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1. 发明授权

US08742447B2 Light emitting device, light emitting device package and lighting system 有权
标题翻译：发光器件，发光器件封装和照明系统
公开(公告)号：US08742447B2
公开(公告)日：2014-06-03
申请号：US13020055
申请日：2011-02-03
申请人： Sun Kyung Kim , Woon Kyung Choi
发明人： Sun Kyung Kim , Woon Kyung Choi
IPC分类号： H01L31/02
CPC分类号： H01L33/46 , H01L2224/48091 , H01L2924/00014
摘要： Disclosed are a light emitting device, a light emitting device package, and a lighting system. The light emitting device includes a light emitting structure including a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer; a substrate over the light emitting structure; a first reflective layer having a plurality of dielectric layers including a first dielectric layer having a first refractive index over the substrate, and a second dielectric layer having a second refractive index different from the first refractive index over the first dielectric layer; and a second reflective layer over the first reflective layer, the second reflective layer having a refractive index lower than the refractive index of each dielectric layer of the first reflective layer.
摘要翻译：公开了一种发光器件，发光器件封装和照明系统。发光器件包括：发光结构，包括第一导电半导体层，有源层和第二导电半导体层; 在发光结构上的衬底; 具有多个电介质层的第一反射层，所述多个电介质层包括在所述衬底上具有第一折射率的第一电介质层和在所述第一电介质层上具有与所述第一折射率不同的第二折射率的第二电介质层; 以及在所述第一反射层上的第二反射层，所述第二反射层的折射率低于所述第一反射层的每个电介质层的折射率。

2. 发明授权

US08604500B2 Light emitting device and light emitting device package 有权
标题翻译：发光器件和发光器件封装
公开(公告)号：US08604500B2
公开(公告)日：2013-12-10
申请号：US13031825
申请日：2011-02-22
申请人： Hyun Min Choi , Sun Kyung Kim , Woon Kyung Choi
发明人： Hyun Min Choi , Sun Kyung Kim , Woon Kyung Choi
IPC分类号： H01L33/46 , B82Y20/00
CPC分类号： H01L33/405 , H01L33/42 , H01L33/46 , H01L2224/48091 , H01L2924/00014
摘要： Provided are a light emitting device and a light emitting device package. The light emitting device includes a transparent substrate, a light emitting structure, and a first reflection layer. The light emitting structure includes a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer that are disposed on a top surface of the substrate. The first reflection layer is disposed on a bottom surface of the substrate. The bottom surface of the substrate has a surface roughness of about 1 nm to about 15 nm in root mean square (RMS) value.
摘要翻译：提供了一种发光器件和发光器件封装。发光器件包括透明衬底，发光结构和第一反射层。发光结构包括设置在基板的顶表面上的第一导电类型半导体层，有源层和第二导电类型半导体层。第一反射层设置在基板的底面上。基板的底表面的均方根（RMS）值具有约1nm至约15nm的表面粗糙度。

3. 发明授权

US08421110B2 Light emitting device and light emitting device package 有权
标题翻译：发光器件和发光器件封装
公开(公告)号：US08421110B2
公开(公告)日：2013-04-16
申请号：US13324785
申请日：2011-12-13
申请人： Kyoung Woo Jo , Sun Kyung Kim , Woon Kyung Choi
发明人： Kyoung Woo Jo , Sun Kyung Kim , Woon Kyung Choi
IPC分类号： H01L33/58
CPC分类号： H01L33/58 , H01L33/0095 , H01L33/405 , H01L33/44 , H01L33/50 , H01L33/508 , H01L2224/48091 , H01L2924/01055 , H01L2924/01068 , H01L2924/01322 , H01L2924/12032 , H01L2933/0083 , H01L2924/00014 , H01L2924/00
摘要： Disclosed are a light emitting device, a method of manufacturing the same and a light emitting device package. The light emitting device of the embodiment includes a light emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer and an active layer between the first and second conductive semiconductor layers; a fluorescent layer on the light emitting structure; and a light extracting structure on the fluorescent layer. The light extracting structure extracts light, which is generated in the light emitting structure and incident into an interfacial surface between the fluorescent layer and the light extracting structure, to an outside of the light emitting structure.
摘要翻译：公开了发光器件，其制造方法和发光器件封装。本实施例的发光器件包括发光结构，其包括第一导电半导体层，第二导电半导体层和在第一和第二导电半导体层之间的有源层; 在发光结构上的荧光层; 以及荧光层上的光提取结构。光提取结构提取在发光结构中产生并入射到荧光层和光提取结构之间的界面的光到发光结构的外部。

