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1. 发明授权

US06307258B1 Open-cavity semiconductor die package 失效
标题翻译：开放式半导体模具封装
公开(公告)号：US06307258B1
公开(公告)日：2001-10-23
申请号：US09218180
申请日：1998-12-22
申请人： Stanford W. Crane, Jr. , Lakshminarasimha Krishnapura , Yun Li
发明人： Stanford W. Crane, Jr. , Lakshminarasimha Krishnapura , Yun Li
IPC分类号： H01L2302
CPC分类号： H01L23/057 , H01L24/48 , H01L2224/05599 , H01L2224/48091 , H01L2224/48247 , H01L2224/85444 , H01L2924/00014 , H01L2924/01079 , H01L2924/16195 , H01L2924/181 , H01L2924/3025 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2924/00
摘要： A semiconductor die carrier includes a housing that defines a cavity for holding one or more semiconductor dies, electrically conductive leads, and a cover plate having an aperture formed therethrough. The housing includes insulative side walls and a end plate joined to the side walls. The side walls and the end plate may be molded together as a one-piece unit. One or more of the side walls includes openings for receiving the leads so that an internal lead section extends within the cavity and an external lead section extends from the side walls external of the housing. The side walls may include a recess for receiving the cover plate. The aperture in the cover plate allows a semiconductor die held in the housing to be exposed to the environment.
摘要翻译：半导体管芯载体包括限定用于保持一个或多个半导体管芯，导电引线和具有穿过其形成的孔的盖板的壳体。壳体包括绝缘侧壁和连接到侧壁的端板。侧壁和端板可以一体地模制在一起。一个或多个侧壁包括用于接收引线的开口，使得内部引线部分在空腔内延伸，并且外部引线部分从壳体外部的侧壁延伸。侧壁可以包括用于接收盖板的凹部。盖板中的孔允许保持在壳体中的半导体管芯暴露于环境中。

2. 发明授权

US06266246B1 Multi-chip module having interconnect dies 失效
标题翻译：具有互连芯片的多芯片模块
公开(公告)号：US06266246B1
公开(公告)日：2001-07-24
申请号：US09484047
申请日：2000-01-18
申请人： Stanford W. Crane, Jr. , Lakshminarasimha Krishnapura , Yun Li , Moises Behar , Dan Fuoco , Bill Ahearn
发明人： Stanford W. Crane, Jr. , Lakshminarasimha Krishnapura , Yun Li , Moises Behar , Dan Fuoco , Bill Ahearn
IPC分类号： H05K720
CPC分类号： H01L23/5382 , H01L23/49861 , H01L23/5385 , H01L24/48 , H01L24/49 , H01L25/0655 , H01L2224/48137 , H01L2224/49171 , H01L2924/00014 , H01L2924/01079 , H01L2924/14 , H01L2924/1433 , H01L2924/30107 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399
摘要： A multi-chip module includes a housing having insulative side walls and an end plate, conductive leads extending from the side walls, integrated circuit (IC) dies mounted to the end plate, and one or more interconnect dies mounted to the end plate. The end plate is made from a heat sink material, such as copper. Each interconnect die is positioned between a pair of the IC dies. Electrically conductive material connects the IC dies to the interconnect die, connects the IC dies to the conductive leads, and connects the interconnect dies to the conductive leads. The interconnect dies function to interconnect the IC dies and to interconnect the IC dies to the conductive leads. The interconnect die may be embodied by wiring layers formed on a silicon substrate.
摘要翻译：多芯片模块包括具有绝缘侧壁和端板的壳体，从侧壁延伸的导电引线，安装到端板的集成电路（IC）模具和安装到端板的一个或多个互连模具。端板由诸如铜的散热材料制成。每个互连裸片位于一对IC芯片之间。导电材料将IC芯片连接到互连裸片，将IC芯片连接到导电引线，并将互连裸片连接到导电引线。互连管芯用于互连IC管芯并将IC管芯与导电引线互连。互连裸片可以由形成在硅衬底上的布线层来实现。

