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1. 发明申请

US20070179660A1 Double side wafer grinder and methods for assessing workpiece nanotopology 有权
标题翻译：双面晶圆研磨机和评估工件纳米拓扑学的方法
公开(公告)号：US20070179660A1
公开(公告)日：2007-08-02
申请号：US11617433
申请日：2006-12-28
申请人： Sumeet Bhagavat , Milind Bhagavat , Roland Vandamme , Tomomi Komura
发明人： Sumeet Bhagavat , Milind Bhagavat , Roland Vandamme , Tomomi Komura
IPC分类号： B24B51/00 , B24B49/00 , B24B7/30 , B24B7/00
CPC分类号： B24B37/28 , B24B7/228 , B24B49/02
摘要： A double side grinder comprises a pair of grinding wheels and a pair of hydrostatic pads operable to hold a flat workpiece (e.g., semiconductor wafer) so that part of the workpiece is positioned between the grinding wheels and part of the workpiece is positioned between the hydrostatic pads. At least one sensor measures a distance between the workpiece and the respective sensor for assessing nanotopology of the workpiece. In a method of the invention, a distance to the workpiece is measured during grinding and used to assess nanotopology of the workpiece. For instance, a finite element structural analysis of the workpiece can be performed using sensor data to derive at least one boundary condition. The nanotopology assessment can begin before the workpiece is removed from the grinder, providing rapid nanotopology feedback. A spatial filter can be used to predict the likely nanotopology of the workpiece after further processing.
摘要翻译：双面研磨机包括一对砂轮和一对静压垫，其可操作以保持平坦工件（例如，半导体晶片），使得工件的一部分位于砂轮之间并且部分工件位于静水压垫至少一个传感器测量工件和相应传感器之间的距离，用于评估工件的纳米拓扑学。在本发明的方法中，在研磨期间测量与工件的距离，并用于评估工件的纳米拓扑学。例如，可以使用传感器数据来执行工件的有限元结构分析以导出至少一个边界条件。纳米技术评估可以在从研磨机上取出工件之前开始，提供快速的纳米拓扑反馈。可以使用空间滤波器来进一步处理后预测工件的可能纳米拓扑。

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