4. 发明授权

US08431945B2 Light emitting device, light emitting device package, and lighting system 有权
标题翻译：发光装置，发光装置封装和照明系统
公开(公告)号：US08431945B2
公开(公告)日：2013-04-30
申请号：US13092275
申请日：2011-04-22
申请人： Hyun Min Choi , Sun Kyung Kim , Woon Kyung Choi
发明人： Hyun Min Choi , Sun Kyung Kim , Woon Kyung Choi
IPC分类号： H01L33/00 , H01L21/00
CPC分类号： H01L33/46 , H01L33/22 , H01L33/382 , H01L2224/48091 , H01L2924/00014
摘要： Disclosed are a light emitting device, a light emitting device package, and a lighting system. The light emitting device includes a light emitting structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer on, a light transmissive substrate having a refractive index lower than a refractive index of a compound semiconductor layer, and a mirror structure layer having a structure in which a first mirror layer having a first refractive index and a second mirror layer having a second refractive index different from the first refractive index are alternately stacked on each other. The first mirror layer has a thickness of W·λ/(4·n1·m), and the second mirror layer has a thickness of W·λ/(4·n2·m) in which the W represents a weight constant in a range of about 1.05 to about 1.25.
摘要翻译：公开了一种发光器件，发光器件封装和照明系统。发光器件包括在其上具有折射率低于化合物半导体层的折射率的透光基板上的第一导电半导体层，有源层和第二导电半导体层的发光结构，以及反射镜具有其中具有第一折射率的第一镜层和具有不同于第一折射率的第二折射率的第二镜层的结构的结构层彼此交替堆叠。第一镜层的厚度为W·λ/（4·n1·m），第二镜层的厚度为W·λ/（4·n2·m），其中W表示重量常数范围为约1.05至约1.25。

5. 发明申请

US20110227111A1 LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE 有权
标题翻译：发光装置和发光装置包装
公开(公告)号：US20110227111A1
公开(公告)日：2011-09-22
申请号：US13031825
申请日：2011-02-22
申请人： Hyun Min CHOI , Sun Kyung Kim , Woon Kyung Choi
发明人： Hyun Min CHOI , Sun Kyung Kim , Woon Kyung Choi
IPC分类号： H01L33/46 , B82Y20/00
CPC分类号： H01L33/405 , H01L33/42 , H01L33/46 , H01L2224/48091 , H01L2924/00014
摘要： Provided are a light emitting device and a light emitting device package. The light emitting device includes a transparent substrate, a light emitting structure, and a first reflection layer. The light emitting structure includes a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer that are disposed on a top surface of the substrate. The first reflection layer is disposed on a bottom surface of the substrate. The bottom surface of the substrate has a surface roughness of about 1 nm to about 15 nm in root mean square (RMS) value.
摘要翻译：提供了一种发光器件和发光器件封装。发光器件包括透明衬底，发光结构和第一反射层。发光结构包括设置在基板的顶表面上的第一导电类型半导体层，有源层和第二导电类型半导体层。第一反射层设置在基板的底面上。基板的底表面的均方根（RMS）值具有约1nm至约15nm的表面粗糙度。

6. 发明申请

US20110227110A1 LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM 有权
标题翻译：发光装置，发光装置包装和照明系统
公开(公告)号：US20110227110A1
公开(公告)日：2011-09-22
申请号：US13020055
申请日：2011-02-03
申请人： Sun Kyung KIM , Woon Kyung Choi
发明人： Sun Kyung KIM , Woon Kyung Choi
IPC分类号： H01L33/60 , H01L33/36
CPC分类号： H01L33/46 , H01L2224/48091 , H01L2924/00014
摘要： Disclosed are a light emitting device, a light emitting device package, and a lighting system. The light emitting device includes a light emitting structure including a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer; a substrate over the light emitting structure; a first reflective layer having a plurality of dielectric layers including a first dielectric layer having a first refractive index over the substrate, and a second dielectric layer having a second refractive index different from the first refractive index over the first dielectric layer; and a second reflective layer over the first reflective layer, the second reflective layer having a refractive index lower than the refractive index of each dielectric layer of the first reflective layer.
摘要翻译：公开了一种发光器件，发光器件封装和照明系统。发光器件包括：发光结构，包括第一导电半导体层，有源层和第二导电半导体层; 在发光结构上的衬底; 具有多个电介质层的第一反射层，所述多个电介质层包括在所述衬底上具有第一折射率的第一电介质层和在所述第一电介质层上具有与所述第一折射率不同的第二折射率的第二电介质层; 以及在所述第一反射层上的第二反射层，所述第二反射层的折射率低于所述第一反射层的每个电介质层的折射率。

