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    • 3. 发明授权
    • Toothbrush including kit for decorating said toothbrush
    • 牙刷包括用于装饰牙刷的套件
    • US09016471B2
    • 2015-04-28
    • US13992167
    • 2011-11-11
    • Eduardo JimenezDavid K. LeeQuang Nguyen
    • Eduardo JimenezDavid K. LeeQuang Nguyen
    • A46B15/00A46B17/00A45D44/18
    • A46B15/0085A46B15/0087A46B15/0091A46B2200/1066
    • A kit for decorating a toothbrush includes the toothbrush having a base portion, and at least one decorative band sized to fit around the outer perimeter of the base portion of the toothbrush. A second embodiment of the kit includes the toothbrush, a writing instrument and an area designated on the base portion for marking with the writing instrument. A third embodiment of the kit includes the toothbrush, a writing instrument, an area designated on the base portion for marking with the writing implement and at least one decorative band sized to fit around the outer perimeter of the base portion of the toothbrush. Any of the kits may include at least one sticker sized to fit on the base portion of the toothbrush. Any of the kits may also include a panel including one or more stickers and/or one or more decorative bands.
    • 用于装饰牙刷的套件包括具有基部的牙刷,以及至少一个装饰带,其尺寸适于围绕牙刷的基部的外周配合。 套件的第二实施例包括牙刷,书写工具和指定在基座部分上用于用书写工具进行标记的区域。 该套件的第三实施例包括牙刷,书写工具,指定在基座部分上用于与书写工具进行标记的区域以及至少一个装饰带,其尺寸适于围绕牙刷基部的外周配合。 任何套件可以包括至少一个大小适合贴在牙刷基部上的贴纸。 任何套件还可以包括包括一个或多个贴纸和/或一个或多个装饰带的面板。
    • 9. 发明授权
    • Integrated circuit chip package and method of making the same
    • 集成电路芯片封装及其制作方法
    • US6124546A
    • 2000-09-26
    • US984547
    • 1997-12-03
    • James HaywardQuang Nguyen
    • James HaywardQuang Nguyen
    • H01L23/31H01L23/498H01L23/28
    • H01L23/3128H01L23/49833H01L2924/0002
    • A semiconductor integrated circuit chip package includes top and bottom interposers 2 and 4, a semiconductor die 14 attached to the top interposer 2, a wirebond 18 or a flipchip connector 52 connected between the die 14 and the top interposer 2, and a tab bond 22 providing an electrical connection from the wirebond 18 or the flipchip connector 52 to outside the bottom interposer 4. A method of making the chip package includes providing top and bottom interposers 2 and 4, attaching a semiconductor die 14 to the top interposer 2, providing a wirebond 18 or a flipchip connector 52 between the die 14 and the top interposer 2, providing a tab bond 22 between the top and bottom interposers 2 and 4, and providing an encapsulant 16 to fill the intermediate volume 40 between the top and bottom interposers 2 and 4.
    • 半导体集成电路芯片封装包括顶部和底部插入件2和4,连接到顶部插入件2的半导体管芯14,连接在管芯14和顶部插入件2之间的引线接合件18或倒装芯片连接器52以及接头接合22 提供从引线键18或倒装芯片连接器52到底部插入件4的外部的电连接。制造芯片封装的方法包括提供顶部和底部插入件2和4,将半导体管芯14附接到顶部插入件2, 引线键18或芯片连接器52在芯片14和顶部插入件2之间提供在顶部和底部插入件2和4之间的接头接合22,并且提供密封剂16以填充顶部和底部插入件2之间的中间体积40 和4。