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1. 发明申请

US20130200343A1 SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND METHOD OF FORMING MULTILAYER SEMICONDUCTOR THIN FILM 失效
标题翻译：半导体器件及其制造方法以及形成多层半导体薄膜的方法
公开(公告)号：US20130200343A1
公开(公告)日：2013-08-08
申请号：US13771846
申请日：2013-02-20
申请人： Sony Corporation
发明人： NORIHITO KOBAYASHI , Mari Sasaki , Takahiro Ohe
IPC分类号： H01L51/00 , H01L51/05
CPC分类号： H01L51/0062 , H01L51/0003 , H01L51/0073 , H01L51/0516 , H01L51/052 , H01L51/0558
摘要： A semiconductor device including a gate electrode, a gate insulating layer, source/drain electrodes, and a channel-forming region that are disposed on a base is provided. The method includes the steps of forming a thin film by application of a mixed solution including a polymeric insulating material and a dioxaanthanthrene compound represented by structural formula (1) below; and subsequently drying the thin film to induce phase separation of the polymeric insulating material and the dioxaanthanthrene compound, thereby forming the gate insulating layer from the polymeric insulating material and the channel-forming region from the dioxaanthanthrene compound: wherein at least one of R3 and R9 represents a substituent other than hydrogen.
摘要翻译：提供了一种包括设置在基座上的栅电极，栅极绝缘层，源/漏电极和沟道形成区域的半导体器件。该方法包括以下步骤：通过使用包含以下结构式（1）表示的聚合绝缘材料和二氧杂蒽化合物的混合溶液形成薄膜; 随后干燥该薄膜以诱发聚合物绝缘材料和二氧杂蒽化合物的相分离，由此从二氧杂蒽化合物的聚合物绝缘材料和沟道形成区形成栅极绝缘层：其中R3和R9中的至少一个表示除氢以外的取代基。

2. 发明授权

US11492486B2 Flame retardant resin composition 有权
公开(公告)号：US11492486B2
公开(公告)日：2022-11-08
申请号：US16337638
申请日：2017-07-26
申请人： Sony Corporation
发明人： Takahiro Ohe , Yasuhito Inagaki , Akito Kuriyama , Kenji Ueda , Kohei Shimizu
IPC分类号： C08L69/00 , C09K21/10 , C09K21/12 , C09K21/14 , B29B17/02
摘要： To provide a flame retardant resin composition having excellent flame retardancy and excellent resin physical properties.
There is provided a flame retardant resin composition, including: an aromatic polycarbonate resin; an inorganic filler; a phosphate ester flame retardant; an organic sulfonic acid flame retardant; a drip preventing agent; and a polyorganosiloxane-containing graft copolymer, in which a content of the aromatic polycarbonate resin is 40 to 95 pts.mass to 5 to 60 pts.mass of the inorganic filler, and a content of the phosphate ester flame retardant, a content of the organic sulfonic acid flame retardant, a content of the drip preventing agent, and a content of the polyorganosiloxane-containing graft copolymer are respectively 1 to 30 pts.mass, 0.01 to 2.5 pts.mass, 0.05 to 1.5 pts.mass, and 0 to 10 pts.mass to the total 100 pts.mass of the aromatic polycarbonate resin and the inorganic filler.

3. 发明申请

US20200032050A1 FLAME RETARDANT RESIN COMPOSITION 审中-公开
公开(公告)号：US20200032050A1
公开(公告)日：2020-01-30
申请号：US16337638
申请日：2017-07-26
申请人： Sony Corporation
发明人： Takahiro Ohe , Yasuhito Inagaki , Akito Kuriyama , Kenji Ueda , Kohei Shimizu
IPC分类号： C08L69/00 , C09K21/12 , C09K21/14 , C09K21/10
摘要： To provide a flame retardant resin composition having excellent flame retardancy and excellent resin physical properties.There is provided a flame retardant resin composition, including: an aromatic polycarbonate resin; an inorganic filler; a phosphate ester flame retardant; an organic sulfonic acid flame retardant; a drip preventing agent; and a polyorganosiloxane-containing graft copolymer, in which a content of the aromatic polycarbonate resin is 40 to 95 pts.mass to 5 to 60 pts.mass of the inorganic filler, and a content of the phosphate ester flame retardant, a content of the organic sulfonic acid flame retardant, a content of the drip preventing agent, and a content of the polyorganosiloxane-containing graft copolymer are respectively 1 to 30 pts.mass, 0.01 to 2.5 pts.mass, 0.05 to 1.5 pts.mass, and 0 to 10 pts.mass to the total 100 pts.mass of the aromatic polycarbonate resin and the inorganic filler.