7. 发明授权

US09276175B2 Light emitting device, light emitting device package 有权
标题翻译：发光装置，发光装置封装
公开(公告)号：US09276175B2
公开(公告)日：2016-03-01
申请号：US12979673
申请日：2010-12-28
申请人： Hyung Jo Park , Sun Kyung Kim , Woon Kyung Choi
发明人： Hyung Jo Park , Sun Kyung Kim , Woon Kyung Choi
IPC分类号： H01L33/00 , H01L33/44
CPC分类号： H01L33/44 , H01L2224/48091 , H01L2924/12032 , H01L2924/00014 , H01L2924/00
摘要： Provided are a light emitting device, a light emitting device package, and a lighting system. The light emitting device includes a light emitting structure, a buffer layer on the light emitting structure, and a filter layer on the buffer layer.
摘要翻译：提供了一种发光器件，发光器件封装和照明系统。发光器件包括发光结构，发光结构上的缓冲层和缓冲层上的过滤层。

8. 发明申请

US20120086036A1 LIGHT EMITTING DEVICE AND LIGTH EMITTING DEVICE PACKAGE 有权
标题翻译：发光器件和发光器件封装
公开(公告)号：US20120086036A1
公开(公告)日：2012-04-12
申请号：US13324785
申请日：2011-12-13
申请人： Kyoung Woo Jo , Sun Kyung Kim , Woon Kyung Choi
发明人： Kyoung Woo Jo , Sun Kyung Kim , Woon Kyung Choi
IPC分类号： H01L33/44
CPC分类号： H01L33/58 , H01L33/0095 , H01L33/405 , H01L33/44 , H01L33/50 , H01L33/508 , H01L2224/48091 , H01L2924/01055 , H01L2924/01068 , H01L2924/01322 , H01L2924/12032 , H01L2933/0083 , H01L2924/00014 , H01L2924/00
摘要： Disclosed are a light emitting device, a method of manufacturing the same and a light emitting device package. The light emitting device of the embodiment includes a light emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer and an active layer between the first and second conductive semiconductor layers; a fluorescent layer on the light emitting structure; and a light extracting structure on the fluorescent layer. The light extracting structure extracts light, which is generated in the light emitting structure and incident into an interfacial surface between the fluorescent layer and the light extracting structure, to an outside of the light emitting structure.
摘要翻译：公开了发光器件，其制造方法和发光器件封装。本实施例的发光器件包括发光结构，其包括第一导电半导体层，第二导电半导体层和在第一和第二导电半导体层之间的有源层; 在发光结构上的荧光层; 以及荧光层上的光提取结构。光提取结构提取在发光结构中产生并入射到荧光层和光提取结构之间的界面的光到发光结构的外部。

9. 发明申请

US20110156073A1 LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE 有权
标题翻译：发光装置，发光装置包装
公开(公告)号：US20110156073A1
公开(公告)日：2011-06-30
申请号：US12979673
申请日：2010-12-28
申请人： Hyung Jo Park , Sun Kyung Kim , Woon Kyung Choi
发明人： Hyung Jo Park , Sun Kyung Kim , Woon Kyung Choi
IPC分类号： H01L33/60
CPC分类号： H01L33/44 , H01L2224/48091 , H01L2924/12032 , H01L2924/00014 , H01L2924/00
摘要： Provided are a light emitting device, a light emitting device package, and a lighting system. The light emitting device includes a light emitting structure, a buffer layer on the light emitting structure, and a filter layer on the buffer layer.
摘要翻译：提供了一种发光器件，发光器件封装和照明系统。发光器件包括发光结构，发光结构上的缓冲层和缓冲层上的过滤层。

10. 发明授权

US08759841B2 Light emitting device package and lighting system 有权
标题翻译：发光装置封装和照明系统
公开(公告)号：US08759841B2
公开(公告)日：2014-06-24
申请号：US13020157
申请日：2011-02-03
申请人： Sung Min Hwang , Hyun Don Song , Woon Kyung Choi
发明人： Sung Min Hwang , Hyun Don Song , Woon Kyung Choi
IPC分类号： H01L27/15
CPC分类号： H01L33/44 , H01L33/50 , H01L33/507 , H01L33/58 , H01L2224/48091 , H01L2924/00014
摘要： A light emitting device package includes a sub mount; a light emitting device on the sub mount, and configured to generate light of a first wavelength; a dielectric layer disposed on the sub mount; and a fluorescent layer on the dielectric layer, and configured to convert the light of the first wavelength into light of a second wavelength, wherein the dielectric layer includes a plurality of layers having at least two different refractive indices, that transmits the light of the first wavelength and reflects the light of the second wavelength.
摘要翻译：发光器件封装包括副安装座; 在所述副安装件上的发光器件，并且被配置为产生第一波长的光; 设置在所述副安装座上的电介质层; 以及在所述电介质层上的荧光层，并且被配置为将所述第一波长的光转换成第二波长的光，其中所述介电层包括具有至少两个不同折射率的多个层，所述多个层透射所述第一波长的光波长并反射第二波长的光。

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