专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06963001B2 Low shrinkage thermosetting resin compositions and methods of use therefor 失效
标题翻译：低收缩热固性树脂组合物及其使用方法
公开(公告)号：US06963001B2
公开(公告)日：2005-11-08
申请号：US10367360
申请日：2003-02-14
申请人： Stephen M. Dershem , Kang Yang , Puwei Liu
发明人： Stephen M. Dershem , Kang Yang , Puwei Liu
IPC分类号： C07C69/54 , C07C69/753 , C07D207/40 , C07D207/404 , C08F220/30 , C07D209/56 , C07D207/12 , C08J9/00 , C07F126/08 , C08K2/46
CPC分类号： C07D207/408 , C07C69/54 , C07C69/753 , C07C2602/42 , C08F220/30
摘要： In accordance with the present invention, there are provided thermosetting resin compositions with a reduced propensity to shrink in volume upon cure and methods of use therefor. The compositions of the present invention include compounds having aromatic, rigid-rod like spacer groups between the crosslinkable moieties. As such, these compounds impart a degree of liquid crystal-like character to the thermosetting resin composition which results in lower shrinkage upon cure. This effect follows from the well-known expansion that occurs when liquid crystal-like materials pass from a nematic liquid crystal-like state to an isotropic state. Further provided by the present invention are low shrinkage die attach pastes and methods of use therefor.
摘要翻译：根据本发明，提供了在固化时体积收缩倾向降低的热固性树脂组合物及其使用方法。本发明的组合物包括在可交联部分之间具有芳族，刚性 - 棒状间隔基团的化合物。因此，这些化合物赋予热固性树脂组合物一定程度的液晶性特征，这在固化时导致较低的收缩率。这种效果是从液晶般的材料从向列型液晶状态向各向同性状态发生的公知的扩展产生的。本发明进一步提供的是低收缩模附着膏及其使用方法。

2. 发明授权

US06831132B2 Film adhesives containing maleimide compounds and methods for use thereof 有权
标题翻译：含有马来酰亚胺化合物的胶粘剂及其使用方法
公开(公告)号：US06831132B2
公开(公告)日：2004-12-14
申请号：US10113909
申请日：2002-03-28
申请人： Puwei Liu , Stephen M. Dershem , Kang Yang , Carolyn C. Albino
发明人： Puwei Liu , Stephen M. Dershem , Kang Yang , Carolyn C. Albino
IPC分类号： C08F25500
CPC分类号： C08L79/085 , C08F8/30 , C08F290/02 , C08L2666/24 , C09J179/085 , H01L24/28 , H01L24/83 , H01L25/0657 , H01L2224/2919 , H01L2224/8319 , H01L2224/8388 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/00
摘要： In accordance with the present invention, there are provided film adhesive compositions comprising at least one macromonomer having at least one unit of ethylenic unsaturation, at least one thermoplastic elastomer co-curable with the macromonomer, and at least one cure initiator, and methods for use thereof. Invention compositions are useful as adhesives in the microelectronics industry. In particular, invention film adhesives may be used to produce microelectronic assemblies with very thin bond lines without compromising adhesive strength.
摘要翻译：根据本发明，提供了膜粘合剂组合物，其包含至少一种具有至少一个烯属不饱和单元的大分子单体，至少一种与大分子单体可共同固化的热塑性弹性体和至少一种固化引发剂，以及使用方法其中。本发明组合物可用作微电子工业中的粘合剂。特别地，本发明的薄膜粘合剂可用于制造具有非常薄的粘合线的微电子组件，而不损害粘合强度。

