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    • 2. 发明申请
    • Multi-dimensional transducer arrays and method of manufacture
    • 多尺寸换能器阵列及其制造方法
    • US20040002656A1
    • 2004-01-01
    • US10184785
    • 2002-06-27
    • Siemens Medical Solutions USA, Inc.
    • Todor SheljaskowGrazyna PalczewskaStephen C. EnglundThomas G. HouckGregg W. FreyRon HoSevig AyterXiaocong Guo
    • A61B008/14
    • G10K11/346A61B8/483B06B1/0622G01S7/003G01S7/5202G01S7/5208G01S15/8925G01S15/8961
    • Transducer arrays and methods of manufacturing the transducer arrays are provided. A multi-dimensional transducer array is provided where the element-to-element spacing or pitch along one dimension is less than the element spacing or pitch along a second dimension. For example, the element pitch along an azimuth dimension is null of the element pitch along an elevation dimension. The multi-dimensional transducer array with the same or different pitch is manufactured from a plurality of modules. Each of the modules are separately diced and then aligned and combined. Separate dicing allows for individual testing of modules prior to assembly as a transducer array. Elements of a transducer array are used for isolating a transmit channel from a receive channel. Rather than a sheet of electrode acting as a ground plane common to a plurality of elements, separate signal lines or traces are provided individually for each element on opposite sides of each element. A transmit channel may connect to one electrode on an element, and the receive channel may connect to an opposite electrode on the element. The separate signal traces on each element allow the element to isolate the transmit and receive paths. A multi-dimensional array is provided for time division multiplex processing. A probe houses the multi-dimensional array and a multiplexer. The multi-dimensional array has a different distribution of elements along different dimensions, such as a 1.5 D array, a split bullet array, a multilayer linear array, or an I beam or nullbeam array formed from two or more linear arrays. The multiplexer enables operation of complex arrays for various ultrasound processes.
    • 提供了传感器阵列和制造换能器阵列的方法。 提供了多维换能器阵列,其中沿着一个维度的元件间元件间距或间距小于沿着第二维度的元件间距或间距。 例如,沿着方位尺寸的元件间距是沿着仰角尺寸的元件间距的1/2。 具有相同或不同间距的多维换能器阵列由多个模块制造。 每个模块分开切割,然后对齐并组合。 单独的切割允许在组装之前对模块进行单独测试作为换能器阵列。 换能器阵列的元件用于隔离发射通道与接收通道。 不是作为多个元件共有的接地平面的电极片而不是单独地为每个元件的相对侧上的每个元件提供单独的信号线或迹线。 传输通道可以连接到元件上的一个电极,并且接收通道可以连接到元件上的相对电极。 每个元件上的单独信号迹线允许元件隔离发送和接收路径。 提供了用于时分复用处理的多维阵列。 探头容纳多维阵列和多路复用器。 多维阵列具有沿着不同维度的元素的不同分布,例如由两个或更多个线性阵列形成的1.5D阵列,分割子弹阵列,多层线性阵列或I波束或+波束阵列。 多路复用器使得能够对各种超声波处理进行复杂阵列的操作