4. 发明授权

US11434364B2 Transparent resin composition and transparent resin molded article 有权
公开(公告)号：US11434364B2
公开(公告)日：2022-09-06
申请号：US16337990
申请日：2017-07-26
申请人： Sony Corporation
发明人： Akito Kuriyama , Yasuhito Inagaki , Takahiro Ohe , Kenji Ueda , Kohei Shimizu
IPC分类号： C08L69/00 , C08G64/04 , C08G64/18 , C08K3/40 , C08K5/42 , C08K7/20 , C08L25/06 , C08L27/18 , C08L83/04
摘要： To provide a transparent resin composition having excellent optical characteristics, particularly, excellent optical characteristics under high temperature and high humidity.
There is provided a transparent resin composition, including: an aromatic polycarbonate resin; and a water-insoluble organic sulfonic acid and/or a metal salt thereof, in which a content of the water-insoluble organic sulfonic acid and/or the metal salt thereof is 0.01 to 3.0 pts·mass to 100 pts·mass of the aromatic polycarbonate resin, and a dissolved amount of the water-insoluble organic sulfonic acid and/or the metal salt thereof is not more than 0.5 g to 100 g of pure water.

5. 发明申请

US20200024444A1 TRANSPARENT RESIN COMPOSITION AND TRANSPARENT RESIN MOLDED ARTICLE 审中-公开
公开(公告)号：US20200024444A1
公开(公告)日：2020-01-23
申请号：US16337990
申请日：2017-07-26
申请人： Sony Corporation
发明人： Akito Kuriyama , Yasuhito Inagaki , Takahiro Ohe , Kenji Ueda , Kohei Shimizu
IPC分类号： C08L69/00 , C08G64/04 , C08G64/18 , C08L83/04 , C08L27/18 , C08L25/06 , C08K5/42 , C08K3/40 , C08K7/20
摘要： To provide a transparent resin composition having excellent optical characteristics, particularly, excellent optical characteristics under high temperature and high humidity.There is provided a transparent resin composition, including: an aromatic polycarbonate resin; and a water-insoluble organic sulfonic acid and/or a metal salt thereof, in which a content of the water-insoluble organic sulfonic acid and/or the metal salt thereof is 0.01 to 3.0 pts·mass to 100 pts·mass of the aromatic polycarbonate resin, and a dissolved amount of the water-insoluble organic sulfonic acid and/or the metal salt thereof is not more than 0.5 g to 100 g of pure water.

6. 发明授权

US09909005B2 Resin composition and resin molded object 有权
公开(公告)号：US09909005B2
公开(公告)日：2018-03-06
申请号：US14420562
申请日：2013-07-18
申请人： Sony Corporation
发明人： Atsushi Yamada , Kenji Ueda , Takahiro Ohe , Yasuhito Inagaki
IPC分类号： C08L69/00
CPC分类号： C08L69/00 , C08K5/42 , C08L27/18 , C08L83/04 , C08L2201/02
摘要： A halogen-free type polycarbonate resin composition and a resin molded object having good flame retardant properties and physical properties that make them suitable for the use as manufactured products. The resin component includes a component A which is a polycarbonate resin, a component B including organic sulfonic acid or organic sulfonic acid metal salt, whose content is 0.05% or more and 2.0% or less by weight, a component C which is a drip inhibitor, whose content is 0.05% or more and 1.0% or less by weight, and a component D which is a silicone compound, whose content is 0.1% or more and 2.0% or less by weight. Among hydrogen atoms in the silicone compound and the proportion of hydrogen atoms in phenyl groups is 51% or more.

7. 发明授权

US09796846B2 Resin composition and resin molded object 有权
公开(公告)号：US09796846B2
公开(公告)日：2017-10-24
申请号：US14422391
申请日：2013-06-12
申请人： Sony Corporation
发明人： Kenji Ueda , Yasuhito Inagaki , Takahiro Ohe , Atsushi Yamada
IPC分类号： C08L69/00
CPC分类号： C08L69/00 , C08K3/34 , C08K5/42 , C08L27/18 , C08L2201/02
摘要： A halogen-free type polycarbonate resin composition and a resin molded object having good flame retardant properties and physical properties that make them suitable for the use as manufactured products are provided. A resin composition of the present disclosure includes a component A, a component B, a component C and a component D. The component A is a polycarbonate resin. The component B is talc having an average median diameter of 4.6 μm or more and 6.0 μm or less, whose content is 5% or more and 20% or less by weight. The component C is an organic sulfonic acid or an organic sulfonic acid metal salt, whose content is 0.05% or more and 2.0% or less by weight. The component D is a drip inhibitor, whose content is 0.05% or more and 1.0% or less by weight.

