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1. 发明授权

US08390984B2 Capacitor substrate structure 有权
标题翻译：电容器基板结构
公开(公告)号：US08390984B2
公开(公告)日：2013-03-05
申请号：US12545786
申请日：2009-08-21
申请人： Shur-Fen Liu , Meng-Huei Chen , Bih-Yih Chen , Yun-Tien Chen
发明人： Shur-Fen Liu , Meng-Huei Chen , Bih-Yih Chen , Yun-Tien Chen
IPC分类号： H01G4/06 , H01G4/20 , H01G4/22
CPC分类号： H01G4/33 , H01G4/1227 , H01G4/228 , H05K1/162 , H05K2201/0195 , H05K2201/0209 , H05K2201/026 , H05K2201/0323 , H05K2201/0355 , H05K2201/09309
摘要： The disclosed is a capacitor substrate structure to reduce the high leakage current and low insulation resistance issue of organic/inorganic hybrid materials with ultra-high dielectric constant. The insulation layer, disposed between two conductive layers, includes multi-layered dielectric layers. At least one of the dielectric layers has high dielectric constant, including high dielectric constant ceramic powder and conductive powder evenly dispersed in organic resin. The other dielectric layers can be organic resin, or further include high dielectric constant ceramic powder dispersed in the organic resin. The substrate has an insulation resistance of about 50KΩ and leakage current of below 100 μAmp under operational voltage.
摘要翻译：公开了一种电容器基板结构，以降低具有超高介电常数的有机/无机混合材料的高漏电流和低绝缘电阻问题。设置在两个导电层之间的绝缘层包括多层电介质层。电介质层中的至少一层具有高介电常数，包括均匀分散在有机树脂中的高介电常数陶瓷粉末和导电粉末。其他电介质层可以是有机树脂，或者还包括分散在有机树脂中的高介电常数陶瓷粉末。基板的绝缘电阻约为50KΩ，漏电流在工作电压以下低于100μAmp。

2. 发明申请

US20100309607A1 CAPACITOR SUBSTRATE STRUCTURE 有权
标题翻译：电容器基板结构
公开(公告)号：US20100309607A1
公开(公告)日：2010-12-09
申请号：US12545786
申请日：2009-08-21
申请人： Shur-Fen Liu , Meng-Huei Chen , Bih-Yih Chen , Yun-Tien Chen
发明人： Shur-Fen Liu , Meng-Huei Chen , Bih-Yih Chen , Yun-Tien Chen
IPC分类号： H01G4/20 , H01G4/06
CPC分类号： H01G4/33 , H01G4/1227 , H01G4/228 , H05K1/162 , H05K2201/0195 , H05K2201/0209 , H05K2201/026 , H05K2201/0323 , H05K2201/0355 , H05K2201/09309
摘要： The disclosed is a capacitor substrate structure to reduce the high leakage current and low insulation resistance issue of organic/inorganic hybrid materials with ultra-high dielectric constant. The insulation layer, disposed between two conductive layers, includes multi-layered dielectric layers. At least one of the dielectric layers has high dielectric constant, including high dielectric constant ceramic powder and conductive powder evenly dispersed in organic resin. The other dielectric layers can be organic resin, or further include high dielectric constant ceramic powder dispersed in the organic resin. The substrate has an insulation resistance of about 50 KΩ and leakage current of below 100 μAmp under operational voltage.
摘要翻译：公开了一种电容器基板结构，以降低具有超高介电常数的有机/无机混合材料的高漏电流和低绝缘电阻问题。设置在两个导电层之间的绝缘层包括多层电介质层。电介质层中的至少一层具有高介电常数，包括均匀分散在有机树脂中的高介电常数陶瓷粉末和导电粉末。其他电介质层可以是有机树脂，或者还包括分散在有机树脂中的高介电常数陶瓷粉末。基板的绝缘电阻约为50KΩ; 漏电流在工作电压以下低于100μAmp。

