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1. 发明公开

US20230286067A1 METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES BY MEANS OF A WIRE SAW DURING A SEQUENCE OF SEPARATION PROCESSES 审中-公开
公开(公告)号：US20230286067A1
公开(公告)日：2023-09-14
申请号：US18008185
申请日：2021-05-20
申请人： Siltronic AG
发明人： Peter Wiesner , Wolfgang Gmach , Robert Kreuzeder
IPC分类号： B23D61/18 , B23D59/04 , B28D5/00 , B28D5/04
CPC分类号： B23D61/185 , B23D59/04 , B28D5/0064 , B28D5/045
摘要： A method cuts slices from workpieces using a wire saw having a wire array, which is tensioned in a plane between two wire guide rollers supported between fixed and floating bearings and having a chamber and a shell. The workpiece is fed through the wire array along a feed direction perpendicular to a workpiece axis, while simultaneously changing the shells' lengths by adjusting a temperature of the chambers with a first cooling fluid in accordance with a first correction profile specifying a change in the shells' lengths based on the depth of cut. The floating bearings are simultaneously axially moved by adjusting a temperature of the fixed bearings with a second cooling fluid in accordance with a second correction profile, which specifies a travel of the floating bearings based on the depth of cut. The first correction profile and the second correction profile are opposed to a shape deviation.

2. 发明授权

US09427888B2 Method for resuming a wire sawing process of a workpiece after an unplanned interruption 有权
标题翻译：在计划外中断后恢复工件的线锯工艺的方法
公开(公告)号：US09427888B2
公开(公告)日：2016-08-30
申请号：US14087163
申请日：2013-11-22
申请人： Siltronic AG
发明人： Peter Wiesner
IPC分类号： B28D5/04 , B23D57/00 , B28D1/08
CPC分类号： B28D5/045 , B23D57/0023 , B28D1/08
摘要： A method resumes an interrupted process for sawing a workpiece into wafers using a wire saw that includes advancing a wire web into existing sawing kerfs of the workpiece with a forward movement of the sawing wire with a first speed in the presence of a liquid sawing medium until the wire web or workpiece has reached a position corresponding to the interruption of the wire sawing process. The sawing wire is moved in defined time intervals by a forward movement of a particular length with a second speed and a backward movement of another length with a third speed, where the backward length is less than the forward length and the forward and backward movement correspond to a cycle. The wire length that is unwound during the forward movements is increased until the length during the forward movement corresponds to the length of the forward movement before the interruption.
摘要翻译：一种方法恢复使用线锯将工件锯切成晶片的中断过程，该线锯包括在存在液体锯切介质的情况下以一级速度向前移动金属丝网到工件的现有锯切切口中，直到丝网或工件已经到达与切线过程中断相对应的位置。通过具有第二速度的特定长度的向前移动和具有第三速度的另一长度的向后移动，锯齿线以规定的时间间隔移动，其中后向长度小于前进长度，并且向前和向后移动对应于到一个循环。在向前运动期间解开的线长度增加，直到向前运动期间的长度对应于中断之前的向前运动的长度。

3. 发明申请

US20140144420A1 METHOD FOR RESUMING A WIRE SAWING PROCESS OF A WORKPIECE AFTER AN UNPLANNED INTERRUPTION 有权
标题翻译：不间断中断后工作线路切割过程的方法
公开(公告)号：US20140144420A1
公开(公告)日：2014-05-29
申请号：US14087163
申请日：2013-11-22
申请人： Siltronic AG
发明人： Peter Wiesner
IPC分类号： B28D5/04
CPC分类号： B28D5/045 , B23D57/0023 , B28D1/08
摘要： A method resumes an interrupted process for sawing a workpiece into wafers using a wire saw that includes advancing a wire web into existing sawing kerfs of the workpiece with a forward movement of the sawing wire with a first speed in the presence of a liquid sawing medium until the wire web or workpiece has reached a position corresponding to the interruption of the wire sawing process. The sawing wire is moved in defined time intervals by a forward movement of a particular length with a second speed and a backward movement of another length with a third speed, where the backward length is less than the forward length and the forward and backward movement correspond to a cycle. The wire length that is unwound during the forward movements is increased until the length during the forward movement corresponds to the length of the forward movement before the interruption.
摘要翻译：一种方法恢复中断的过程，用于使用线锯将工件锯切成晶片，该线锯包括在存在液体锯切介质的情况下以一级速度向前移动金属丝网到工件的现有锯切切口中，直到丝网或工件已经到达与切线过程中断相对应的位置。通过具有第二速度的特定长度的向前移动和具有第三速度的另一长度的向后移动，锯齿线以规定的时间间隔移动，其中后向长度小于前进长度，并且向前和向后移动对应于到一个循环。在向前运动期间解开的线长度增加，直到向前运动期间的长度对应于中断之前的向前运动的长度。

