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1. 发明申请

US20050225210A1 Z-axis electrical connection and methods for ultrasound transducers 审中-公开
标题翻译： Z轴电气连接和超声换能器的方法
公开(公告)号：US20050225210A1
公开(公告)日：2005-10-13
申请号：US10815307
申请日：2004-04-01
申请人： Stephen Englund , Ellen Rowland , Grazyna Palczewska , Gregg Frey , Todor Sheljaskow , Lisa Fearn , Vaughn Marian , Nelson Oliver , Walter Wilser , Worth Walters
发明人： Stephen Englund , Ellen Rowland , Grazyna Palczewska , Gregg Frey , Todor Sheljaskow , Lisa Fearn , Vaughn Marian , Nelson Oliver , Walter Wilser , Worth Walters
IPC分类号： B06B1/06 , H01L41/18 , H04R17/00 , H05K3/36 , H05K3/46
CPC分类号： B06B1/0622
摘要： Electrical connection is provided in a transducer stack through a backing block. A flexible circuit is sandwiched between pieces of acoustic attenuating material. For example, 2 to 200 or more flexible circuits are stacked in alternating layers with pieces of acoustically attenuating material. The alternating layers are then connected together to form a backing block with Z-axis electrical connection. The top surface of the connected backing block includes a plurality of exposed electrical traces from the flex circuit. Since flex circuits are used, the electrical traces are precisely aligned along one dimension. Since pre-formed acoustic attenuating material pieces are used, precise alignment is provided along a second or orthogonal dimension. The substrate holding the electrical traces in the flexible circuits provides more stability and allows for easier connection to circuit boards as compared to individual strips of metal.
摘要翻译：通过背衬块在换能器堆叠中提供电气连接。柔性电路夹在声衰减材料片之间。例如，2到200个或更多个柔性电路以交替的层与多个声衰减材料堆叠。然后将交替层连接在一起以形成具有Z轴电连接的背衬块。连接的背衬块的顶表面包括来自柔性电路的多个暴露的电迹线。由于使用柔性电路，所以电迹线沿着一个维度精确对准。由于使用了预先形成的声衰减材料片，所以沿着第二或正交的尺寸提供精确对准。与单个金属条相比，在柔性电路中保持电迹线的基板提供更多的稳定性并且允许更容易地连接到电路板。

2. 发明申请

US20050042424A1 Electrically conductive matching layers and methods 有权
标题翻译：导电匹配层和方法
公开(公告)号：US20050042424A1
公开(公告)日：2005-02-24
申请号：US10646130
申请日：2003-08-22
申请人： Gregg Frey , Todor Sheljaskow , Walter Wilser , Worth Walters , Nelson Oliver
发明人： Gregg Frey , Todor Sheljaskow , Walter Wilser , Worth Walters , Nelson Oliver
IPC分类号： A61B8/00 , B06B1/06 , B32B3/00 , G01N29/28 , H04R17/00
CPC分类号： B06B1/0622 , Y10T428/24612
摘要： Matching layers are provided, including: electrically conductive acoustic matching layers, methods for conducting electric current through matching layers, methods for manufacturing multi-dimensional arrays using conductive matching layers, and multi-dimensional arrays with electrically conducting matching layers. Matching layers with conductors aligned for providing electrical conduction through the thickness or range dimension of the matching layer are provided. For example, vias, aligned magnetic particles, or conductive films at least partially or entirely within the matching layer of each element allow electrical conduction from the transducer material to a ground foil or flex circuit. By using multiple electrical conductive matching layers, a gradation in acoustic impedance for better matching is provided while allowing dicing of the entire stack, including the matching layers and the electroceramic material, in one step.
摘要翻译：提供了匹配层，包括：导电声匹配层，用于通过匹配层传导电流的方法，使用导电匹配层制造多维阵列的方法，以及具有导电匹配层的多维阵列。提供了匹配层，导体对齐以提供通过匹配层的厚度或范围尺寸的导电。例如，通孔，对准的磁性颗粒或至少部分或完全在每个元件的匹配层内的导电膜允许从换能器材料到接地箔或柔性电路的电传导。通过使用多个导电匹配层，提供了用于更好匹配的声阻抗等级，同时允许包括匹配层和电陶瓷材料在内的整个叠层的切割。

