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    • 6. 发明申请
    • HOUSING OF AN ELECTRONIC DEVICE FORMED BY DOUBLESHOT INJECTION MOLDING
    • 由双重注射成型制成的电子器件的外壳
    • US20080012179A1
    • 2008-01-17
    • US11782175
    • 2007-07-24
    • Stephen ZadeskyEvans HankeyJonathan IveRico Zorkendorfer
    • Stephen ZadeskyEvans HankeyJonathan IveRico Zorkendorfer
    • B29C45/00
    • B29C45/162B29C45/062Y10T428/1352
    • A method for forming an enclosure for enclosing internal electronic components of an electronic device is provided, which comprises: performing a first injection molding process, the first injection molding process forming at least a first wall of the enclosure; allowing the at least a first wall of the enclosure to solidify; thereafter performing a second injection molding process, the second injection molding process forming at least a second wall of the enclosure, the at least a second wall of the enclosure fusing with the at least a first wall of the enclosure during the second injection molding process, the at least second wall of the enclosure forming at least one different side of the enclosure than the at least first wall of the enclosure; and allowing the at least a second wall of the enclosure to solidify, the at least a second wall of the enclosure being integrally formed with the at least a first wall of the enclosure to thereby form a single-piece multi-walled enclosure.
    • 提供了一种用于形成用于封闭电子设备的内部电子部件的外壳的方法,其包括:执行第一注射成型工艺,所述第一注射成型工艺形成所述外壳的至少第一壁; 允许外壳的至少第一壁固化; 然后执行第二注射成型工艺,所述第二注射成型工艺形成所述外壳的至少第二壁,所述外壳的所述至少第二壁在所述第二注射成型过程期间与所述外壳的所述至少第一壁熔合, 所述外壳的所述至少第二壁形成所述外壳的至少一个不同于所述外壳的至少第一壁的不同侧面; 并且允许所述外壳的所述至少第二壁固化,所述外壳的所述至少第二壁与所述外壳的所述至少第一壁一体地形成,从而形成单件式多壁外壳。