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    • 3. 发明申请
    • Combining multiple exposure images to increase dynamic range
    • 组合多个曝光图像以增加动态范围
    • US20070242900A1
    • 2007-10-18
    • US11403989
    • 2006-04-13
    • Mei ChenQian LinSuk Lim
    • Mei ChenQian LinSuk Lim
    • G06K9/32
    • G06T5/50H04N5/23232H04N5/235H04N5/2355
    • Methods, machines, and machine-readable media for processing multiple exposure source images, including a reference image and one or more non-reference images, are described. In one aspect, respective sets of motion vectors that establish correspondences between respective pairs of the source images are calculated. Ones of the source images are warped to a reference coordinate system based on the sets of motion vectors. For each of the non-reference ones of the warped images, a respective set of one or more measures of alignment confidence between the non-reference warped image and the reference image in the reference coordinate system is computed. Saturated pixels and unsaturated pixels are identified in the warped images. An output image with pixel value contributions from unsaturated pixels in the warped images is generated based on the computed alignment confidence measures.
    • 描述了用于处理多个曝光源图像(包括参考图像和一个或多个非参考图像)的方法,机器和机器可读介质。 在一个方面,计算在各个对象图像之间建立对应关系的各组运动矢量。 基于运动矢量集,将源图像的一部分变形为参考坐标系。 对于每个未参考的翘曲图像,计算在参考坐标系中的非参考翘曲图像和参考图像之间的对准置信度的相应集合。 饱和像素和不饱和像素在翘曲图像中被识别。 基于所计算的对准置信度度量,生成具有来自翘曲图像中的不饱和像素的像素值贡献的输出图像。
    • 7. 发明申请
    • Pb-free solder alloy
    • 无铅焊料合金
    • US20060088440A1
    • 2006-04-27
    • US11252415
    • 2005-10-18
    • Suk LimSang Cho
    • Suk LimSang Cho
    • C22C13/00
    • C22C13/00
    • Provided is a Pb-free solder alloy used for mounting electronic parts on a printed circuit board. The Pb-free solder alloy is highly resistant to oxidation and impact. The Pb-free solder alloy includes Ag of 2.8 wt % to 4.2 wt %, Cu of 0.3 wt % to 0.8 wt %, Ge of 0.0001 wt % to 0.01 wt %, In of 0.001 wt % to 0.2 wt %, and the balance of Sn. The Pb-free solder alloy having this composition also has a high shear strength and low brittleness factor after bonding. Thus, the Pb-free solder alloy has high quality mechanical properties, to form a high quality joint.
    • 提供了一种用于将电子部件安装在印刷电路板上的无铅焊料合金。 无铅焊料合金高度耐氧化和冲击。 无铅焊料合金包括2.8重量%至4.2重量%的Ag,0.3重量%至0.8重量%的Cu,0.0001重量%至0.01重量%的Ge,0.001重量%至0.2重量%的In,余量 的Sn。 具有该组成的无铅焊料合金也具有高的剪切强度和粘结后的低脆性系数。 因此,无铅焊料合金具有高质量的机械性能,形成高质量的接头。
    • 8. 发明申请
    • Cameras, optical systems, imaging methods, and optical filter configuration methods
    • 相机,光学系统,成像方法和光学滤波器配置方法
    • US20050146634A1
    • 2005-07-07
    • US10749576
    • 2003-12-31
    • D. SilversteinSuk Lim
    • D. SilversteinSuk Lim
    • H04N5/238H04N5/225H04N5/335H04N9/04H04N9/07
    • H04N5/2254H04N9/045
    • Cameras, optical systems, imaging methods and optical filter configuration methods are described. According to one embodiment, a camera includes an image device configured to receive light of a subject and to provide an image representation of the subject from the light, wherein the image representation is usable to generate a visible image of the subject, a lens system optically coupled with the image device and configured to direct the light to the image device, wherein the image device is configured to generate the image representation while having a first sensitivity to a first wavelength of light and a second sensitivity to a second wavelength of light different than the first sensitivity, and a filter optically coupled with the lens system and corresponding to the image device wherein the filter is configured to pass a first quantity of photons having the first wavelength of light for the subject and a second quantity of photons having the second wavelength of light for the subject.
    • 描述了相机,光学系统,成像方法和滤光器配置方法。 根据一个实施例,相机包括被配置为接收被摄体的光并且从光提供被摄体的图像表示的图像装置,其中图像表示可用于生成被摄体的可见图像,光学透镜系统 与图像装置耦合并且被配置为将光引导到图像装置,其中图像装置被配置为产生图像表示,同时具有对第一波长的光的第一灵敏度和对不同于第一波长的光的第二波长的第二灵敏度 第一灵敏度,以及与透镜系统光学耦合并对应于图像装置的滤光器,其中滤光器被配置为使具有第一波长的光的第一量光子传递给对象,以及具有第二波长的第二数量的光子 的光线为主题。