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    • 8. 发明授权
    • Semiconductor device
    • 半导体器件
    • US08373203B2
    • 2013-02-12
    • US12954222
    • 2010-11-24
    • Shunpei YamazakiHiromichi GodoDaisuke Kawae
    • Shunpei YamazakiHiromichi GodoDaisuke Kawae
    • H01L27/148
    • H01L29/78693H01L29/41733H01L29/42384H01L29/4908H01L29/66969H01L29/7869H01L29/78696
    • An intrinsic or substantially intrinsic semiconductor, which has been subjected to a step of dehydration or dehydrogenation and a step of adding oxygen so that the carrier concentration is less than 1×1012/cm3 is used for an oxide semiconductor layer of an insulated gate transistor, in which a channel region is formed. The length of the channel formed in the oxide semiconductor layer is set to 0.2 μm to 3.0 μm an inclusive and the thicknesses of the oxide semiconductor layer and the gate insulating layer are set to 15 nm to 30 nm inclusive and 20 nm to 50 nm inclusive, respectively, or 15 nm to 100 nm inclusive and 10 nm to 20 nm inclusive, respectively. Consequently, a short-channel effect can be suppressed, and the amount of change in threshold voltage can be less than 0.5 V in the range of the above channel lengths.
    • 对于绝缘栅极晶体管的氧化物半导体层,使用已进行脱水或脱氢工序的本征或本质上本征的半导体,以及添加氧以使载流子浓度小于1×10 12 / cm 3的步骤, 其中形成沟道区。 将形成在氧化物半导体层中的沟道的长度设定为0.2μm〜3.0μm,氧化物半导体层和栅极绝缘层的厚度为15nm〜30nm,包括20nm〜50nm ,或分别为15nm〜100nm,10nm〜20nm。 因此,可以抑制短沟道效应,并且在上述通道长度的范围内阈值电压的变化量可以小于0.5V。