3. 发明申请

US20090227719A1 Curable High Dielectric Constant Ink Composition and High Dielectric Film 审中-公开
标题翻译：可固化的高介电常数油墨组合物和高介电膜
公开(公告)号：US20090227719A1
公开(公告)日：2009-09-10
申请号：US12044928
申请日：2008-03-07
申请人： Chin-Hsien Hung , Shur-Fen Liu , Meng-Huei Chen , Bih-Yih Chen , Ming-Tsung Hung , Man-Chun Yu
发明人： Chin-Hsien Hung , Shur-Fen Liu , Meng-Huei Chen , Bih-Yih Chen , Ming-Tsung Hung , Man-Chun Yu
IPC分类号： C08K3/10 , C08L61/00
CPC分类号： C08L63/00 , C08K3/22 , C08K5/01 , C08K5/10 , C08L79/08 , C09D11/36 , C09D11/38 , C09D11/52
摘要： The invention discloses a curable ink composition which comprises about 1-10 parts by weight of a curable epoxy resin system, about 1-30 parts by weight of ferroelectric ceramic powders, about 0.1-10 parts by weight of a polymeric dispersant, and about 50-96 parts by weight of a solvent. The ink composition is suitable for forming a high dielectric film by inkjet printing for built-in capacitors.
摘要翻译：本发明公开了一种可固化油墨组合物，其包含约1-10重量份的可固化环氧树脂体系，约1-30重量份的铁电陶瓷粉末，约0.1-10重量份的聚合物分散剂和约50重量％ -96重量份溶剂。油墨组合物适用于通过内置电容器的喷墨印刷形成高介电膜。

4. 发明申请

US20050137293A1 Organic-inorganic hybrid compositions with high dielectric constant and high thermal stability, and cured compositions thereof 有权
标题翻译：具有高介电常数和高热稳定性的有机 - 无机杂化组合物及其固化组合物
公开(公告)号：US20050137293A1
公开(公告)日：2005-06-23
申请号：US10742815
申请日：2003-12-23
申请人： Shur-Fen Liu , Meng-Huei Chen , Bih-Yih Chen , Yi-Kai Chang , Jinn-Shing King
发明人： Shur-Fen Liu , Meng-Huei Chen , Bih-Yih Chen , Yi-Kai Chang , Jinn-Shing King
IPC分类号： C08G59/32 , C08L63/00 , H01G4/20 , H05K1/16
CPC分类号： C08G59/3218 , H01G4/206 , H05K1/162 , H05K2201/0209
摘要： The present invention discloses an organic-inorganic hybrid composition with a high dielectric constant, which can be used as a bonding layer having a high thermal stability and a high dielectric constant. The composition includes a) a high Tg epoxy resin system; b) ferroelectric ceramic particles having two particle size distributions, with one of them pertaining to a nano level; c) at least one macromolecular flexibilizer; d) a macromolecular dispersant; and e) additives such as a diluent, an adhesive promoter, a catalyst, and an organic solvent.
摘要翻译：本发明公开了具有高介电常数的有机 - 无机杂化组合物，其可以用作具有高热稳定性和高介电常数的粘合层。组合物包括a）高Tg环氧树脂体系; b）具有两个粒度分布的铁电陶瓷颗粒，其中一个属于纳米级; c）至少一种大分子增韧剂; d）大分子分散剂; 和e）添加剂如稀释剂，粘合促进剂，催化剂和有机溶剂。

5. 发明授权

US07008981B2 Organic-inorganic hybrid compositions with high dielectric constant and high thermal stability, and cured compositions thereof 有权
标题翻译：具有高介电常数和高热稳定性的有机 - 无机杂化组合物及其固化组合物
公开(公告)号：US07008981B2
公开(公告)日：2006-03-07
申请号：US10742815
申请日：2003-12-23
申请人： Shur-Fen Liu , Meng-Huei Chen , Bih-Yih Chen , Yi-Kai Chang , Jinn-Shing King
发明人： Shur-Fen Liu , Meng-Huei Chen , Bih-Yih Chen , Yi-Kai Chang , Jinn-Shing King
IPC分类号： C08L63/00
CPC分类号： C08G59/3218 , H01G4/206 , H05K1/162 , H05K2201/0209
摘要： The present invention discloses an organic-inorganic hybrid composition with a high dielectric constant, which can be used as a bonding layer having a high thermal stability and a high dielectric constant. The composition includes a) a high Tg epoxy resin system; b) ferroelectric ceramic particles having two particle size distributions, with one of them pertaining to a nano level; c) at least one macromolecular flexibilizer; d) a macromolecular dispersant; and e) additives such as a diluent, an adhesive promoter, a catalyst, and an organic solvent.
摘要翻译：本发明公开了具有高介电常数的有机 - 无机杂化组合物，其可以用作具有高热稳定性和高介电常数的粘合层。组合物包括a）高Tg环氧树脂体系; b）具有两个粒度分布的铁电陶瓷颗粒，其中一个属于纳米级; c）至少一种大分子增韧剂; d）大分子分散剂; 和e）添加剂如稀释剂，粘合促进剂，催化剂和有机溶剂。