3. 发明授权

US06743852B2 Benzoxazines, thermosetting resins comprised thereof, and methods for use thereof 有权
公开(公告)号：US06743852B2
公开(公告)日：2004-06-01
申请号：US10008591
申请日：2001-11-13
申请人： Stephen M. Dershem , Puwei Liu , Farhad G. Mizori
发明人： Stephen M. Dershem , Puwei Liu , Farhad G. Mizori
IPC分类号： C07D26506
CPC分类号： C07D413/04 , C07D265/16 , C08G77/26 , Y10T428/31678
摘要： In accordance with the present invention, there are provided novel benzoxazine compounds and thermosetting resin compositions prepared therefrom. Invention compositions are particularly useful for increasing adhesion at interfaces within microelectronic packages. Invention benzoxazines are useful for the preparation of invention compositions with properties which are associated with increased adhesion at interfaces, such as, for example, low shrinkage on cure and low coefficient of thermal expansion (CTE). In another aspect of the invention, there are provided die-attach pastes having increased interfacial adhesion. Invention die-attach pastes include benzoxazine-containing thermosetting resin compositions. In further aspects of the invention, there are provided methods for enhancing adhesive strength of thermosetting resin compositions and methods for enhancing adhesion of a substrate bound to a metallic surface by a thermosetting resin composition.

4. 发明授权

US06946523B2 Heterobifunctional monomers and uses therefor 失效
标题翻译：异双官能单体及其用途
公开(公告)号：US06946523B2
公开(公告)日：2005-09-20
申请号：US10612545
申请日：2003-07-01
申请人： Stephen M. Dershem , Kevin J. Forrestal , Puwei Liu
发明人： Stephen M. Dershem , Kevin J. Forrestal , Puwei Liu
IPC分类号： C07D207/44 , C07D207/448 , C08F32/08 , C08F232/08 , C08G61/02 , C08G61/08 , H05K1/03 , C08F32/04 , C07C207/00 , C08F232/04
CPC分类号： C07D207/448 , C08F32/08 , C08F232/08 , C08G61/02 , C08G61/08 , H05K1/0313 , H05K1/032
摘要： In accordance with the present invention, there are provided novel heterobifunctional monomers and users for the same. Invention compounds have many of the properties required by the microelectronics industry, such as, for example, hydrophobicity, high Tg values, low dielectric constant, ionic purity, low coefficient of thermal expansion (CTE), and the like. These properties result in a thermoset that is particularly well suited to high performance applications where typical operating temperatures are often significantly higher than those at which prior art materials were suitable. Invention compounds are particularly ideal for use in the manufacture of electronic components, such as, for example, printed circuit boards, and the like.
摘要翻译：根据本发明，提供了新颖的异双功能单体及其用途。本发明化合物具有许多微电子工业所需的性质，例如疏水性，高T值，低介电常数，离子纯度，低热膨胀系数（CTE）和类似。这些特性导致热固性材料特别适用于其中典型工作温度通常明显高于现有技术材料适合的高性能应用。本发明化合物特别适用于制造电子元件，例如印刷电路板等。

5. 发明授权

US07517925B2 Benzoxazines, thermosetting resins comprised thereof, and methods for use thereof 有权
标题翻译：苯并恶嗪，其组合的热固性树脂及其使用方法
公开(公告)号：US07517925B2
公开(公告)日：2009-04-14
申请号：US10735119
申请日：2003-12-11
申请人： Stephen M. Dershem , Puwei Liu , Farhad G. Mizori
发明人： Stephen M. Dershem , Puwei Liu , Farhad G. Mizori
IPC分类号： C08K5/34
CPC分类号： C07D413/04 , C07D265/16 , C08G77/26 , Y10T428/31678
摘要： In accordance with the present invention, there are provided novel benzoxazine compounds and thermosetting resin compositions prepared therefrom. Invention compositions are particularly useful for increasing adhesion at interfaces within microelectronic packages. Invention benzoxazines are useful for the preparation of invention compositions with properties which are associated with increased adhesion at interfaces, such as, for example, low shrinkage on cure and low coefficient of thermal expansion (CTE). In another aspect of the invention, there are provided die-attach pastes having increased interfacial adhesion. Invention die-attach pastes include benzoxazine-containing thermosetting resin compositions. In further aspects of the invention, there are provided methods for enhancing adhesive strength of thermosetting resin compositions and methods for enhancing adhesion of a substrate bound to a metallic surface by a thermosetting resin composition.
摘要翻译：根据本发明，提供了由其制备的新型苯并恶嗪化合物和热固性树脂组合物。本发明组合物特别可用于增加微电子封装内的界面处的粘附性。本发明的苯并恶嗪可用于制备本发明组合物，其性能与界面处的增加的粘附性相关，例如固化时的低收缩率和低的热膨胀系数（CTE）。在本发明的另一方面，提供了具有增加的界面粘合力的模片附着浆料。本发明的模片附着膏包括含有苯并恶嗪的热固性树脂组合物。在本发明的另一方面，提供了用于提高热固性树脂组合物的粘合强度的方法和通过热固性树脂组合物增强与金属表面结合的基材的粘附性的方法。