4. 发明申请

US20230050459A1 METHOD FOR SEPARATING MULTIPLE SLICES OF WORKPIECES BY MEANS OF A WIRE SAW DURING A SEQUENCE OF SEPARATION PROCESSES 有权
公开(公告)号：US20230050459A1
公开(公告)日：2023-02-16
申请号：US17795235
申请日：2021-01-18
申请人： Siltronic AG
发明人： Georg Pietsch , Peter Wiesner
IPC分类号： B28D5/04 , B28D5/00
摘要： Wafers are sliced from a workpiece using a wire saw during slicing operations. The wire saw has a wire web of sawing wire and a setting device. The wire web is stretched in a plane between wire guide rollers that are mounted between fixed and moveable bearings. During each of the slicing operations, the setting device feeds the workpiece through the wire web along a feed direction perpendicular to a workpiece axis and perpendicular to the plane of the wire web. During each of the slicing operations, the movable bearings move oscillatingly axialy. The feeding of the workpiece through the wire web includes a simultaneous displacement of the workpiece along the workpiece axis using the setting element in accordance with a correction profile, which includes an oscillating component that is opposite to the effect which the axial moving of the movable bearings has on the shape of the sliced-off wafers.

5. 发明申请

US20150158203A1 METHOD FOR SLICING WAFERS FROM A WORKPIECE BY MEANS OF A WIRE SAW 有权
标题翻译：用于通过电线通过工件来切割工件的方法
公开(公告)号：US20150158203A1
公开(公告)日：2015-06-11
申请号：US14557479
申请日：2014-12-02
申请人： Siltronic AG
发明人： Peter Wiesner , Robert Kreuzeder
IPC分类号： B28D5/04
CPC分类号： B28D5/045
摘要： A method for sawing a multiplicity of wafers from a workpiece by means of a wire web of a wire saw includes providing a wire web consisting of a plurality of parallel wire sections. The wire web is spanned by at least two wire guide rollers where each wire guide rollers comprises a core having two side surfaces and a lateral surface. The core is composed of a first material. Each core is rotatably mounted along its longitudinal axis and comprises at least two separate cavities. The lateral surface of each core is enclosed by a jacket composed of a second material. Parallel groves are cut into the jacket for guiding the wire sections of the web. The length of the jacket is altered thermally by means of at least one cavity being filled with a temperature regulating medium.
摘要翻译：通过线锯的丝网从工件锯切多个晶片的方法包括提供由多个平行的线部分组成的导线网。金属丝网由至少两个导丝辊跨过，其中每个导丝辊包括具有两个侧表面和侧面的芯。核心由第一种材料组成。每个芯沿其纵向轴线可旋转地安装并且包括至少两个分离的空腔。每个芯的侧表面由由第二材料构成的护套包围。将平行的圆形切割成夹套以引导网的线段。夹套的长度通过至少一个填充有温度调节介质的空腔热变化。

6. 发明公开

US20230234261A1 METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES BY MEANS OF A WIRE SAW DURING A SEQUENCE OF SEPARATION PROCESSES 审中-公开
公开(公告)号：US20230234261A1
公开(公告)日：2023-07-27
申请号：US18009346
申请日：2021-05-27
申请人： Siltronic AG
发明人： Axel Beyer , Patrick Berger , Carl Frintert , Matthias Guenther , Peter Wiesner
IPC分类号： B28D7/02 , B28D5/04 , B28D7/04
CPC分类号： B28D7/02 , B28D5/045 , B28D7/04
摘要： The invention relates to a method for separating a plurality of slices from workpieces (4) by means of a wire saw, wherein a wire grating (2) is tensioned in a plane between two wire-guiding rollers (1), wherein each of the two wire-guiding rollers (1) is mounted between a fixed bearing (5) and a floating bearing (6). The method involves delivering the workpiece (4) via the wire grating (2) by controlling the temperature of the workpiece (4) by wetting the workpiece (4) with a cooling medium, while simultaneously axially shifting the floating bearing (6) by controlling the temperature of the fixed bearing (5) with a cooling fluid according to the specification of a first temperature profile, and while simultaneously shifting the workpiece (4) along the workpiece axis by means of a control element (15) according to the specification of a second correction profile.