6. 发明申请

US20050154092A1 Organic-inorganic hybrid compositions with sufficient flexibility, high dielectric constant and high thermal stability, and cured compositions thereof 有权
标题翻译：具有足够柔韧性，高介电常数和高热稳定性的有机 - 无机杂化组合物及其固化组合物
公开(公告)号：US20050154092A1
公开(公告)日：2005-07-14
申请号：US11003411
申请日：2004-12-06
申请人： Shur-Fen Liu , Meng-Huei Chen , Jinn-Shing King
发明人： Shur-Fen Liu , Meng-Huei Chen , Jinn-Shing King
IPC分类号： C08K3/04 , C08K3/08 , C08K3/34 , C08K5/00 , H01G4/20 , H05K1/16
CPC分类号： C08K3/08 , C08K3/34 , H01G4/206 , H05K1/162 , H05K2201/0209 , H05K2201/0323 , H05K2201/09309 , C08L63/00
摘要： The present invention discloses an organic-inorganic hybrid composition with sufficient flexibility, a high dielectric constant, which can be used as a bonding layer having a high thermal stability and high dielectric constant. The composition includes a) a high Tg epoxy resin system; b) ferroelectric ceramic particles having two particle size distributions, with one of them pertaining to a nano level; c) an electrically conductive powder, such as an electrically conductive carbon black; d) at least one macromolecular flexibilizer; e) a macromolecular dispersant; and f) additives such as a diluent, an adhesive promoter, a hardener, a hardener promoter, and an organic solvent.
摘要翻译：本发明公开了具有足够的柔软性，高介电常数的有机 - 无机杂化组合物，其可以用作具有高热稳定性和高介电常数的结合层。组合物包括a）高Tg环氧树脂体系; b）具有两个粒度分布的铁电陶瓷颗粒，其中一个属于纳米级; c）导电粉末，例如导电炭黑; d）至少一种大分子增韧剂; e）大分子分散剂; 和f）添加剂如稀释剂，粘合促进剂，硬化剂，硬化剂促进剂和有机溶剂。

7. 发明申请

US20090170993A1 FLEXIBLE, LOW DIELECTRIC LOSS COMPOSITION AND METHOD FOR PREPARING THE SAME 有权
标题翻译：柔性，低介电损失组合物及其制备方法
公开(公告)号：US20090170993A1
公开(公告)日：2009-07-02
申请号：US12344484
申请日：2008-12-27
申请人： Shur-Fen Liu , Meng-Huei Chen , Man-Chun Yu
发明人： Shur-Fen Liu , Meng-Huei Chen , Man-Chun Yu
IPC分类号： C08K3/22
CPC分类号： C08K3/22 , H05K1/0373 , H05K1/0393 , H05K2201/0145 , H05K2201/0158 , H05K2201/0209 , C08L21/00
摘要： A flexible, low dielectric loss composition, used to fabricate a flexible substrate, is provided. The composition includes: SrTiO3 and/or Ba(Sr)TiO3 ceramic particle, with a particular size between 30 nm and 2 μm, in an amount of 20-80% by weight of the composition; at least one flexile macromolecule in an amount of 1.0-50% by weight of the composition, wherein the macromolecules have functional groups of hydroxyl group, carboxyl group, allyl group, amino group, or chain aliphatic epoxy group; and a thermosetting organic resin.
摘要翻译：提供了用于制造柔性基底的柔性低介电损耗组合物。该组合物包括：具有30nm至2μm特定尺寸的SrTiO 3和/或Ba（Sr）TiO 3陶瓷颗粒，其量为组合物重量的20-80％; 至少一种柔性大分子的量为组合物重量的1.0-50％，其中大分子具有羟基，羧基，烯丙基，氨基或链脂族环氧基的官能团; 和热固性有机树脂。

