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1. 发明申请

US20230071961A1 SENSOR MODULE 有权
公开(公告)号：US20230071961A1
公开(公告)日：2023-03-09
申请号：US17799231
申请日：2021-02-10
申请人： Sony Semiconductor Solutions Corporation
发明人： Hirofumi Owaki , Tomonori Agawa , Kunihiko Togano , Hiroo Suzuki
IPC分类号： H04N5/225 , H05K9/00
摘要： A sensor module according to an embodiment of the present technology includes a housing, a sensor board, an external connector, a flexible printed circuit, and a metallic shield case. The flexible printed circuit electrically connects the sensor board and the external connector, the flexible printed circuit including a signal line and a ground line. The shield case includes a bottom portion that is arranged between the flexible printed circuit and the external connector. The external connector includes a first connection pin that is connected to the signal line, a second connection pin that is connected to the ground line, and a third connection pin that is connected to the bottom portion of the shield case. The bottom portion includes a first hole, a second hole, a third hole, and a thermal storage, the first hole being a hole through which the first connection pin passes, the second hole being a hole through which the second connection pin passes, the third hole being a hole through which the third connection pin passes, the thermal storage being provided around the third hole and covered with a solder material used to join the third connection pin to the bottom portion.

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