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    • 1. 发明授权
    • High density flash memory architecture with columnar substrate coding
    • 具有柱状衬底编码的高密度闪存架构
    • US06396737B2
    • 2002-05-28
    • US09733427
    • 2000-12-08
    • Sukyoon YoonPavel KlingerJoo Young Yoon
    • Sukyoon YoonPavel KlingerJoo Young Yoon
    • G11C1140
    • H01L27/11521G11C11/5621G11C11/5628G11C11/5635G11C11/5642G11C2211/565H01L27/115
    • Instead of using a common substrate (101) for each sector of a flash memory, trenches are used to isolate columnar active substrate regions (304) of the substrate (101), and independent access to each of these columnar regions (304) is provided. First, the independent access to each of these columnar regions (304) provides a capability for achieving more precise control over the voltage on the floating gates (106). For example, flash memory in accordance with the present invention is better suited for multi-level storage (storing of more than 1 bit of information per cell). Second, the independent access to each of these columnar regions (304) also provides a capability for areas of flash memory smaller than an entire sector to be erased at one time. Finally, since both programming and erasing is achieved by way of cold electron tunneling from the columnar active substrate region (304), no high voltages need to be applied to either the drain (102) or source (104). This is advantageous in that the minimum distance required by cell punchthrough is reduced. Hence, higher densities of flash memory may be achieved.
    • 代替对快闪存储器的每个扇区使用公共衬底(101),使用沟槽来隔离衬底(101)的柱状有源衬底区域(304),并且提供对这些柱状区域(304)中的每一个的独立访问 。 首先,对这些柱状区域(304)中的每一个的独立访问提供了实现对浮动栅极(106)上的电压的更精确控制的能力。 例如,根据本发明的闪速存储器更适合于多级存储(每个单元存储超过1位的信息)。 第二,对这些柱状区域(304)中的每一个的独立访问还提供了一次能够擦除小于整个扇区的闪存区域的能力。 最后,由于通过来自柱状有源衬底区域(304)的冷电子隧穿来实现编程和擦除,所以不需要将高电压施加到漏极(102)或源极(104)。 这是有利的,因为电池穿透所需的最小距离减小了。 因此,可以实现更高密度的闪速存储器。
    • 2. 发明授权
    • High density flash memory architecture with columnar substrate coding
    • 具有柱状衬底编码的高密度闪存架构
    • US06198658B1
    • 2001-03-06
    • US09415770
    • 1999-10-08
    • Sukyoon YoonPavel KlingerJoo Young Yoon
    • Sukyoon YoonPavel KlingerJoo Young Yoon
    • G11C1140
    • H01L27/11521G11C11/5621G11C11/5628G11C11/5635G11C11/5642G11C2211/565H01L27/115
    • Instead of using a common substrate (101) for each sector of a flash memory, trenches are used to isolate columnar active substrate regions (304) of the substrate (101), and independent access to each of these columnar regions (304) is provided. First, the independent access to each of these columnar regions (304) provides a capability for achieving more precise control over the voltage on the floating gates (106). For example, flash memory in accordance with the present invention is better suited for multi-level storage (storing of more than 1 bit of information per cell). Second, the independent access to each of these columnar regions (304) also provides a capability for areas of flash memory smaller than an entire sector to be erased at one time. Finally, since both programming and erasing is achieved by way of cold electron tunneling from the columnar active substrate region (304), no high voltages need to be applied to either the drain (102) or source (104). This is advantageous in that the minimum distance required by cell punchthrough is reduced. Hence, higher densities of flash memory may be achieved.
    • 代替对快闪存储器的每个扇区使用公共衬底(101),使用沟槽来隔离衬底(101)的柱状有源衬底区域(304),并且提供对这些柱状区域(304)中的每一个的独立访问 。 首先,对这些柱状区域(304)中的每一个的独立访问提供了实现对浮动栅极(106)上的电压的更精确控制的能力。 例如,根据本发明的闪速存储器更适合于多级存储(每个单元存储超过1位的信息)。 第二,对这些柱状区域(304)中的每一个的独立访问还提供了一次能够擦除小于整个扇区的闪存区域的能力。 最后,由于通过来自柱状有源衬底区域(304)的冷电子隧穿来实现编程和擦除,所以不需要将高电压施加到漏极(102)或源极(104)。 这是有利的,因为电池穿透所需的最小距离减小了。 因此,可以实现更高密度的闪速存储器。
    • 8. 发明授权
    • Flash EEPROM unit cell and memory array architecture including the same
    • 闪存EEPROM单元和存储器阵列架构包括相同
    • US06940122B2
    • 2005-09-06
    • US10689722
    • 2003-10-22
    • Sukyoon Yoon
    • Sukyoon Yoon
    • H01L27/115G11C16/00H01L21/8247H01L27/148H01L29/788
    • H01L27/115H01L27/11521
    • A high-density flash EEPROM (Electrically Erasable Programmable Read Only Memory) unit cell and a memory array architecture including the same are disclosed. The flash EEPROM unit cell comprises a substrate on which field oxide layers are formed for isolating unit cells, a floating gate dielectric layer formed between the adjacent field oxide layers, wherein the floating gate dielectric layer includes a first dielectric layer and a second dielectric layer which are connected in parallel between a source and a drain formed on the substrate, and the thickness of the first dielectric layer is thicker than the second dielectric layer, a floating gate formed on the floating gate dielectric layer, a control gate dielectric layer formed on the floating gate; and a control gate formed on the control gate dielectric layer.
    • 公开了一种高密度闪存EEPROM(电可擦除可编程只读存储器)单元和包括其的存储器阵列结构。 闪速EEPROM单元包括其上形成有用于隔离单元电池的场氧化物层的衬底,形成在相邻的场氧化物层之间的浮置栅介质层,其中该浮栅绝缘层包括第一电介质层和第二电介质层, 在形成在基板上的源极和漏极之间并联连接,并且第一电介质层的厚度比第二电介质层厚,形成在浮栅电介质层上的浮置栅极,形成在栅极电介质层上的控制栅极电介质层 浮门 以及形成在控制栅极介电层上的控制栅极。