3. 发明授权

US06475832B2 Open-cavity semiconductor die package 失效
公开(公告)号：US06475832B2
公开(公告)日：2002-11-05
申请号：US09950702
申请日：2001-09-13
申请人： Stanford W. Crane, Jr. , Lakshminarasimha Krishnapura , Yun Li
发明人： Stanford W. Crane, Jr. , Lakshminarasimha Krishnapura , Yun Li
IPC分类号： H01L2144
CPC分类号： H01L23/057 , H01L24/48 , H01L2224/05599 , H01L2224/48091 , H01L2224/48247 , H01L2224/85444 , H01L2924/00014 , H01L2924/01079 , H01L2924/16195 , H01L2924/181 , H01L2924/3025 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2924/00
摘要： A semiconductor die carrier includes a housing that defines a cavity for holding one or more semiconductor dies, electrically conductive leads, and a cover plate having an aperture formed therethrough. The housing includes insulative side walls and a end plate joined to the side walls. The side walls and the end plate may be molded together as a one-piece unit. One or more of the side walls includes openings for receiving the leads so that an internal lead section extends within the cavity and an external lead section extends from the side walls external of the housing. The side walls may include a recess for receiving the cover plate. The aperture in the cover plate allows a semiconductor die held in the housing to be exposed to the environment.

4. 发明授权

US06421254B2 Multi-chip module having interconnect dies 失效
公开(公告)号：US06421254B2
公开(公告)日：2002-07-16
申请号：US09903699
申请日：2001-07-13
申请人： Stanford W. Crane, Jr. , Lakshminarasimha Krishnapura , Yun Li , Moises Behar , Dan Fuoco , Bill Ahearn
发明人： Stanford W. Crane, Jr. , Lakshminarasimha Krishnapura , Yun Li , Moises Behar , Dan Fuoco , Bill Ahearn
IPC分类号： H05K700
CPC分类号： H01L23/5382 , H01L23/49861 , H01L23/5385 , H01L24/48 , H01L24/49 , H01L25/0655 , H01L2224/48137 , H01L2224/49171 , H01L2924/00014 , H01L2924/01079 , H01L2924/14 , H01L2924/1433 , H01L2924/30107 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399
摘要： A multi-chip module includes a housing having insulative side walls and an end plate, conductive leads extending from the side walls, integrated circuit (IC) dies mounted to the end plate, and one or more interconnect dies mounted to the end plate. The end plate is made from a heat sink material, such as copper. Each interconnect die is positioned between a pair of the IC dies. Electrically conductive material connects the IC dies to the interconnect die, connects the IC dies to the conductive leads, and connects the interconnect dies to the conductive leads. The interconnect dies function to interconnect the IC dies and to interconnect the IC dies to the conductive leads. The interconnect die may be embodied by wiring layers formed on a silicon substrate.

5. 发明授权

US6016256A Multi-chip module having interconnect dies 失效
公开(公告)号：US6016256A
公开(公告)日：2000-01-18
申请号：US970379
申请日：1997-11-14
申请人： Stanford W. Crane, Jr. , Lakshminarasimha Krishnapura , Yun Li , Moises Behar , Dan Fuoco , Bill Ahearn
发明人： Stanford W. Crane, Jr. , Lakshminarasimha Krishnapura , Yun Li , Moises Behar , Dan Fuoco , Bill Ahearn
IPC分类号： H01L25/18 , H01L23/498 , H01L23/538 , H01L25/065 , H01L25/07 , H05K5/00 , H01L23/053 , H01L23/057
CPC分类号： H01L23/5382 , H01L23/49861 , H01L23/5385 , H01L25/0655 , H01L2224/48137 , H01L2224/49171 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01079 , H01L2924/14 , H01L2924/1433 , H01L2924/30107
摘要： A multi-chip module includes a housing having insulative side walls and an end plate, conductive leads extending from the side walls, integrated circuit (IC) dies mounted to the end plate, and one or more interconnect dies mounted to the end plate. The end plate is made from a heat sink material, such as copper. Each interconnect die is positioned between a pair of the IC dies. Electrically conductive material connects the IC dies to the interconnect die, connects the IC dies to the conductive leads, and connects the interconnect dies to the conductive leads. The interconnect dies function to interconnect the IC dies and to interconnect the IC dies to the conductive leads. The interconnect die may be embodied by wiring layers formed on a silicon substrate.