3. 发明申请

US20050203409A1 Electrical interconnections and methods for membrane ultrasound transducers 有权
标题翻译：用于膜超声换能器的电气互连和方法
公开(公告)号：US20050203409A1
公开(公告)日：2005-09-15
申请号：US10799973
申请日：2004-03-12
申请人： Gregg Frey , Grazyna Palczewska , Stephen Barnes , Mirsaid Bolorforosh
发明人： Gregg Frey , Grazyna Palczewska , Stephen Barnes , Mirsaid Bolorforosh
IPC分类号： A61B8/14 , B06B1/02
CPC分类号： B06B1/0292
摘要： Electrical interconnects are provided for CMUTs. For example, electrodes within the silicon substrate, such as the electrodes at the bottom of the void below membranes, are interconnected together within the substrate. The interconnected electrode may then be used as the grounding electrode. By providing interconnection within the substrate and below the membranes, space for vias and the associated connection between the electrodes on an exposed surface of the substrate is minimized. As another example, an electrical conductor is formed on the side of the silicon substrate rather than the top of the substrate. Conductors on the side may allow routing signals from a top surface to a bottom surface without large wire bonding pads. Alternatively, conductors on the edge provide additional space for wire bonding pads. As yet another example, polymer material used as a matching or protection layer is formed on the top surface of the CMUT with electrical traces routed within the polymer. By using multiple layers of polymer, multiple layers of electrical conductors may be routed without interference.
摘要翻译：为CMUT提供电气互连。例如，硅衬底内的电极，例如在膜下面的空隙底部的电极在衬底内互连在一起。然后可以将互连的电极用作接地电极。通过在衬底内和薄膜之下提供互连，通孔的空隙和衬底的暴露表面上的电极之间的相关连接最小化。作为另一示例，电导体形成在硅衬底的侧面而不是衬底的顶部上。侧面的导体可以允许从顶表面到底面的路由信号，而不需要大的引线接合焊盘。或者，边缘上的导体为引线焊盘提供额外的空间。作为另一个实例，用作匹配或保护层的聚合物材料形成在CMUT的顶表面上，其电导迹线在聚合物内布置。通过使用多层聚合物，多层电导体可以无干扰地布线。

4. 发明申请

US20060058706A1 Backing, transducer array and method for thermal survival 有权
标题翻译：支撑，换能器阵列和热存活方法
公开(公告)号：US20060058706A1
公开(公告)日：2006-03-16
申请号：US10921565
申请日：2004-08-19
申请人： Gregg Frey
发明人： Gregg Frey
IPC分类号： A61H1/00
CPC分类号： G10K11/004 , B06B1/0681 , Y10T156/10
摘要： Backing blocks, transducer arrays and methods are provided for thermal cycle survivability. By decoupling a portion of the backing block from a case used to contain the transducer stack, the greater thermal expansion properties of most backing blocks may be minimized. For example, a rim is formed on the backing block material. The rim is bonded to the case structure while other portions of the backing block remain free of bonding to the case structure. During thermal cycling or other temperature changes, the backing block may be less likely to expand or bulge and crack, delaminate or damage transducer elements or other transducer materials.
摘要翻译：提供支撑块，换能器阵列和方法用于热循环寿命。通过将背衬块的一部分与用于容纳换能器堆叠的壳体分离，大多数背衬块的较大的热膨胀性能可以最小化。例如，在背衬块材料上形成边缘。轮缘结合到壳体结构，而背衬块的其它部分保持不与壳体结构的结合。在热循环或其他温度变化期间，背衬块可能不太可能膨胀或膨胀并破裂，分层或损坏换能器元件或其它换能器材料。

5. 发明申请

US20060028099A1 Composite acoustic matching layer 审中-公开
标题翻译：复合声匹配层
公开(公告)号：US20060028099A1
公开(公告)日：2006-02-09
申请号：US10912395
申请日：2004-08-05
申请人： Gregg Frey
发明人： Gregg Frey
IPC分类号： H01L41/08
CPC分类号： G10K11/02
摘要： A matching layer is formed as a composite, such as a 2-2 or a 1-3 composite. The base material forms some portion, such as 5 or more percentage by volume, of the composite matching layer and volume. The in-fill, bonding or acoustically isolating material holds the sections of base material together and provides for control of the stiffness and cross coupling. By using an electrically conductive base material, electrical conductivity is provided from a top surface to a bottom surface. The composite is easily manufactured using dicing of a base material, filling of the kerfs and curing the filled kerfs.
摘要翻译：形成匹配层作为复合材料，例如2-2或1-3复合材料。基材形成复合匹配层和体积的一部分，例如5体积％以上的体积。填充，粘合或声隔离材料将基材的部分保持在一起并提供刚度和交叉耦合的控制。通过使用导电基材，从顶表面到底表面提供导电性。复合材料可以使用基材的切割，切口填充和固化填充的切口容易地制造。

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