6. 发明授权

US07199249B2 Free radically polymerizable coupling agents 失效
标题翻译：自由基聚合偶联剂
公开(公告)号：US07199249B2
公开(公告)日：2007-04-03
申请号：US10190299
申请日：2002-07-03
申请人： Puwei Liu , Stephen M. Dershem , Benjamin Neff , Maria Villegas
发明人： Puwei Liu , Stephen M. Dershem , Benjamin Neff , Maria Villegas
IPC分类号： C07F7/10 , C07F7/18 , C07D207/24
CPC分类号： C07D207/452 , C07F7/1804 , C08K5/0025 , C09D4/00 , Y10T428/2852 , C08G77/04
摘要： In accordance with the present invention, there are provided novel coupling agents which are compatible with a wide variety of adhesive formulations and which provide substantial adhesion enhancement relative to base formulations to which they are added. Invention compounds comprise at least one free-radically polymerizable group (other than acrylate) and at least one reactive moiety which forms covalent bond(s) with substrates having free hydroxyl groups on the surface thereof. Thus, invention compounds are covalently linked to adhesive formulations upon free radical cure, while at the same time providing “residual” functionality which is capable of undergoing reaction with any substrate having reactive (e.g., hydroxyl) groups in the surface thereof.
摘要翻译：根据本发明，提供了与各种粘合剂制剂相容的新型偶联剂，并且相对于添加它们的碱配方提供显着的附着力增强。本发明化合物包含至少一种可自由基聚合的基团（丙烯酸酯除外）和至少一个在其表面上与具有游离羟基的基材形成共价键的反应性部分。因此，本发明化合物在自由基固化时与粘合剂制剂共价连接，同时提供能够与其表面具有反应性（例如羟基）基团的任何基材反应的“残留”官能团。

7. 发明授权

US06960636B2 Thermosetting resin compositions containing maleimide and/or vinyl compounds 失效
标题翻译：含有马来酰亚胺和/或乙烯基化合物的热固性树脂组合物
公开(公告)号：US06960636B2
公开(公告)日：2005-11-01
申请号：US10342143
申请日：2003-01-13
申请人： Stephen M. Dershem , Puwei Liu
发明人： Stephen M. Dershem , Puwei Liu
IPC分类号： B32B7/04 , C07D207/44 , C07D207/452 , C07D401/04 , C08F22/40 , C08G73/06 , C08G73/10 , C08G73/12 , C09J179/08 , H05K1/03 , H05K3/28 , C08F2/46 , B32B27/06 , B32B27/28 , C08F122/40 , C08F222/40
CPC分类号： C07D207/452 , B32B7/04 , C07D401/04 , C08F22/40 , C08G73/0655 , C08G73/10 , C08G73/12 , C08G73/121 , C09J179/085 , H05K1/0346 , H05K3/285 , Y10S428/901 , Y10T428/239 , Y10T428/31721
摘要： In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.
摘要翻译：根据本发明，提供了新型热固性树脂组合物，其不需要溶剂来提供具有合适粘度的系统以便于处理。本发明组合物具有快速固化的益处。所得到的热固性材料对于升高的温度是稳定的，高度柔性的，具有低吸湿性，因此可用于各种应用中，例如在粘合剂应用中，因为它们对基材和附着于其上的装置表现出良好的粘合性。