8. 发明授权

US07271206B2 Organic-inorganic hybrid compositions with sufficient flexibility, high dielectric constant and high thermal stability, and cured compositions thereof 有权
标题翻译：具有足够柔韧性，高介电常数和高热稳定性的有机 - 无机杂化组合物及其固化组合物
公开(公告)号：US07271206B2
公开(公告)日：2007-09-18
申请号：US11003411
申请日：2004-12-06
申请人： Shur-Fen Liu , Meng-Huei Chen , Jinn-Shing King
发明人： Shur-Fen Liu , Meng-Huei Chen , Jinn-Shing King
IPC分类号： C08L63/00
CPC分类号： C08K3/08 , C08K3/34 , H01G4/206 , H05K1/162 , H05K2201/0209 , H05K2201/0323 , H05K2201/09309 , C08L63/00
摘要： The present invention discloses an organic-inorganic hybrid composition with sufficient flexibility, a high dielectric constant, which can be used as a bonding layer having a high thermal stability and high dielectric constant. The composition includes a) a high Tg epoxy resin system; b) ferroelectric ceramic particles having two particle size distributions, with one of them pertaining to a nano level; c) an electrically conductive powder, such as an electrically conductive carbon black; d) at least one macromolecular flexibilizer; e) a macromolecular dispersant; and f) additives such as a diluent, an adhesive promoter, a hardener, a hardener promoter, and an organic solvent.
摘要翻译：本发明公开了具有足够的柔软性，高介电常数的有机 - 无机杂化组合物，其可以用作具有高热稳定性和高介电常数的结合层。组合物包括a）高Tg环氧树脂体系; b）具有两个粒度分布的铁电陶瓷颗粒，其中一个属于纳米级; c）导电粉末，例如导电炭黑; d）至少一种大分子增韧剂; e）大分子分散剂; 和f）添加剂如稀释剂，粘合促进剂，硬化剂，硬化剂促进剂和有机溶剂。

9. 发明申请

US20140255711A1 RESIN COMPOSITION AND USES OF THE SAME 审中-公开
标题翻译：树脂组合物及其用途
公开(公告)号：US20140255711A1
公开(公告)日：2014-09-11
申请号：US13834341
申请日：2013-03-15
申请人： Meng-Huei Chen , Shur-Fen Liu
发明人： Meng-Huei Chen , Shur-Fen Liu
IPC分类号： C08L71/12
摘要： A resin composition is provided. The resin composition comprises: (a) a resin of formula (I): (b) a nonpolar elastomer containing vinyl group, wherein the content of the vinyl group is no more than 60% based on the total weight of the elastomer; and (c) a peroxide as a polymerization initiator, wherein, R1, R2, A1, A2, and n are as defined in the specification; and the content of component (b) is about 2% to about 100% based on the weight of component (a), and the content of component (c) is about 0.01% to about 10% based on the total weight of component (a) and component (b).
摘要翻译：提供树脂组合物。树脂组合物包含：（a）式（I）的树脂：（b）含乙烯基的非极性弹性体，其中乙烯基的含量相对于弹性体的总重量为不大于60％和（c）作为聚合引发剂的过氧化物，其中，R1，R2，A1，A2和n如说明书中所定义; 并且组分（b）的含量基于组分（a）的重量为约2％至约100％，并且组分（c）的含量基于组分的总重量为约0.01％至约10％ a）和组分（b）。

10. 发明授权

US08138263B2 Flexible, low dielectric loss composition and method for preparing the same 有权
标题翻译：柔性，低介电损耗组成及其制备方法
公开(公告)号：US08138263B2
公开(公告)日：2012-03-20
申请号：US12344484
申请日：2008-12-27
申请人： Shur-Fen Liu , Meng-Huei Chen , Man-Chun Yu
发明人： Shur-Fen Liu , Meng-Huei Chen , Man-Chun Yu
IPC分类号： C08K3/22 , C08L101/00 , H01B3/30
CPC分类号： C08K3/22 , H05K1/0373 , H05K1/0393 , H05K2201/0145 , H05K2201/0158 , H05K2201/0209 , C08L21/00
摘要： A flexible, low dielectric loss composition, used to fabricate a flexible substrate, is provided. The composition includes: SrTiO3 and/or Ba(Sr)TiO3 ceramic particle, with a particular size between 30 nm and 2 μm, in an amount of 20-80% by weight of the composition; at least one flexile macromolecule in an amount of 1.0-50% by weight of the composition, wherein the macromolecules have functional groups of hydroxyl group, carboxyl group, allyl group, amino group, or chain aliphatic epoxy group; and a thermosetting organic resin.
摘要翻译：提供了用于制造柔性基底的柔性低介电损耗组合物。该组合物包括：SrTiO 3和/或Ba（Sr）TiO 3陶瓷颗粒，其特征尺寸在30nm和2μm之间，其量为组合物重量的20-80％; 至少一种柔性大分子的量为组合物重量的1.0-50％，其中大分子具有羟基，羧基，烯丙基，氨基或链脂族环氧基的官能团; 和热固性有机树脂。

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