8. 发明申请

US20150210850A1 RESIN COMPOSITION AND RESIN MOLDED OBJECT 有权
标题翻译：树脂组合物和树脂模塑对象
公开(公告)号：US20150210850A1
公开(公告)日：2015-07-30
申请号：US14420562
申请日：2013-07-18
申请人： Sony Corporation
发明人： Atsushi Yamada , Kenji Ueda , Takahiro Ohe , Yasuhito Inagaki
IPC分类号： C08L69/00
CPC分类号： C08L69/00 , C08K5/42 , C08L27/18 , C08L83/04 , C08L2201/02
摘要： [Object] To provide a halogen-free type polycarbonate resin composition and a resin molded object having good flame retardant properties and physical properties that make them suitable for the use as manufactured products.[Solving Means] A resin composition includes a component A which is a polycarbonate resin; a component B including organic sulfonic acid or organic sulfonic acid metal salt, whose content is 0.05% or more and 2.0% or less by weight; a component C which is a drip inhibitor, whose content is 0.05% or more and 1.0% or less by weight; and a component D which is a silicone compound, whose content is 0.1% or more and 2.0% or less by weight. Among hydrogen atoms in the silicone compound, the proportion of hydrogen atoms in phenyl groups is 51% or more; and/or the proportion of hydrogen atoms in hydrogen groups is 22% or more.
摘要翻译：提供一种无卤型聚碳酸酯树脂组合物和具有良好阻燃性和物理性能的树脂模制品，使其适合用作制成品。树脂组合物包含作为聚碳酸酯树脂的成分A，包括有机磺酸或有机磺酸金属盐的组分B，其含量为0.05重量％以上且2.0重量％以下; 作为滴液抑制剂的成分C，其含量为0.05重量％以上且1.0重量％以下; 和作为硅酮化合物的成分D，其含量为0.1重量％以上且2.0重量％以下。在硅氧烷化合物中的氢原子中，苯基中氢原子的比例为51％以上; 和/或氢原子的比例为22％以上。

9. 发明申请

US20150218370A1 RESIN COMPOSITION AND RESIN MOLDED OBJECT 有权
标题翻译：树脂组合物和树脂模塑对象
公开(公告)号：US20150218370A1
公开(公告)日：2015-08-06
申请号：US14422391
申请日：2013-06-12
申请人： Sony Corporation
发明人： Kenji Ueda , Yasuhito Inagaki , Takahiro Ohe , Atsushi Yamada
IPC分类号： C08L69/00
CPC分类号： C08L69/00 , C08K3/34 , C08K5/42 , C08L27/18 , C08L2201/02
摘要： To provide a halogen-free type polycarbonate resin composition and a resin molded object having good flame retardant properties and physical properties that make them suitable for the use as manufactured products.A resin composition of the present disclosure includes a component A, a component B, a component C and a component D. The component A is a polycarbonate resin. The component B is talc having an average median diameter of 4.6 μm or more and 6.0 μm or less, whose content is 5% or more and 20% or less by weight. The component C is an organic sulfonic acid or an organic sulfonic acid metal salt, whose content is 0.05% or more and 2.0% or less by weight. The component D is a drip inhibitor, whose content is 0.05% or more and 1.0% or less by weight.
摘要翻译：提供一种无卤型聚碳酸酯树脂组合物和具有良好阻燃性和物理性能的树脂模制品，使其适合用作制成品。本公开的树脂组合物包含组分A，组分B，组分C和组分D.组分A是聚碳酸酯树脂。组分B是平均中值粒径为4.6μm以上且6.0μm以下的滑石，其含量为5重量％以上且20重量％以下。组分C是有机磺酸或有机磺酸金属盐，其含量为0.05重量％以上且2.0重量％以下。组分D为滴注抑制剂，其含量为0.05重量％以上且1.0重量％以下。

10. 发明授权

US08546796B2 Semiconductor device, method of manufacturing the same, and method of forming multilayer semiconductor thin film 失效
标题翻译：半导体装置及其制造方法以及多层半导体薄膜的形成方法
公开(公告)号：US08546796B2
公开(公告)日：2013-10-01
申请号：US13771846
申请日：2013-02-20
申请人： Sony Corporation
发明人： Norihito Kobayashi , Mari Sasaki , Takahiro Ohe
IPC分类号： H01L51/30
CPC分类号： H01L51/0062 , H01L51/0003 , H01L51/0073 , H01L51/0516 , H01L51/052 , H01L51/0558
摘要： A semiconductor device including a gate electrode, a gate insulating layer, source/drain electrodes, and a channel-forming region that are disposed on a base is provided. The method includes the steps of forming a thin film by application of a mixed solution including a polymeric insulating material and a dioxaanthanthrene compound represented by structural formula (1) below; and subsequently drying the thin film to induce phase separation of the polymeric insulating material and the dioxaanthanthrene compound, thereby forming the gate insulating layer from the polymeric insulating material and the channel-forming region from the dioxaanthanthrene compound: wherein at least one of R3 and R9 represents a substituent other than hydrogen.
摘要翻译：提供了一种包括设置在基座上的栅电极，栅极绝缘层，源/漏电极和沟道形成区域的半导体器件。该方法包括以下步骤：通过使用包含以下结构式（1）表示的聚合绝缘材料和二氧杂蒽化合物的混合溶液形成薄膜; 随后干燥该薄膜以诱发聚合物绝缘材料和二氧杂蒽化合物的相分离，由此从二氧杂蒽化合物的聚合物绝缘材料和沟道形成区形成栅极绝缘层：其中R3和R9中的至少一个表示除氢以外的取代基。

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