8. 发明授权

US06620946B2 Low shrinkage thermosetting resin compositions and methods of use thereof 失效
公开(公告)号：US06620946B2
公开(公告)日：2003-09-16
申请号：US10137064
申请日：2002-04-30
申请人： Stephen M. Dershem , Kang Yang
发明人： Stephen M. Dershem , Kang Yang
IPC分类号： C07D20740
CPC分类号： C07D207/408 , C07C69/54 , C07C69/753 , C07C2602/42 , C08F220/30
摘要： In accordance with the present invention, there are provided thermosetting resin compositions with a reduced propensity to shrink in volume upon cure and methods of use therefor. The compositions of the present invention include compounds having aromatic, rigid-rod like spacer groups between the crosslinkable moieties. As such, these compounds impart a degree of liquid crystal-like character to the thermosetting resin composition which results in lower shrinkage upon cure. This effect follows from the well-known expansion that occurs when liquid crystal-like materials pass from a nematic liquid crystal-like state to an isotropic state. Further provided by the present invention are low shrinkage die attach pastes and methods of use therefor.

9. 发明申请

US20110049731A1 MATERIALS AND METHODS FOR STRESS REDUCTION IN SEMICONDUCTOR WAFER PASSIVATION LAYERS 有权
标题翻译：在半导体波长钝化层中减少应力的材料和方法
公开(公告)号：US20110049731A1
公开(公告)日：2011-03-03
申请号：US12874767
申请日：2010-09-02
申请人： Stephen M. Dershem , Farhad G. Mizori , James T. Huneke
发明人： Stephen M. Dershem , Farhad G. Mizori , James T. Huneke
IPC分类号： H01L23/29 , H01L21/312
CPC分类号： H01L21/312 , C08G73/1014 , C08G73/106 , H01L21/02118 , H01L23/293 , H01L2924/0002 , H01L2924/12044 , H01L2924/00
摘要： The present invention provides polyimide polymer materials for passivating semiconductor wafers and methods for fabricating thereof.
摘要翻译：本发明提供了用于钝化半导体晶片的聚酰亚胺聚合物材料及其制造方法。

10. 发明申请

US20100249276A1 CURATIVES FOR EPOXY COMPOSITIONS 有权
标题翻译：环氧组合物用途
公开(公告)号：US20100249276A1
公开(公告)日：2010-09-30
申请号：US12815896
申请日：2010-06-15
申请人： Stephen M. Dershem
发明人： Stephen M. Dershem
IPC分类号： C08L63/00 , C07C63/00 , C07C69/618 , C07F7/18 , C07D207/40 , C07D209/76 , C07D403/02 , C07D491/00 , C07F7/08 , C07F7/21 , C07F7/10 , C09D163/00 , C09J163/00
CPC分类号： C08G65/336 , C07C69/017 , C07C69/54 , C07C69/73 , C07C69/80 , C07C69/90 , C07C235/46 , C07F7/1804 , C08G59/4007 , C08G65/18 , C08G65/3326 , C08G65/33396 , C08G65/3344 , C08L63/00 , C08L71/02 , C09D163/00 , C09D171/02 , C09J163/00 , C09J171/02
摘要： The invention provides epoxy and oxetane compositions including the novel acyloxy and N-acyl curing agents described herein. Use of invention curing agents result in cured adhesive compositions with remarkably increased adhesion and reduced hydrophilicity when compared to resins cured with other types of curing agents. Furthermore, the curatives of this invention do not interfere with free-radical cure and are thus suited for use in hybrid cure thermoset compositions.
摘要翻译：本发明提供环氧和氧杂环丁烷组合物，包括本文所述的新型酰氧基和N-酰基固化剂。当与其它类型的固化剂固化的树脂相比时，使用本发明固化剂导致固化的粘合剂组合物具有显着增加的粘附性和降低的亲水性。此外，本发明的固化剂不会干扰自由基固化，因此适用于混合固化热固性组合物。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式