6. 发明授权

US06709891B2 Open-cavity semiconductor die package 失效
标题翻译：开放式半导体模具封装
公开(公告)号：US06709891B2
公开(公告)日：2004-03-23
申请号：US10231347
申请日：2002-08-30
申请人： Sanford W. Crane, Jr. , Lakshminarasimha Krishnapura , Yun Li
发明人： Sanford W. Crane, Jr. , Lakshminarasimha Krishnapura , Yun Li
IPC分类号： H01L2144
CPC分类号： H01L23/057 , H01L24/48 , H01L2224/05599 , H01L2224/48091 , H01L2224/48247 , H01L2224/85444 , H01L2924/00014 , H01L2924/01079 , H01L2924/16195 , H01L2924/181 , H01L2924/3025 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2924/00
摘要： A semiconductor die carrier includes a housing that defines a cavity for holding one or more semiconductor dies, electrically conductive leads, and a cover plate having an aperture formed therethrough. The housing includes insulative side walls and a end plate joined to the side walls. The side walls and the end plate may be molded together as a one-piece unit. One or more of the side walls includes openings for receiving the leads so that an internal lead section extends within the cavity and an external lead section extends from the side walls external of the housing. The side walls may include a recess for receiving the cover plate. The aperture in the cover plate allows a semiconductor die held in the housing to be exposed to the environment.
摘要翻译：半导体管芯载体包括限定用于保持一个或多个半导体管芯，导电引线和具有穿过其形成的孔的盖板的壳体。壳体包括绝缘侧壁和连接到侧壁的端板。侧壁和端板可以一体地模制在一起。一个或多个侧壁包括用于接收引线的开口，使得内部引线部分在空腔内延伸，并且外部引线部分从壳体外部的侧壁延伸。侧壁可以包括用于接收盖板的凹部。盖板中的孔允许保持在壳体中的半导体管芯暴露于环境中。

7. 外观设计

USD1036799S1 Clean water tank of vacuum cleaner 有权
公开(公告)号：USD1036799S1
公开(公告)日：2024-07-23
申请号：US29824876
申请日：2022-01-27
申请人： Yun Li
设计人： Yun Li
摘要： FIG. 1 is a front elevational view of a clean water tank of vacuum cleaner showing my new design;
FIG. 2 is a left side elevational view thereof;
FIG. 3 is a right side elevational view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a rear elevational view thereof;
FIG. 7 is a first perspective view thereof;
FIG. 8 is a second perspective view thereof; and,
FIG. 9 is a third perspective view thereof.
The broken lines shown in the drawings are for the purpose of illustrating portions of the article and form no part of the claimed design.

8. 发明授权

US08416682B2 Method and implementing apparatus for cooperative multi-hop routing in wireless network 有权
标题翻译：无线网络中协同多跳路由的方法与实现装置
公开(公告)号：US08416682B2
公开(公告)日：2013-04-09
申请号：US13472779
申请日：2012-05-16
申请人： Yun Li , Hongcheng Zhuang , Rui Wang
发明人： Yun Li , Hongcheng Zhuang , Rui Wang
IPC分类号： G01R31/08 , G06F11/00 , G08C15/00 , H04J1/16 , H04J3/14 , H04L1/00 , H04L12/26
CPC分类号： H04B7/155 , H04B7/022 , H04L45/24 , H04W84/18 , H04W88/04 , Y02D70/34
摘要： The present invention relates to a method and an implementing apparatus for cooperative multi-hop routing in a wireless network. According to the method the diversity gains and the interrupt probabilities in a cooperative communication manner between master nodes in the route are obtained, and the segmenting mode for sending packet data is determined accordingly, thus implementing cooperative communication in a multi-hop route, where signals having same information are sent through different paths, and multiple independently faded copies of data symbols may be obtained at a receiver end, thus obtaining higher reception reliability and higher transmission capacity, and improving performance of a communication process.
摘要翻译：本发明涉及无线网络中协同多跳路由的方法和实现装置。根据该方法，获得路由中的主节点之间的协作通信方式的分集增益和中断概率，并且相应地确定用于发送分组数据的分段模式，从而在多跳路由中实现协作通信，其中信号具有相同的信息通过不同的路径发送，并且可以在接收机端获得数据符号的多个独立褪色的副本，从而获得更高的接收可靠性和更高的传输容量，并且提高通信过程的性能。

