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    • 4. 发明授权
    • Bondhead alignment tool for a bonding apparatus
    • 用于粘合装置的粘合头对准工具
    • US07849896B2
    • 2010-12-14
    • US12037335
    • 2008-02-26
    • Ping Kong Joseph ChoyChung Sheung Tate YungJu FanHon Yu Peter Ng
    • Ping Kong Joseph ChoyChung Sheung Tate YungJu FanHon Yu Peter Ng
    • B32B41/00
    • H01L21/68H01L21/67144
    • An alignment tool for a bonding apparatus comprises a loading surface for receiving a pushing force from a surface of a device which is attached to the bonding apparatus, the loading surface being arranged and constructed to experience a tilting moment upon receiving an unequally distributed pushing force from a misaligned device acting on it. The loading surface transmits the tilting moment experienced by it to a sensing surface which is operatively connected to the loading surface through a columnar body, which has a smaller width than the loading surface and the sensing surface, and which connects the loading surface and the sensing surface. An array of piezoelectric elements communicates with the sensing surface and produces electrical signals in response to the tilting moment such that a computing unit operatively connected to the piezoelectric elements may detect a direction of tilt of the loading surface from the electrical signals produced by the piezoelectric elements.
    • 用于接合装置的对准工具包括用于从附接到接合装置的装置的表面接收推力的装载表面,所述装载表面被布置和构造成在接收到不均匀分布的推力时经历倾斜力矩 一个对准的装置。 装载表面将其经历的倾斜力矩传递到感测表面,该感测表面通过柱形体操作性地连接到装载表面,该柱状体具有比装载表面和感测表面更小的宽度,并且连接装载表面和感测 表面。 压电元件阵列与感测表面通信并且响应于倾斜力矩产生电信号,使得可操作地连接到压电元件的计算单元可以从由压电元件产生的电信号检测装载表面的倾斜方向 。