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    • 6. 发明授权
    • DBG system and method with adhesive layer severing
    • DBG系统和粘合层切断方法
    • US07420263B2
    • 2008-09-02
    • US11374377
    • 2006-03-13
    • Seung Wook ParkHyun Jin Park
    • Seung Wook ParkHyun Jin Park
    • H01L23/544
    • H01L21/78Y10T156/1052
    • An array of grooves (23) is formed in a first side (12) of a wafer (10) during a wafer processing method. A back grinding tape (16) is adhered to the first side. An amount of material is removed from the second side (20) of the wafer. An adhesive layer (30) is applied to the second side. Dicing tape (24) is applied to the adhesive layer to create a first wafer assembly (32). The first wafer assembly is supported on a support surface (34) with the dicing tape facing the support surface and the back grinding tape exposed. The back grinding tape is removed and the adhesive layer is severed through the array of grooves to create individually removable die (28).
    • 在晶片处理方法中,在晶片(10)的第一侧(12)中形成有凹槽(23)的阵列。 后研磨带(16)粘附到第一侧。 从晶片的第二侧(20)去除一定量的材料。 粘合剂层(30)施加到第二侧。 将切割带(24)施加到粘合剂层以形成第一晶片组件(32)。 第一晶片组件被支撑在支撑表面(34)上,其中切割带面向支撑表面并且后研磨带暴露。 去除后研磨带,并且通过凹槽阵列切断粘合剂层以形成单独可移除的模具(28)。
    • 7. 发明授权
    • Pixel structure of liquid crystal display
    • 液晶显示器的像素结构
    • US07233379B2
    • 2007-06-19
    • US10725030
    • 2003-12-02
    • Dae Hong KimJong Seo YoonKi Cheol SeoHyun Jin Park
    • Dae Hong KimJong Seo YoonKi Cheol SeoHyun Jin Park
    • G02F1/1343
    • G02F1/136286
    • Disclosed is a pixel structure of a liquid crystal display including: a first substrate with red, green and blue color filters; a second substrate comprising; a TFT; a data bus line carrying a data signal that is applied to the TFT to drive unit pixels; and a gate bus line in which a bump-shaped groove is formed at a region where the gate bus line crosses and overlaps the data bus line to prevent the data bus line from opening and through which a gate signal is applied: wherein current is selectively supplied to the pixel electrode of the unit pixel region defined by the gate bus line and the data bus line so that an electric field is generated between the first substrate and the second substrate; and a liquid crystal layer between the first substrate and the second substrate.
    • 公开了一种液晶显示器的像素结构,包括:具有红色,绿色和蓝色滤色器的第一基板; 第二基板,包括: 一个TFT; 承载施加到TFT以驱动单位像素的数据信号的数据总线; 以及栅极总线,其中在栅极总线与数据总线交叉并与数据总线重叠的区域处形成凸起形状的沟槽,以防止数据总线开路并通过其施加栅极信号:其中电流是选择性的 提供给由栅极总线和数据总线定义的单位像素区域的像素电极,使得在第一基板和第二基板之间产生电场; 以及在第一基板和第二基板之间的液晶层。
    • 8. 发明授权
    • DBG system and method with adhesive layer severing
    • DBG系统和粘合层切断方法
    • US07074695B2
    • 2006-07-11
    • US10959713
    • 2004-10-06
    • Seung Wook ParkHyun Jin Park
    • Seung Wook ParkHyun Jin Park
    • H01L21/46
    • H01L21/78Y10T156/1052
    • An array of grooves (23) is formed in a first side (12) of a wafer (10) during a wafer processing method. A back grinding tape (16) is adhered to the first side. An amount of material is removed from the second side (20) of the wafer. An adhesive layer (30) is applied to the second side. Dicing tape (24) is applied to the adhesive layer to create a first wafer assembly (32). The first wafer assembly is supported on a support surface (34) with the dicing tape facing the support surface and the back grinding tape exposed. The back grinding tape is removed and the adhesive layer is severed through the array of grooves to create individually removable die (28).
    • 在晶片处理方法中,在晶片(10)的第一侧(12)中形成有凹槽(23)的阵列。 后研磨带(16)粘附到第一侧。 从晶片的第二侧(20)去除一定量的材料。 粘合剂层(30)施加到第二侧。 将切割带(24)施加到粘合剂层以形成第一晶片组件(32)。 第一晶片组件被支撑在支撑表面(34)上,其中切割带面向支撑表面并且后研磨带暴露。 去除后研磨带,并且通过凹槽阵列切断粘合剂层以形成单独可移除的模具(28)。