9. 发明授权

US08042412B2 Turbomachinery system fiberoptic multi-parameter sensing system and method 有权
标题翻译：涡轮机械系统光纤多参数传感系统及方法
公开(公告)号：US08042412B2
公开(公告)日：2011-10-25
申请号：US12215094
申请日：2008-06-25
申请人： Hua Xia , Norman Arnold Turnquist , David So Keung Chan , Danian Zheng , Kevin Thomas McCarthy , Richard Joseph Gawrelski , Matthew Damian Pietrzykowski , Alexander Seth Ross , Yun Li , Juntao Wu
发明人： Hua Xia , Norman Arnold Turnquist , David So Keung Chan , Danian Zheng , Kevin Thomas McCarthy , Richard Joseph Gawrelski , Matthew Damian Pietrzykowski , Alexander Seth Ross , Yun Li , Juntao Wu
IPC分类号： G01D9/00 , G01L1/24 , G01L3/00
CPC分类号： G01L3/12 , G01H9/004 , G01L3/109 , G01M11/081
摘要： A fiberoptic multi-parameter sensing system for monitoring turbomachinery system shaft static and dynamic torques, vibration modes and associated operation status includes a multi-furcated fiber bundle based optical splitter configured to transmit light to a surface of at least one turbomachinery system shaft through a plurality of optical fiber bundles disposed at a plurality of locations in proximity to the surface of the at least one shaft, in which the plurality of locations together are arranged in a substantially axial direction between the ends of the at least one shaft. The system further includes an array of high-temperature bifurcated fiber bundle based reflectance probes to receive reflectance signals from the shaft surface and send to an array of photosensitive detectors, configured to detect dynamic light reflected from the at least one turbomachinery system shaft surface in response to the transmitted light during rotation of at least one turbomachinery system shaft and generate dynamic reflected light signals there from. A sensing mechanism is configured to determine a torque or vibration on at least one turbomachinery system shaft in response to the dynamic reflected light signal signatures based on time-domain and frequency-domain signal processes.
摘要翻译：用于监测涡轮机械系统轴静态和动态扭矩，振动模式和相关操作状态的光纤多参数感测系统包括多分叉光纤束分光镜，其被配置为通过多个透镜将光透射到至少一个涡轮机械系统轴的表面设置在所述至少一个轴的表面附近的多个位置的光纤束，其中所述多个位置一起在所述至少一个轴的端部之间沿大致轴向布置。该系统还包括一组高温分叉纤维束的反射探测器，用于接收来自轴表面的反射信号并发送到一组光敏检测器，该阵列被配置为响应于检测从至少一个涡轮机械系统轴表面反射的动态光在至少一个涡轮机械系统轴的旋转期间的透射光，并且从那里产生动态反射光信号。感测机构被配置为响应于基于时域和频域信号处理的动态反射光信号特征来确定至少一个涡轮机械系统轴上的扭矩或振动。

10. 发明授权

US07898176B2 Fluidic thermal management article and method 有权
标题翻译：流体热管理文章和方法
公开(公告)号：US07898176B2
公开(公告)日：2011-03-01
申请号：US11863722
申请日：2007-09-28
申请人： Yun Li , Mark Lewis Grabb , John Erik Hershey , Jian Zhang , Hua Xia , Gelu Comanescu
发明人： Yun Li , Mark Lewis Grabb , John Erik Hershey , Jian Zhang , Hua Xia , Gelu Comanescu
IPC分类号： H01J1/62 , H01J63/04
CPC分类号： H05K7/20981 , Y10T428/249953 , Y10T428/26 , Y10T428/31504
摘要： An article includes a display layer having an outward facing surface and an inward facing surface. The display layer includes a light-emitting device that generates heat and light during use. A thermal transport layer may be secured to the display layer. The thermal transport layer may include a microfluidic layer including a coolant that can transport heat generated by the light-emitting device away from the light-emitting device. An article includes a display structure having a height, a width, and a thickness that define a volume. The display structure can include components that emit light to generate a three-dimensional image within the volume. The display structure includes a stack. The display structure also includes a thermal dissipation layer in contact with the sheet or stack that can transport generated heat from the sheet or stack to a heat absorbing structure.
摘要翻译：一种物品包括具有向外表面和向内表面的显示层。显示层包括在使用期间产生热和光的发光装置。热传输层可以固定到显示层。热传输层可以包括微流体层，该微流体层包括可将由发光器件产生的热量远离发光器件的冷却剂。一种物品包括具有限定体积的高度，宽度和厚度的显示结构。显示结构可以包括发射光以在该体积内产生三维图像的组件。显示结构包括堆叠。显示结构还包括与板或堆叠接触的散热层，其可以将产生的热量从片材或堆叠传送到吸热结构。

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