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1. 发明申请

US20110272189A1 SHIELDING DEVICE FOR SHIELDING AN ELECTRONIC COMPONENT 有权
标题翻译：用于屏蔽电子元件的屏蔽装置
公开(公告)号：US20110272189A1
公开(公告)日：2011-11-10
申请号：US13083865
申请日：2011-04-11
申请人： Singjang CHEN , Jonathan BENSON , Erica L. McCAY
发明人： Singjang CHEN , Jonathan BENSON , Erica L. McCAY
IPC分类号： H05K9/00 , H05K13/00
CPC分类号： H05K9/0024 , A61N1/3718 , A61N1/375 , A61N1/39 , H01F27/36 , H05K1/0218 , H05K2201/0715 , H05K2201/10371 , Y10T29/49002
摘要： A shielding device for shielding an electronic component (102) to be mounted on a printed circuit board (132). The shielding device exhibiting a top shielding (110) and a bottom shielding (120; 140; 160; 180) separable from each other, wherein the top shielding includes an electrically and/or magnetically conductive material and the bottom shielding is multilayered. The bottom shielding exhibits at least one electrically and/or magnetically conductive metal sheet layer (122; 162; 164) embedded between at least two insulating layers (126; 124) and includes at least two electrically conductive transmission lines (172; 174; 176) for conducting electric current to the electronic component. The top shielding and the conductive metal sheet layer are electrically isolated from the electronic component. The bottom shielding integrated into the printed circuit board and the top shielding and the bottom shielding designed such when they are attached to each other, they completely envelope the electronic component.
摘要翻译：一种用于屏蔽要安装在印刷电路板（132）上的电子部件（102）的屏蔽装置。所述屏蔽装置具有可分离的顶部屏蔽（110）和底部屏蔽（120; 140; 160; 180），其中所述顶部屏蔽包括电和/或导磁材料，并且所述底部屏蔽层是多层的。底部屏蔽表现出至少一个嵌入在至少两个绝缘层（126; 124）之间的电和/或导磁金属片层（122; 162; 164），并且包括至少两个导电传输线（172; 174; 176 ），用于向电子部件传导电流。顶部屏蔽和导电金属片层与电子部件电隔离。集成到印刷电路板中的底部屏蔽和顶部屏蔽和底部屏蔽设计成当彼此连接时，它们完全包围电子部件。

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