会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明授权
    • Workpiece chuck with temperature control assembly having spacers between layers providing clearance for thermoelectric modules
    • 具有温度控制组件的工件卡盘,其具有在为热电模块提供间隙的层之间的间隔件
    • US06886347B2
    • 2005-05-03
    • US10617200
    • 2003-07-10
    • Douglas E. HudsonDana G. ButcherRichard B. GatesJames Pelrin
    • Douglas E. HudsonDana G. ButcherRichard B. GatesJames Pelrin
    • H01L21/02H01L21/00F25B21/02F25D23/12
    • H01L21/67109H01L2924/0002H01L2924/00
    • A workpiece chuck and method for supporting a workpiece such as a semiconductor wafer are described. The workpiece chuck includes an upper surface for supporting the wafer and a temperature control assembly in thermal communication with the upper surface to control temperature in the wafer. The temperature control assembly includes one or more thermoelectric modules between an upper and lower layers. One or more spacers between the upper and lower layers provide a space between the upper and lower layers such that the one or more thermoelectric modules vertically float in the space. That is, the upper and lower layers of the temperature control modules do not mechanically constrain the thermoelectric modules in the vertical direction. As a result, mechanical stresses on the thermoelectric modules due to temperature effects are substantially reduced or eliminated, resulting in much higher reliability of the chuck and the thermoelectric modules over temperature. Also, the spacers provided additional mechanical stability to the chuck, resulting in improved flatness of the chuck upper surface over temperature. To provide additional stability and improve performance over temperature, the thermoelectric modules can be made effectively smaller. This can be done by segmenting the modules into multiple segments or by providing a plurality of submodules connected together.
    • 描述了用于支撑诸如半导体晶片的工件的工件卡盘和方法。 工件卡盘包括用于支撑晶片的上表面和与上表面热连通的温度控制组件以控制晶片中的温度。 温度控制组件包括在上层和下层之间的一个或多个热电模块。 上层和下层之间的一个或多个间隔件在上层和下层之间提供了一个空间,使得一个或多个热电模块在空间中垂直浮动。 也就是说,温度控制模块的上层和下层不在垂直方向上机械地约束热电模块。 结果,由于温度影响导致的热电模块上的机械应力显着降低或消除,导致卡盘和热电模块在温度上的可靠性高得多。 此外,间隔件为卡盘提供了额外的机械稳定性,导致卡盘上表面的温度平坦度提高。 为了提供额外的稳定性并且提高温度的性能,可以使热电模块有效地更小。 这可以通过将模块分段成多个段或通过提供连接在一起的多个子模块来完成。