflammable epoxy resin composition for using a thin copper film laminate, which is applied to a printed circuit board (PCB), and using the same. The present invention provides for nonflammable epoxy resin composition for using a thin copper film laminate, comprising bisphenol A-type epoxy resin, multifunctional epoxy resin, an imidazole-based curing catalyst, and a curing retarder, and using the same. As described above, since the ring-open of the epoxy group is prompted by an imidazole catalyst, without the use of dicyandiamide, epoxy polymer reaction occurs due to the chain-reaction of epoxy group, and the glass-transition temperature is 170° C. or greater, the nonflammable epoxy resin composition for using a thin copper film of the present invention has a strong heat-resistance, lower dielectric constant, controllable gelation time, and does not require the use of non-harmful catalysts to the human body.
    • 本发明涉及一种应用于印刷电路板(PCB)的薄铜层压板的不燃性环氧树脂组合物及其应用。 本发明提供了使用包含双酚A型环氧树脂,多官能环氧树脂,咪唑类固化催化剂和固化延迟剂的薄铜膜层压体的不燃性环氧树脂组合物,并使用它们。 如上所述,由于环氧基的开环是由咪唑催化剂引起的,不使用双氰胺,由于环氧基的链反应而发生环氧聚合物反应,玻璃化转变温度为170℃ 使用本发明的薄铜膜的不可燃性环氧树脂组合物具有很强的耐热性,较低的介电常数,可控制的凝胶化时间,并且不需要对人体使用无害的催化剂。