7. 发明公开

US20230226629A1 METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES BY MEANS OF A WIRE SAW DURING A SEQUENCE OF SEPARATION PROCESSES 审中-公开
公开(公告)号：US20230226629A1
公开(公告)日：2023-07-20
申请号：US17928933
申请日：2021-06-07
申请人： Siltronic AG
发明人： Axel Beyer , Carl Frintert , Peter Wiesner
IPC分类号： B23D57/00 , B23D59/00 , B23D59/04 , B28D5/00 , B28D5/04
CPC分类号： B23D57/0023 , B23D57/0053 , B23D59/001 , B23D59/04 , B28D5/0064 , B28D5/045
摘要： A method uses a wire saw to cut slices from a workpiece. The wire saw has an array of saw wire tensioned in a plane between two rollers supported between fixed and floating bearings. During a cut-off operation, the workpiece is fed through the wire array with simultaneous axial movement of the floating bearings by adjusting the temperature of the fixed bearings with a cooling fluid in accordance with the temperature of the cooling fluid being in dependence on a depth of cut and correlating with a first correction profile, which specifies the travel of the floating bearings in dependence on the depth of cut. Also, the workpiece is fed through the wire array while simultaneously moving the workpiece along the workpiece axis in accordance with a second correction profile, specifying the travel of the workpiece. The first and second correction profiles are opposed to a shape deviation.

8. 发明公开

US20230234149A1 METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES BY MEANS OF A WIRE SAW DURING A SEQUENCE OF SEPARATION PROCESSES 审中-公开
公开(公告)号：US20230234149A1
公开(公告)日：2023-07-27
申请号：US18009348
申请日：2021-05-20
申请人： Siltronic AG
发明人： Peter Wiesner , Wolfgang Gmach , Robert Kreuzeder
IPC分类号： B23D57/00 , B28D5/00 , B23D59/00 , B28D5/04
CPC分类号： B23D57/0023 , B23D57/0061 , B28D5/0076 , B23D59/002 , B28D5/045 , B28D5/0064
摘要： Slices are cut from workpieces using a wire saw having a wire array tensioned in a plane between two wire guide rollers each supported between fixed and floating bearings and comprising a chamber and a shell enclosing a core and having guide grooves for wires. During a cut-off operation, a workpiece is fed through the wire array perpendicular to a workpiece axis and the wire array plane. The workpiece is fed through the wire array while simultaneously: changing shell lengths by adjusting chamber temperatures in dependence on a depth of cut and a first correction profile; and moving the workpiece along the workpiece axis in accordance with a second correction profile. The correction profiles are opposed to a shape deviation.

9. 发明授权

US09662804B2 Method for slicing wafers from a workpiece by means of a wire saw 有权
公开(公告)号：US09662804B2
公开(公告)日：2017-05-30
申请号：US14557479
申请日：2014-12-02
申请人： Siltronic AG
发明人： Peter Wiesner , Robert Kreuzeder
IPC分类号： B28D5/04
CPC分类号： B28D5/045
摘要： A method for sawing a multiplicity of wafers from a workpiece by means of a wire web of a wire saw includes providing a wire web consisting of a plurality of parallel wire sections. The wire web is spanned by at least two wire guide rollers where each wire guide rollers comprises a core having two side surfaces and a lateral surface. The core is composed of a first material. Each core is rotatably mounted along its longitudinal axis and comprises at least two separate cavities. The lateral surface of each core is enclosed by a jacket composed of a second material. Parallel groves are cut into the jacket for guiding the wire sections of the web. The length of the jacket is altered thermally by means of at least one cavity being filled with a temperature regulating medium.

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